MX2019011435A - Composicion adhesiva curable por calor a baja temperatura para estructura. - Google Patents

Composicion adhesiva curable por calor a baja temperatura para estructura.

Info

Publication number
MX2019011435A
MX2019011435A MX2019011435A MX2019011435A MX2019011435A MX 2019011435 A MX2019011435 A MX 2019011435A MX 2019011435 A MX2019011435 A MX 2019011435A MX 2019011435 A MX2019011435 A MX 2019011435A MX 2019011435 A MX2019011435 A MX 2019011435A
Authority
MX
Mexico
Prior art keywords
adhesive composition
low
temperature heat
curable adhesive
moisture absorbent
Prior art date
Application number
MX2019011435A
Other languages
English (en)
Inventor
Makino Daisuke
Suzuki Atsuhiko
Murachi Yusuke
Asakawa Motoyasu
Himuro Katsuya
Yamamoto Kenichi
Original Assignee
Cemedine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cemedine Co Ltd filed Critical Cemedine Co Ltd
Publication of MX2019011435A publication Critical patent/MX2019011435A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D65/00—Designing, manufacturing, e.g. assembling, facilitating disassembly, or structurally modifying motor vehicles or trailers, not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D65/00—Designing, manufacturing, e.g. assembling, facilitating disassembly, or structurally modifying motor vehicles or trailers, not otherwise provided for
    • B62D65/02—Joining sub-units or components to, or positioning sub-units or components with respect to, body shell or other sub-units or components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Manufacturing & Machinery (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)

Abstract

Se proporciona una composición adhesiva curable por calor a baja temperatura para estructuras que es capaz de curarse a una temperatura baja en un tiempo corto, tiene defectos de surco reducidos después de la posición de estado abierto, y es excelente en la propiedad de prevención de oxidación, resistencia a la corrosión, resistencia a la ducha, y maniobrabilidad, y un método para producir una estructura automotriz mediante el uso de la composición adhesiva. La composición adhesiva curable por calor a baja temperatura para estructuras incluye (A) una resina epoxi, (B) un agente de curado microencapsulado, (C) un agente higroscópico, (D) un modificador de viscosidad, y (E) un estabilizante. El agente higroscópico (C) es óxido de calcio, que adecuadamente incluye tanto un grado tratado superficialmente como un grado no tratado superficialmente.
MX2019011435A 2017-03-27 2018-03-23 Composicion adhesiva curable por calor a baja temperatura para estructura. MX2019011435A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017060693A JP6872944B2 (ja) 2017-03-27 2017-03-27 低温加熱硬化型構造用接着剤組成物
PCT/JP2018/011607 WO2018180955A1 (ja) 2017-03-27 2018-03-23 低温加熱硬化型構造用接着剤組成物

Publications (1)

Publication Number Publication Date
MX2019011435A true MX2019011435A (es) 2019-12-19

Family

ID=63675799

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019011435A MX2019011435A (es) 2017-03-27 2018-03-23 Composicion adhesiva curable por calor a baja temperatura para estructura.

Country Status (7)

Country Link
US (1) US11680193B2 (es)
JP (1) JP6872944B2 (es)
CN (1) CN110461981B (es)
DE (1) DE112018001618T5 (es)
MX (1) MX2019011435A (es)
RU (1) RU2727518C1 (es)
WO (1) WO2018180955A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189150A1 (ja) * 2022-03-28 2023-10-05 セメダイン株式会社 自動車構造体の製造方法及び硬化性組成物

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855970A (ja) 1981-09-29 1983-04-02 東芝ライテック株式会社 表示装置
JPS5883023A (ja) 1981-11-11 1983-05-18 Taoka Chem Co Ltd 硬化性組成物
US4833226A (en) 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JPH0488077A (ja) * 1990-07-31 1992-03-19 Aisin Chem Co Ltd スポット溶接可能な接着剤組成物
JP3199818B2 (ja) 1992-03-06 2001-08-20 松本油脂製薬株式会社 エポキシ樹脂硬化剤用マイクロカプセル
JP3308347B2 (ja) 1992-06-26 2002-07-29 日本化薬株式会社 マイクロカプセル型硬化促進剤、これを含むエポキシ樹脂組成物及びその硬化物
JP2000281759A (ja) 1999-04-01 2000-10-10 Mitsui Chemicals Inc 潜在性エポキシ硬化剤とそれを配合してなる１液型エポキシ樹脂組成物
EP1252217B1 (en) 1999-12-20 2004-08-18 3M Innovative Properties Company Ambient-temperature-stable, one-part curable epoxy adhesive
JP2001281759A (ja) 2000-03-29 2001-10-10 Seiko Epson Corp 投影システム、投影装置および投影プログラムを記憶した記憶媒体
WO2008127923A2 (en) * 2007-04-11 2008-10-23 Dow Global Technologies, Inc. Heat-resistant structural epoxy resins
JP2010189542A (ja) * 2009-02-18 2010-09-02 Cemedine Henkel Co Ltd Ｃｋｄ輸送対応ヘミング接着剤
JP5606079B2 (ja) * 2010-01-19 2014-10-15 ソマール株式会社 エポキシ樹脂組成物及びこれを用いたディスペンサー塗布用接着剤
JP2011168672A (ja) * 2010-02-17 2011-09-01 Sekisui Chem Co Ltd 絶縁シート
US9000120B2 (en) 2010-06-29 2015-04-07 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
WO2012000171A1 (en) * 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
DE102011007897A1 (de) 2011-04-12 2012-10-18 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Klebstoffe
EP2828321B1 (en) * 2012-03-23 2016-04-27 Dow Global Technologies LLC Flame retardant structural epoxy resin adhesives and process for bonding metal members
JP6013906B2 (ja) * 2012-12-27 2016-10-25 ナミックス株式会社 液状エポキシ樹脂組成物
EP3428214B1 (en) 2013-10-29 2019-09-04 Kaneka Corporation Polymer fine particle-containing curable resin composition having improved storage stability
JP6191639B2 (ja) 2015-03-18 2017-09-06 マツダ株式会社 車体部材の接合構造及びその接合方法

Also Published As

Publication number Publication date
JP6872944B2 (ja) 2021-05-19
US20210102101A1 (en) 2021-04-08
DE112018001618T5 (de) 2020-01-16
WO2018180955A1 (ja) 2018-10-04
CN110461981A (zh) 2019-11-15
RU2727518C1 (ru) 2020-07-22
CN110461981B (zh) 2022-06-03
JP2018162392A (ja) 2018-10-18
US11680193B2 (en) 2023-06-20

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