MX2021007714A - Unidad de enfriamiento, metodo para fabricar la unidad de enfriamiento y estructura. - Google Patents
Unidad de enfriamiento, metodo para fabricar la unidad de enfriamiento y estructura.Info
- Publication number
- MX2021007714A MX2021007714A MX2021007714A MX2021007714A MX2021007714A MX 2021007714 A MX2021007714 A MX 2021007714A MX 2021007714 A MX2021007714 A MX 2021007714A MX 2021007714 A MX2021007714 A MX 2021007714A MX 2021007714 A MX2021007714 A MX 2021007714A
- Authority
- MX
- Mexico
- Prior art keywords
- cooling unit
- metal plate
- resin tray
- manufacturing
- packing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6556—Solid parts with flow channel passages or pipes for heat exchange
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Una unidad de enfriamiento (1) incluye una bandeja de resina (3), una placa de metal (2) proporcionada sobre una superficie de la bandeja de resina (3), y una nervadura formadora de trayectoria de flujo (5) proporcionada en un espacio entre la bandeja de resina (3) y la placa de metal (2), en la cual una porción de superficie superior (3b) de una porción de pared lateral (3a) de la bandeja de resina (3) y la placa de metal (2) se sujetan mecánicamente a través de un empaque elástico (4), el empaque elástico (4) incluye un empaque de unión que se une a la superficie de la placa de metal (2), y una estructura no uniforme fina se forma en la superficie de la placa de metal (2) al menos en una porción de unión con el empaque de unión.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018241444 | 2018-12-25 | ||
PCT/JP2019/050931 WO2020138211A1 (ja) | 2018-12-25 | 2019-12-25 | 冷却ユニット、冷却ユニットの製造方法および構造体 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021007714A true MX2021007714A (es) | 2021-09-30 |
Family
ID=71129572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021007714A MX2021007714A (es) | 2018-12-25 | 2019-12-25 | Unidad de enfriamiento, metodo para fabricar la unidad de enfriamiento y estructura. |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220087062A1 (es) |
EP (1) | EP3905322A4 (es) |
JP (1) | JP7047137B2 (es) |
KR (1) | KR20210093324A (es) |
CN (1) | CN113196472A (es) |
MX (1) | MX2021007714A (es) |
WO (1) | WO2020138211A1 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11812582B2 (en) * | 2020-11-09 | 2023-11-07 | Baidu Usa Llc | Symmetrical cold plate design |
CN114464912A (zh) * | 2020-11-10 | 2022-05-10 | 英威达纺织(英国)有限公司 | 电池冷却组件及其制作方法 |
US20230417493A1 (en) * | 2020-12-02 | 2023-12-28 | Mitsui Chemicals, Inc. | Temperature control unit and method for manufacturing temperature control unit |
WO2022265018A1 (ja) * | 2021-06-18 | 2022-12-22 | 三井化学株式会社 | ケース、及びパック |
DE102022206659A1 (de) | 2022-06-30 | 2024-01-04 | Mahle International Gmbh | Wärmeübertragerplatte |
CN115243512A (zh) * | 2022-07-12 | 2022-10-25 | 杭州逗酷软件科技有限公司 | 一种散热器及无线网络设备 |
JP2024080260A (ja) * | 2022-12-02 | 2024-06-13 | 三桜工業株式会社 | 冷却器及び冷却器の製造方法 |
DE102022213549A1 (de) * | 2022-12-13 | 2024-06-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Kühlvorrichtung, Kühlvorrichtung und Baugruppe |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51126871A (en) | 1975-04-26 | 1976-11-05 | Citizen Watch Co Ltd | The structure of movement fixation for a clock |
US5912433A (en) * | 1997-01-17 | 1999-06-15 | Minnesota Mining And Manufacturing Company | Cable closure injection sealed with low surface energy adhesive |
US6414867B2 (en) * | 2000-02-16 | 2002-07-02 | Hitachi, Ltd. | Power inverter |
JP3982180B2 (ja) | 2000-02-16 | 2007-09-26 | 株式会社日立製作所 | 電力変換装置 |
CN1501961A (zh) * | 2001-04-05 | 2004-06-02 | 住友化学工业株式会社 | 热塑性弹性体组合物和包含该组合物的模塑制品 |
AU2003257595A1 (en) * | 2002-09-12 | 2004-04-30 | Nok Corporation | Gasket |
JP4193587B2 (ja) | 2003-05-26 | 2008-12-10 | 宇部興産株式会社 | ポリアミド系エラストマー及びその製造方法 |
WO2005010240A2 (en) * | 2003-07-17 | 2005-02-03 | Microchips, Inc. | Low temperature methods for hermetically sealing reservoir devices |
US20050128705A1 (en) * | 2003-12-16 | 2005-06-16 | International Business Machines Corporation | Composite cold plate assembly |
JP2008282969A (ja) * | 2007-05-10 | 2008-11-20 | Toyota Industries Corp | 冷却器及び電子機器 |
WO2009031632A1 (ja) | 2007-09-05 | 2009-03-12 | Taisei Plas Co., Ltd. | 金属樹脂複合体の製造方法 |
JP5531573B2 (ja) * | 2008-12-09 | 2014-06-25 | 日本軽金属株式会社 | 樹脂部材と金属部材の接合方法、液冷ジャケットの製造方法及び液冷ジャケット |
JP5949742B2 (ja) * | 2008-12-09 | 2016-07-13 | 日本軽金属株式会社 | 液冷ジャケット |
US20100296249A1 (en) * | 2009-05-19 | 2010-11-25 | Beijing AVC Technology Research Center Co., Ltd. | Micro passage cold plate device for a liquid cooling radiator |
JP2013222870A (ja) | 2012-04-18 | 2013-10-28 | Ngk Spark Plug Co Ltd | 半導体装置 |
JP2014067918A (ja) * | 2012-09-26 | 2014-04-17 | Asahi Kasei Corp | 太陽電池モジュール |
JP5836298B2 (ja) | 2013-03-13 | 2015-12-24 | 三菱電機株式会社 | 半導体装置 |
JP6255317B2 (ja) | 2014-07-25 | 2017-12-27 | 日立オートモティブシステムズ株式会社 | 電池ブロックおよび電池モジュール |
WO2016076264A1 (ja) * | 2014-11-14 | 2016-05-19 | 富士通株式会社 | 接合体及びその製造方法、並びに冷却装置及び冷却装置を用いた電子装置 |
JP2016146451A (ja) * | 2015-02-09 | 2016-08-12 | 株式会社日本自動車部品総合研究所 | 冷却器付き半導体装置 |
JP6460921B2 (ja) * | 2015-06-15 | 2019-01-30 | 三菱電機株式会社 | 電力半導体装置用冷却装置及びその製造方法 |
JP5935933B2 (ja) * | 2015-07-16 | 2016-06-15 | 日本軽金属株式会社 | 複合型中空容器の製造方法 |
US10561040B1 (en) * | 2018-10-08 | 2020-02-11 | Hewlett Packard Enterprise Development Lp | Flexible gasket seal for direct liquid cooling of electronic devices |
-
2019
- 2019-12-25 WO PCT/JP2019/050931 patent/WO2020138211A1/ja unknown
- 2019-12-25 EP EP19902642.8A patent/EP3905322A4/en not_active Withdrawn
- 2019-12-25 KR KR1020217019063A patent/KR20210093324A/ko not_active Application Discontinuation
- 2019-12-25 MX MX2021007714A patent/MX2021007714A/es unknown
- 2019-12-25 JP JP2020563368A patent/JP7047137B2/ja active Active
- 2019-12-25 CN CN201980083220.6A patent/CN113196472A/zh not_active Withdrawn
- 2019-12-25 US US17/418,216 patent/US20220087062A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20210093324A (ko) | 2021-07-27 |
EP3905322A4 (en) | 2022-09-21 |
EP3905322A1 (en) | 2021-11-03 |
WO2020138211A1 (ja) | 2020-07-02 |
CN113196472A (zh) | 2021-07-30 |
JPWO2020138211A1 (ja) | 2021-10-21 |
JP7047137B2 (ja) | 2022-04-04 |
US20220087062A1 (en) | 2022-03-17 |
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