MX2017003109A - Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos. - Google Patents
Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos.Info
- Publication number
- MX2017003109A MX2017003109A MX2017003109A MX2017003109A MX2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A
- Authority
- MX
- Mexico
- Prior art keywords
- systems
- heat
- methods
- same
- heat path
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
En la presente invención se proporcionan dispositivos, sistemas y métodos para disipar el calor generado a partir de un dispositivo portador de corriente eléctrica. El concepto descrito proporciona un dispositivo dieléctrico de ruta de calor que ayuda a la disipación de calor de un dispositivo portador de corriente eléctrica transfiriendo calor desde un extremo del dispositivo a otro. El concepto descrito también proporciona sistemas que comunican el calor generado por un dispositivo eléctrico a un dispositivo secundario puesto a tierra térmicamente a través de un dispositivo dieléctrico de trayectoria térmica para disipar el calor.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/078,481 US10115657B2 (en) | 2016-03-23 | 2016-03-23 | Dielectric heat path devices, and systems and methods using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2017003109A true MX2017003109A (es) | 2018-08-15 |
Family
ID=59895550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2017003109A MX2017003109A (es) | 2016-03-23 | 2017-03-09 | Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos. |
Country Status (3)
Country | Link |
---|---|
US (3) | US10115657B2 (es) |
CA (1) | CA2960121C (es) |
MX (1) | MX2017003109A (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109982551A (zh) * | 2019-04-12 | 2019-07-05 | 赵洁 | 一种基于plc的自动化控制装置 |
Family Cites Families (34)
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US4100089A (en) | 1976-01-16 | 1978-07-11 | Raychem Corporation | High-voltage insulating material comprising anti-tracking and erosion inhibiting compounds with insulating polymers |
US4733329A (en) | 1986-10-31 | 1988-03-22 | Siemens Energy & Automation | Three-phase load center |
JPH05161511A (ja) * | 1991-12-19 | 1993-06-29 | Shinko Kogyo Co Ltd | パーソナル冷暖房機付き机 |
US5196815A (en) | 1992-01-31 | 1993-03-23 | Westinghouse Electric Corp. | Miniature circuit breaker |
US5315477A (en) | 1993-04-08 | 1994-05-24 | General Electric Company | Thermally efficient compact circuit breaker support and enclosure |
US5315830B1 (en) * | 1993-04-14 | 1998-04-07 | Marlow Ind Inc | Modular thermoelectric assembly |
JP4627843B2 (ja) * | 1999-07-22 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US6509808B1 (en) * | 1999-09-17 | 2003-01-21 | Lockhead Martin Energy Research | High thermal conductivity lossy dielectric using a multi layer configuration |
US8916966B2 (en) * | 2004-09-28 | 2014-12-23 | Triquint Semiconductor, Inc. | Integrated circuit including a heat dissipation structure |
US7361538B2 (en) * | 2005-04-14 | 2008-04-22 | Infineon Technologies Ag | Transistors and methods of manufacture thereof |
US8373195B2 (en) * | 2006-04-12 | 2013-02-12 | SemiLEDs Optoelectronics Co., Ltd. | Light-emitting diode lamp with low thermal resistance |
US7821050B1 (en) * | 2006-07-31 | 2010-10-26 | Altera Corporation | CRAM transistors with high immunity to soft error |
JP4727684B2 (ja) * | 2007-03-27 | 2011-07-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
JP5887056B2 (ja) | 2007-08-31 | 2016-03-16 | キャボット コーポレイションCabot Corporation | サーマルインターフェースマテリアル |
JP4704416B2 (ja) * | 2007-12-17 | 2011-06-15 | Okiセミコンダクタ株式会社 | Soi基板を用いた半導体装置及びその製造方法 |
US20100304078A1 (en) | 2009-06-01 | 2010-12-02 | Alcoa Inc. | Fire resistant systems, methods and apparatus |
US20120281335A1 (en) * | 2009-12-21 | 2012-11-08 | Epcos Ag | Temperature-Independent Capacitor and Capacitor Module |
US8203839B2 (en) | 2010-03-10 | 2012-06-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices, power modules, and vehicles incorporating the same |
US8270167B2 (en) | 2010-10-21 | 2012-09-18 | General Electric Company | Heat transfer apparatus for use with electrical devices |
US8339772B2 (en) | 2010-11-08 | 2012-12-25 | Schneider Electric USA, Inc. | Heat dissipation means for increasing power density in enclosed equipment |
KR20120054934A (ko) * | 2010-11-22 | 2012-05-31 | 삼성전자주식회사 | 고유전상수의 게이트 유전층을 갖는 반도체 소자의 제조방법들 및 그에 의해 제조된 반도체 소자들 |
US8441092B2 (en) * | 2010-12-06 | 2013-05-14 | Stmicroelectronics Pte. Ltd. | Thermoelectric cooler system, method and device |
US8847382B2 (en) * | 2010-12-06 | 2014-09-30 | Stmicroelectronics Pte. Ltd. | Thermoelectric cooler system, method and device |
CN201879083U (zh) * | 2010-12-08 | 2011-06-29 | 河海大学 | 便捷收放式床上小书桌 |
TW201242501A (en) | 2011-04-08 | 2012-10-16 | Yuen Jinn Electrical Ceramic Co Ltd | Ceramic heat sink module and manufacturing method thereof |
US20150232732A1 (en) | 2011-09-15 | 2015-08-20 | Porex Corporation | Thermally conductive porous media |
US8969924B2 (en) * | 2012-05-21 | 2015-03-03 | The Board Of Trustees Of The Leland Stanford Junior University | Transistor-based apparatuses, systems and methods |
US8674509B2 (en) * | 2012-05-31 | 2014-03-18 | Freescale Semiconductor, Inc. | Integrated circuit die assembly with heat spreader |
JP2014135478A (ja) * | 2012-12-03 | 2014-07-24 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
US9412891B2 (en) * | 2012-12-17 | 2016-08-09 | International Business Machines Corporation | Thermal receiver for high power solar concentrators and method of assembly |
JP5725050B2 (ja) * | 2013-01-29 | 2015-05-27 | トヨタ自動車株式会社 | 半導体モジュール |
US20150001623A1 (en) * | 2013-06-26 | 2015-01-01 | Tsinghua University | Field effect transistor and method for forming the same |
KR102200928B1 (ko) * | 2014-02-18 | 2021-01-11 | 삼성전자주식회사 | 낮은 기생 커패시턴스 성분을 갖는 트랜지스터와 이의 제조 방법 |
KR101564992B1 (ko) | 2014-05-30 | 2015-11-03 | 엘에스산전 주식회사 | 배선용 차단기 |
-
2016
- 2016-03-23 US US15/078,481 patent/US10115657B2/en active Active
-
2017
- 2017-03-07 CA CA2960121A patent/CA2960121C/en active Active
- 2017-03-09 MX MX2017003109A patent/MX2017003109A/es unknown
-
2018
- 2018-01-18 US US15/874,032 patent/US10615098B2/en active Active
-
2020
- 2020-02-24 US US16/799,353 patent/US20200194337A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CA2960121C (en) | 2023-10-03 |
US20200194337A1 (en) | 2020-06-18 |
CA2960121A1 (en) | 2017-09-23 |
US10115657B2 (en) | 2018-10-30 |
US20170278772A1 (en) | 2017-09-28 |
US20180145008A1 (en) | 2018-05-24 |
US10615098B2 (en) | 2020-04-07 |
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