MX2018000332A - Disipador termico. - Google Patents

Disipador termico.

Info

Publication number
MX2018000332A
MX2018000332A MX2018000332A MX2018000332A MX2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A
Authority
MX
Mexico
Prior art keywords
heat
cooled
transfer layer
layer
heat transfer
Prior art date
Application number
MX2018000332A
Other languages
English (en)
Inventor
Moriyama Hirotake
Hayashi Akihiro
Original Assignee
Sumitomo Seika Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Seika Chemicals filed Critical Sumitomo Seika Chemicals
Publication of MX2018000332A publication Critical patent/MX2018000332A/es

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)

Abstract

Se proporciona un disipador térmico que sea ligero, fácil de trabajar y que tenga una buena capacidad de enfriamiento. Un disipador térmico X1 de la presente invención incluye una carcasa cuasi-tubular 1 que se fija a un objetivo de enfriamiento 01 y se conforma mediante una lámina termodisipadora. La lámina termodisipadora tiene una capa de transferencia de calor 1A y una capa de radiación térmica 1B laminada sobre la capa de transferencia de calor 1A. La capa de radiación térmica 1B constituye al menos una parte de una superficie exterior de la carcasa 1 situada lejos del objetivo de enfriamiento 01.
MX2018000332A 2015-07-10 2016-07-01 Disipador termico. MX2018000332A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015138934A JP2018139236A (ja) 2015-07-10 2015-07-10 ヒートシンク
PCT/JP2016/069664 WO2017010322A1 (ja) 2015-07-10 2016-07-01 ヒートシンク

Publications (1)

Publication Number Publication Date
MX2018000332A true MX2018000332A (es) 2018-06-07

Family

ID=57756967

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018000332A MX2018000332A (es) 2015-07-10 2016-07-01 Disipador termico.

Country Status (9)

Country Link
US (1) US20180195816A1 (es)
EP (1) EP3322270A4 (es)
JP (1) JP2018139236A (es)
KR (1) KR20180026735A (es)
CN (1) CN108029218A (es)
CA (1) CA2991695A1 (es)
MX (1) MX2018000332A (es)
TW (1) TW201719104A (es)
WO (1) WO2017010322A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017088809A (ja) * 2015-11-16 2017-05-25 住友精化株式会社 熱放射性塗膜形成用水性分散液、熱放射性塗膜及び放熱シート
CN110800174B (zh) * 2017-08-07 2023-05-16 极光先进雷射株式会社 电容器的冷却构造和激光装置
JP6816678B2 (ja) * 2017-08-30 2021-01-20 トヨタ自動車株式会社 放熱シート
CN110416808A (zh) * 2019-07-10 2019-11-05 安徽迅科智能技术有限公司 一种弱电系统接线器
US11064632B2 (en) * 2019-09-05 2021-07-13 Ldc Precision Engineering Co., Ltd. Heat-sinking improved structure for evaporators
TWI703295B (zh) * 2019-10-15 2020-09-01 財團法人食品工業發展研究所 複合加熱裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564496A (en) * 1994-11-01 1996-10-15 United Technologies Corporation Composite parting sheet
JP2006093546A (ja) * 2004-09-27 2006-04-06 Oki Electric Ind Co Ltd 放熱シート、放熱筒状体およびそれらを用いた放熱構造
JP2006245523A (ja) * 2005-02-04 2006-09-14 Dainippon Printing Co Ltd 放熱シート、及びその製造方法
JP2006253601A (ja) * 2005-03-14 2006-09-21 Oki Electric Ind Co Ltd 放熱装置およびそれを用いた放熱構造
JP5193431B2 (ja) * 2006-04-18 2013-05-08 沖電線株式会社 放熱構造
JP2008091715A (ja) * 2006-10-03 2008-04-17 Techno Associe Co Ltd 放熱筒状体およびこれを用いる放熱構造
US20090303685A1 (en) * 2008-06-10 2009-12-10 Chen H W Interface module with high heat-dissipation
JP5397543B2 (ja) * 2010-05-28 2014-01-22 トヨタ自動車株式会社 熱交換器及びその製造方法
JP2012078487A (ja) * 2010-09-30 2012-04-19 Sanyo Electric Co Ltd 投写型映像表示装置
JP6292549B2 (ja) * 2013-03-28 2018-03-14 住友精化株式会社 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池
WO2014157587A1 (ja) * 2013-03-29 2014-10-02 株式会社神戸製鋼所 プレコートアルミニウム板材、アルミニウム板材および車載ｌｅｄ照明用ヒートシンク

Also Published As

Publication number Publication date
JP2018139236A (ja) 2018-09-06
EP3322270A4 (en) 2018-12-26
WO2017010322A1 (ja) 2017-01-19
CN108029218A (zh) 2018-05-11
KR20180026735A (ko) 2018-03-13
TW201719104A (zh) 2017-06-01
EP3322270A1 (en) 2018-05-16
CA2991695A1 (en) 2017-01-19
US20180195816A1 (en) 2018-07-12

Similar Documents

Publication Publication Date Title
MX2018000332A (es) Disipador termico.
IL273104A (en) Heat sinks, component and arrangement of heat sinks for liquid immersion cooling
EP3411648A4 (en) BATTERY COOLING PLATE HEAT EXCHANGER AND PLATE ASSEMBLY
TW201613037A (en) Substrate for power modules, substrate with heat sink for power modules and power module with heat sink
PH12016502202A1 (en) Integrated vapor chamber for thermal management of computing devices
WO2017189156A3 (en) Wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks
EP3601920A4 (en) COOLING TOWER EQUIPPED WITH DIRECT AND INDIRECT HEAT EXCHANGERS
EP3255358A4 (en) Heat exchange apparatus and semi-conductor cooling refrigerator provided with same
EP3260723A3 (en) Heat dissipating brake rotor
EP3745453A4 (en) SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND POWER MODULE
MX2017014037A (es) Un portador refrigerado.
PL3829280T3 (pl) Systemy chłodzenia przystosowane do termicznego łączenia ich z urządzeniami wytwarzającymi ciepło
GB201212923D0 (en) Improved apparatus
EP3258559A4 (en) Retaining structure-based heat transfer and dissipation system and wind generator set
EP3667718A4 (en) DIELECTRIC LOW CONSTANT THERMOCONDUCTIVE HEAT DISSIPATION ELEMENT
EP3595003A4 (en) POWER MODULE SUBSTRATE WITH HEAT SINK
SG11202113191SA (en) Radiator and hydrogen generator with heat dissipation function
TW201613456A (en) Heat dissipation module
EP3515667A4 (en) IMPROVED HEAT SINK AND THERMAL DISSIPATION STRUCTURE
GB202316736D0 (en) Heat sinks with beyond-board fins
PH12018500850A1 (en) Protective film forming sheet
TWM533846U (en) Heat dissipating device
JP1654099S (ja) 放熱構造体
GB201903669D0 (en) Distributed computing with heat transfer
MX2017008884A (es) Enfriador de bebidas.