MX2018005155A - Metodo para incorporar un chip invertido de circuito integrado. - Google Patents
Metodo para incorporar un chip invertido de circuito integrado.Info
- Publication number
- MX2018005155A MX2018005155A MX2018005155A MX2018005155A MX2018005155A MX 2018005155 A MX2018005155 A MX 2018005155A MX 2018005155 A MX2018005155 A MX 2018005155A MX 2018005155 A MX2018005155 A MX 2018005155A MX 2018005155 A MX2018005155 A MX 2018005155A
- Authority
- MX
- Mexico
- Prior art keywords
- smart card
- flip chip
- vertical plane
- contact pad
- substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Las modalidades de la invención se refieren a procesos para fabricar un dispositivo inteligente, por ejemplo una tarjeta inteligente, y configuraciones para los dispositivos de tarjetas inteligentes con mayor fiabilidad y vida útil, y un acabado mejorado. En el dispositivo de tarjeta inteligente que comprende capas de sustrato laminadas que interponen una película flexible que tiene patrón conductor en la misma, al menos un chip invertido para operar el dispositivo de tarjeta inteligente se incorpora en un primer sustrato de manera que el primer sustrato proporciona una encapsulación a al menos el chip invertido, en donde el al menos un chip invertido se dispone en una posición en un primer plano vertical; y una almohadilla de contacto, para proporcionar conexión eléctrica cuando el dispositivo de tarjeta inteligente se inserta en un lector de tarjetas inteligentes, se dispone en una posición en un segundo plano vertical, en donde el primer plano vertical no se superpone con el segundo plano vertical. La almohadilla de contacto se proyecta a través de una cavidad en un segundo sustrato para formar un plano uniforme continuo desde una superficie exterior de las capas de sustrato laminadas hasta la almohadilla de contacto.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562263105P | 2015-12-04 | 2015-12-04 | |
| PCT/SG2016/050574 WO2017095329A1 (en) | 2015-12-04 | 2016-11-22 | Method for embedding integrated circuit flip chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2018005155A true MX2018005155A (es) | 2018-08-15 |
Family
ID=57530791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2018005155A MX2018005155A (es) | 2015-12-04 | 2016-11-22 | Metodo para incorporar un chip invertido de circuito integrado. |
Country Status (19)
| Country | Link |
|---|---|
| US (2) | US10558906B2 (es) |
| EP (1) | EP3384434B1 (es) |
| JP (1) | JP6544759B2 (es) |
| KR (1) | KR101897944B1 (es) |
| CN (1) | CN108292373B (es) |
| AU (1) | AU2016361882B2 (es) |
| BR (2) | BR112018011000B1 (es) |
| CA (1) | CA3002778C (es) |
| ES (1) | ES2747913T3 (es) |
| HU (1) | HUE045755T2 (es) |
| MA (1) | MA43370B1 (es) |
| MX (1) | MX2018005155A (es) |
| PH (1) | PH12018500683A1 (es) |
| PL (1) | PL3384434T3 (es) |
| PT (1) | PT3384434T (es) |
| RU (1) | RU2667741C1 (es) |
| UA (1) | UA118640C2 (es) |
| WO (1) | WO2017095329A1 (es) |
| ZA (1) | ZA201802189B (es) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
| KR102107795B1 (ko) * | 2018-11-22 | 2020-05-28 | 주식회사 엔에이블 | 플렉시블 기판을 이용한 스마트 카드 제조방법 |
| DE102019202715A1 (de) | 2019-02-28 | 2020-09-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Folienbasiertes package mit distanzausgleich |
| DE102019202716B4 (de) * | 2019-02-28 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flex-folien-package mit coplanarer topologie für hochfrequenzsignale und verfahren zum herstellen eines derartigen flex-folien-packages |
| DE102019202721B4 (de) | 2019-02-28 | 2021-03-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 3d-flexfolien-package |
| DE102019202718B4 (de) | 2019-02-28 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Dünnes Dual-Folienpackage und Verfahren zum Herstellen desselben |
| ES2949221T3 (es) * | 2020-08-05 | 2023-09-26 | Smartflex Tech Pte Ltd | Tarjetas inteligentes que tienen un LED y métodos para fabricar las mismas |
| DE102021001579A1 (de) | 2021-03-25 | 2022-09-29 | Giesecke+Devrient Mobile Security Gmbh | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
| WO2023284616A1 (en) * | 2021-07-16 | 2023-01-19 | Act Identity Technology Limited | Chip module and method of forming same |
| US11960951B1 (en) * | 2022-09-23 | 2024-04-16 | Capital One Services, Llc | Transaction card with multiple orientations |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837153A (en) * | 1997-01-15 | 1998-11-17 | Kawan; Joseph C. | Method and system for creating and using a logotype contact module with a smart card |
| US6832730B2 (en) * | 2001-07-27 | 2004-12-21 | Storcard, Inc. | Smart card with rotating storage |
| DE10303740B4 (de) * | 2003-01-30 | 2006-09-14 | Infineon Technologies Flash Gmbh & Co. Kg | Sicherheitsspeicherkarte und Herstellungsverfahren |
| US9430732B2 (en) * | 2014-05-08 | 2016-08-30 | Tego, Inc. | Three-dimension RFID tag with opening through structure |
| US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
| CN102231193B (zh) * | 2011-07-06 | 2013-05-08 | 黄艳 | 一种双界面智能卡 |
| US9390364B2 (en) * | 2011-08-08 | 2016-07-12 | Féinics Amatech Teoranta | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
| JP5482746B2 (ja) * | 2011-08-25 | 2014-05-07 | 大日本印刷株式会社 | カード、カードの製造方法 |
| FR2980015B1 (fr) * | 2011-09-08 | 2013-11-22 | Sansystems | Dispositif electronique a puce et procede de fabrication par bobines |
| US20140042230A1 (en) * | 2012-08-09 | 2014-02-13 | Infineon Technologies Ag | Chip card module with separate antenna and chip card inlay using same |
| WO2014082401A1 (zh) * | 2012-11-30 | 2014-06-05 | Xue Yuan | 双界面智能卡及其制造方法 |
| FR2999753B1 (fr) * | 2012-12-13 | 2015-02-13 | Oberthur Technologies | Procede de fabrication par lamination en continu de cartes a microcircuit du type a contact |
| EP2784724A3 (en) * | 2013-03-27 | 2015-04-22 | Féinics AmaTech Teoranta | Selective deposition of magnetic particles, and using magnetic material as a carrier medium to deposit other particles |
-
2016
- 2016-11-22 MX MX2018005155A patent/MX2018005155A/es unknown
- 2016-11-22 HU HUE16809206A patent/HUE045755T2/hu unknown
- 2016-11-22 ES ES16809206T patent/ES2747913T3/es active Active
- 2016-11-22 BR BR112018011000-0A patent/BR112018011000B1/pt active IP Right Grant
- 2016-11-22 KR KR1020187012554A patent/KR101897944B1/ko active IP Right Grant
- 2016-11-22 JP JP2018529179A patent/JP6544759B2/ja active Active
- 2016-11-22 EP EP16809206.2A patent/EP3384434B1/en active Active
- 2016-11-22 PL PL16809206T patent/PL3384434T3/pl unknown
- 2016-11-22 PT PT168092062T patent/PT3384434T/pt unknown
- 2016-11-22 MA MA43370A patent/MA43370B1/fr unknown
- 2016-11-22 CA CA3002778A patent/CA3002778C/en active Active
- 2016-11-22 BR BR122019027776-1A patent/BR122019027776B1/pt active IP Right Grant
- 2016-11-22 WO PCT/SG2016/050574 patent/WO2017095329A1/en active Application Filing
- 2016-11-22 UA UAA201803354A patent/UA118640C2/uk unknown
- 2016-11-22 AU AU2016361882A patent/AU2016361882B2/en active Active
- 2016-11-22 CN CN201680070576.2A patent/CN108292373B/zh active Active
- 2016-11-22 RU RU2018111711A patent/RU2667741C1/ru active
- 2016-11-22 US US15/767,043 patent/US10558906B2/en active Active
-
2018
- 2018-03-27 PH PH12018500683A patent/PH12018500683A1/en unknown
- 2018-04-04 ZA ZA2018/02189A patent/ZA201802189B/en unknown
-
2019
- 2019-12-27 US US16/728,949 patent/US10685275B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| BR112018011000A2 (pt) | 2018-12-04 |
| PH12018500683B1 (en) | 2018-10-15 |
| WO2017095329A1 (en) | 2017-06-08 |
| UA118640C2 (uk) | 2019-02-11 |
| AU2016361882B2 (en) | 2018-11-01 |
| JP6544759B2 (ja) | 2019-07-17 |
| PT3384434T (pt) | 2019-10-28 |
| US10558906B2 (en) | 2020-02-11 |
| BR112018011000B1 (pt) | 2020-10-20 |
| ZA201802189B (en) | 2019-08-28 |
| EP3384434A1 (en) | 2018-10-10 |
| CA3002778C (en) | 2018-09-18 |
| PL3384434T3 (pl) | 2020-01-31 |
| EP3384434B1 (en) | 2019-08-21 |
| HUE045755T2 (hu) | 2020-01-28 |
| BR122019027776B1 (pt) | 2020-10-20 |
| KR20180069000A (ko) | 2018-06-22 |
| CN108292373B (zh) | 2019-07-23 |
| MA43370B1 (fr) | 2019-10-31 |
| CA3002778A1 (en) | 2017-06-08 |
| ES2747913T3 (es) | 2020-03-12 |
| KR101897944B1 (ko) | 2018-09-12 |
| US20180300597A1 (en) | 2018-10-18 |
| CN108292373A (zh) | 2018-07-17 |
| RU2667741C1 (ru) | 2018-09-24 |
| US10685275B2 (en) | 2020-06-16 |
| AU2016361882A1 (en) | 2018-04-19 |
| US20200134413A1 (en) | 2020-04-30 |
| JP2019500749A (ja) | 2019-01-10 |
| PH12018500683A1 (en) | 2018-10-15 |
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