MX2017003407A - Componente termicamente conductivo de centro de carga. - Google Patents
Componente termicamente conductivo de centro de carga.Info
- Publication number
- MX2017003407A MX2017003407A MX2017003407A MX2017003407A MX2017003407A MX 2017003407 A MX2017003407 A MX 2017003407A MX 2017003407 A MX2017003407 A MX 2017003407A MX 2017003407 A MX2017003407 A MX 2017003407A MX 2017003407 A MX2017003407 A MX 2017003407A
- Authority
- MX
- Mexico
- Prior art keywords
- load center
- heat
- thermally conductive
- conductive component
- heat generating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/03—Cooling
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Aquí se proporcionan dispositivos y sistemas para disipar el calor generado a partir de componentes generadores de calor en un centro de carga. El concepto descrito proporciona un componente disipador de calor que ayuda a la disipación de calor de un componente generador de calor en un centro de carga al transferir calor desde el componente generador de calor a un componente no generador de calor.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/078,473 US10283945B2 (en) | 2016-03-23 | 2016-03-23 | Load center thermally conductive component |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2017003407A true MX2017003407A (es) | 2018-08-15 |
Family
ID=59895558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2017003407A MX2017003407A (es) | 2016-03-23 | 2017-03-15 | Componente termicamente conductivo de centro de carga. |
Country Status (3)
Country | Link |
---|---|
US (1) | US10283945B2 (es) |
CA (1) | CA2961328C (es) |
MX (1) | MX2017003407A (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106410706B (zh) * | 2016-10-18 | 2019-09-27 | 北京金风科创风电设备有限公司 | 电力输运载体及其加工工艺,以及围护结构 |
EP3661341A1 (de) * | 2018-11-27 | 2020-06-03 | Siemens Aktiengesellschaft | Vorrichtung zur kühlung einer stromschiene |
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US4100089A (en) * | 1976-01-16 | 1978-07-11 | Raychem Corporation | High-voltage insulating material comprising anti-tracking and erosion inhibiting compounds with insulating polymers |
US4733329A (en) * | 1986-10-31 | 1988-03-22 | Siemens Energy & Automation | Three-phase load center |
JPH05161511A (ja) | 1991-12-19 | 1993-06-29 | Shinko Kogyo Co Ltd | パーソナル冷暖房機付き机 |
US5196815A (en) | 1992-01-31 | 1993-03-23 | Westinghouse Electric Corp. | Miniature circuit breaker |
US5315477A (en) * | 1993-04-08 | 1994-05-24 | General Electric Company | Thermally efficient compact circuit breaker support and enclosure |
US5315830B1 (en) | 1993-04-14 | 1998-04-07 | Marlow Ind Inc | Modular thermoelectric assembly |
JP4627843B2 (ja) | 1999-07-22 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US6509808B1 (en) | 1999-09-17 | 2003-01-21 | Lockhead Martin Energy Research | High thermal conductivity lossy dielectric using a multi layer configuration |
US8916966B2 (en) | 2004-09-28 | 2014-12-23 | Triquint Semiconductor, Inc. | Integrated circuit including a heat dissipation structure |
US7361538B2 (en) | 2005-04-14 | 2008-04-22 | Infineon Technologies Ag | Transistors and methods of manufacture thereof |
US8373195B2 (en) | 2006-04-12 | 2013-02-12 | SemiLEDs Optoelectronics Co., Ltd. | Light-emitting diode lamp with low thermal resistance |
US7821050B1 (en) | 2006-07-31 | 2010-10-26 | Altera Corporation | CRAM transistors with high immunity to soft error |
JP4727684B2 (ja) | 2007-03-27 | 2011-07-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
CN101835830B (zh) | 2007-08-31 | 2013-02-20 | 卡伯特公司 | 热界面材料 |
JP4704416B2 (ja) | 2007-12-17 | 2011-06-15 | Okiセミコンダクタ株式会社 | Soi基板を用いた半導体装置及びその製造方法 |
WO2010141489A2 (en) * | 2009-06-01 | 2010-12-09 | Alcoa Inc. | Fire resistant systems, methods and apparatus |
EP2517217B1 (de) | 2009-12-21 | 2020-08-19 | TDK Electronics AG | Temperaturunhabhängiger kondensator und kondensatormodul |
US8203839B2 (en) * | 2010-03-10 | 2012-06-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices, power modules, and vehicles incorporating the same |
US8270167B2 (en) * | 2010-10-21 | 2012-09-18 | General Electric Company | Heat transfer apparatus for use with electrical devices |
US8339772B2 (en) * | 2010-11-08 | 2012-12-25 | Schneider Electric USA, Inc. | Heat dissipation means for increasing power density in enclosed equipment |
KR20120054934A (ko) | 2010-11-22 | 2012-05-31 | 삼성전자주식회사 | 고유전상수의 게이트 유전층을 갖는 반도체 소자의 제조방법들 및 그에 의해 제조된 반도체 소자들 |
US8847382B2 (en) | 2010-12-06 | 2014-09-30 | Stmicroelectronics Pte. Ltd. | Thermoelectric cooler system, method and device |
US8441092B2 (en) | 2010-12-06 | 2013-05-14 | Stmicroelectronics Pte. Ltd. | Thermoelectric cooler system, method and device |
CN201879083U (zh) | 2010-12-08 | 2011-06-29 | 河海大学 | 便捷收放式床上小书桌 |
TW201242501A (en) | 2011-04-08 | 2012-10-16 | Yuen Jinn Electrical Ceramic Co Ltd | Ceramic heat sink module and manufacturing method thereof |
WO2013040289A2 (en) * | 2011-09-15 | 2013-03-21 | Porex Corporation | Thermally conductive porous media |
US8674509B2 (en) | 2012-05-31 | 2014-03-18 | Freescale Semiconductor, Inc. | Integrated circuit die assembly with heat spreader |
JP2014135478A (ja) | 2012-12-03 | 2014-07-24 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
US9412891B2 (en) | 2012-12-17 | 2016-08-09 | International Business Machines Corporation | Thermal receiver for high power solar concentrators and method of assembly |
JP5725050B2 (ja) | 2013-01-29 | 2015-05-27 | トヨタ自動車株式会社 | 半導体モジュール |
KR101564992B1 (ko) * | 2014-05-30 | 2015-11-03 | 엘에스산전 주식회사 | 배선용 차단기 |
-
2016
- 2016-03-23 US US15/078,473 patent/US10283945B2/en active Active
-
2017
- 2017-03-15 MX MX2017003407A patent/MX2017003407A/es unknown
- 2017-03-17 CA CA2961328A patent/CA2961328C/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20170279253A1 (en) | 2017-09-28 |
CA2961328A1 (en) | 2017-09-23 |
US10283945B2 (en) | 2019-05-07 |
CA2961328C (en) | 2023-10-10 |
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