MX2020013349A - Abrasion con una placa de abrasion. - Google Patents

Abrasion con una placa de abrasion.

Info

Publication number
MX2020013349A
MX2020013349A MX2020013349A MX2020013349A MX2020013349A MX 2020013349 A MX2020013349 A MX 2020013349A MX 2020013349 A MX2020013349 A MX 2020013349A MX 2020013349 A MX2020013349 A MX 2020013349A MX 2020013349 A MX2020013349 A MX 2020013349A
Authority
MX
Mexico
Prior art keywords
abrading
workpiece
plate
abrasive grains
backing pad
Prior art date
Application number
MX2020013349A
Other languages
English (en)
Inventor
Hans Hede
Mats Sundell
Tomas Sjöberg
Maria Sundqvist
Original Assignee
Mirka Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mirka Ltd filed Critical Mirka Ltd
Publication of MX2020013349A publication Critical patent/MX2020013349A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
    • B24B23/02—Portable grinding machines, e.g. hand-guided; Accessories therefor with rotating grinding tools; Accessories therefor
    • B24B23/028—Angle tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
    • B24B23/02—Portable grinding machines, e.g. hand-guided; Accessories therefor with rotating grinding tools; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

La solución divulgada comprende un método de abrasión de la superficie de una pieza que se va a trabajar; el método comprende proporcionar una pieza que se va a trabajar, un aparato de abrasión con una almohadilla de respaldo configurada para recibir una placa de abrasión, una placa de abrasión que se puede fijar a la almohadilla de respaldo y una pasta líquida que comprende granos abrasivos; fijar la placa de abrasión a la almohadilla de respaldo; proporcionar la pasta líquida que comprende granos abrasivos entre la placa de abrasión y la superficie de la pieza que se va a trabajar; y hacer funcionar el aparato de abrasión para desgastar por fricción la superficie de la pieza que se va a trabajar; en la presente, la placa de abrasión comprende una capa de cara a la pieza que se va a trabajar, dicha capa de cara a la pieza que se va a trabajar está de frente a la superficie de la pieza que se va a trabajar y comprende metal o polímero, y los granos abrasivos tienen una dureza en la escala de Mohs de más de 5.
MX2020013349A 2018-06-15 2019-06-13 Abrasion con una placa de abrasion. MX2020013349A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20185541 2018-06-15
PCT/FI2019/050456 WO2019239013A1 (en) 2018-06-15 2019-06-13 Abrading with an abrading plate

Publications (1)

Publication Number Publication Date
MX2020013349A true MX2020013349A (es) 2021-03-09

Family

ID=68842610

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020013349A MX2020013349A (es) 2018-06-15 2019-06-13 Abrasion con una placa de abrasion.

Country Status (8)

Country Link
US (1) US20210205958A1 (es)
EP (1) EP3807049A4 (es)
BR (1) BR112020022826A2 (es)
CA (1) CA3101919A1 (es)
DO (1) DOP2020000235A (es)
MX (1) MX2020013349A (es)
WO (1) WO2019239013A1 (es)
ZA (1) ZA202006691B (es)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5888119A (en) * 1997-03-07 1999-03-30 Minnesota Mining And Manufacturing Company Method for providing a clear surface finish on glass
JP4102490B2 (ja) 1998-09-09 2008-06-18 株式会社トッパンＴｄｋレーベル 遊離砥粒研磨スラリー組成物
EP1129821B1 (en) * 1999-08-31 2008-05-21 Shin-Etsu Handotai Co., Ltd Method and device for polishing semiconductor wafer
JP3494641B1 (ja) * 2001-12-12 2004-02-09 東洋紡績株式会社 半導体ウエハ研磨用研磨パッド
KR100564580B1 (ko) * 2003-10-06 2006-03-29 삼성전자주식회사 산화막 평탄화 방법 및 이를 이용한 반도체 소자의 제조방법
US20100203809A1 (en) * 2003-10-28 2010-08-12 Nihon Micro Coating Co., Ltd. Method of polishing a magnetic hard disc substrate
JP4792802B2 (ja) * 2005-04-26 2011-10-12 住友電気工業株式会社 Ｉｉｉ族窒化物結晶の表面処理方法
KR100926025B1 (ko) * 2005-09-14 2009-11-11 가부시키가이샤 오카모도 코사쿠 기카이 세이사쿠쇼 직사각형 기판의 양면 연마 장치 및 양면 연마 방법
KR20090010774A (ko) * 2007-07-24 2009-01-30 에이티티(주) 압입법을 이용한 다이아몬드 연마구의 제조방법 및 이에의해 제조된 다이아몬드 연마구
JP2010064196A (ja) * 2008-09-11 2010-03-25 Ebara Corp 基板研磨装置および基板研磨方法
WO2012005142A1 (ja) * 2010-07-09 2012-01-12 旭硝子株式会社 研磨剤および研磨方法
KR20130140057A (ko) 2010-12-07 2013-12-23 아사히 가라스 가부시키가이샤 연마구
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘
US9308616B2 (en) * 2013-01-21 2016-04-12 Innovative Finishes LLC Refurbished component, electronic device including the same, and method of refurbishing a component of an electronic device
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
CN105556642B (zh) * 2013-07-19 2017-10-31 国立大学法人名古屋工业大学 金属制研磨衬垫及其制造方法
CN104924195A (zh) * 2015-06-12 2015-09-23 浙江工业大学 一种蓝宝石晶片高效超精密加工方法
US11465255B2 (en) * 2015-10-27 2022-10-11 Fujibo Holdings, Inc. Lapping material and method for producing the same, and method for producing polished product
JP6888476B2 (ja) * 2016-08-23 2021-06-16 信越化学工業株式会社 基板の製造方法

Also Published As

Publication number Publication date
EP3807049A4 (en) 2022-03-23
US20210205958A1 (en) 2021-07-08
CA3101919A1 (en) 2019-12-19
BR112020022826A2 (pt) 2021-02-02
DOP2020000235A (es) 2021-03-31
WO2019239013A1 (en) 2019-12-19
EP3807049A1 (en) 2021-04-21
ZA202006691B (en) 2021-08-25

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