MX2017003109A - Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos. - Google Patents

Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos.

Info

Publication number
MX2017003109A
MX2017003109A MX2017003109A MX2017003109A MX2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A MX 2017003109 A MX2017003109 A MX 2017003109A
Authority
MX
Mexico
Prior art keywords
systems
heat
methods
same
heat path
Prior art date
Application number
MX2017003109A
Other languages
English (en)
Inventor
Ray BENSON Tony
J Fritz Peter
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of MX2017003109A publication Critical patent/MX2017003109A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

En la presente invención se proporcionan dispositivos, sistemas y métodos para disipar el calor generado a partir de un dispositivo portador de corriente eléctrica. El concepto descrito proporciona un dispositivo dieléctrico de ruta de calor que ayuda a la disipación de calor de un dispositivo portador de corriente eléctrica transfiriendo calor desde un extremo del dispositivo a otro. El concepto descrito también proporciona sistemas que comunican el calor generado por un dispositivo eléctrico a un dispositivo secundario puesto a tierra térmicamente a través de un dispositivo dieléctrico de trayectoria térmica para disipar el calor.
MX2017003109A 2016-03-23 2017-03-09 Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos. MX2017003109A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/078,481 US10115657B2 (en) 2016-03-23 2016-03-23 Dielectric heat path devices, and systems and methods using the same

Publications (1)

Publication Number Publication Date
MX2017003109A true MX2017003109A (es) 2018-08-15

Family

ID=59895550

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017003109A MX2017003109A (es) 2016-03-23 2017-03-09 Dispositivos dielectricos de ruta termica, y sistemas y metodos que usan los mismos.

Country Status (3)

Country Link
US (3) US10115657B2 (es)
CA (1) CA2960121C (es)
MX (1) MX2017003109A (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109982551A (zh) * 2019-04-12 2019-07-05 赵洁 一种基于plc的自动化控制装置

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US6509808B1 (en) * 1999-09-17 2003-01-21 Lockhead Martin Energy Research High thermal conductivity lossy dielectric using a multi layer configuration
US8916966B2 (en) * 2004-09-28 2014-12-23 Triquint Semiconductor, Inc. Integrated circuit including a heat dissipation structure
US7361538B2 (en) * 2005-04-14 2008-04-22 Infineon Technologies Ag Transistors and methods of manufacture thereof
US8373195B2 (en) * 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance
US7821050B1 (en) * 2006-07-31 2010-10-26 Altera Corporation CRAM transistors with high immunity to soft error
JP4727684B2 (ja) * 2007-03-27 2011-07-20 富士フイルム株式会社 薄膜電界効果型トランジスタおよびそれを用いた表示装置
EP2183312A1 (en) 2007-08-31 2010-05-12 Cabot Corporation Thermal interface materials
JP4704416B2 (ja) * 2007-12-17 2011-06-15 Ｏｋｉセミコンダクタ株式会社 Ｓｏｉ基板を用いた半導体装置及びその製造方法
WO2010141489A2 (en) 2009-06-01 2010-12-09 Alcoa Inc. Fire resistant systems, methods and apparatus
CN102667979B (zh) * 2009-12-21 2016-01-13 爱普科斯公司 与温度有关的电容器和电容器模块
US8203839B2 (en) 2010-03-10 2012-06-19 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices, power modules, and vehicles incorporating the same
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KR20120054934A (ko) * 2010-11-22 2012-05-31 삼성전자주식회사 고유전상수의 게이트 유전층을 갖는 반도체 소자의 제조방법들 및 그에 의해 제조된 반도체 소자들
US8441092B2 (en) * 2010-12-06 2013-05-14 Stmicroelectronics Pte. Ltd. Thermoelectric cooler system, method and device
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TW201242501A (en) 2011-04-08 2012-10-16 Yuen Jinn Electrical Ceramic Co Ltd Ceramic heat sink module and manufacturing method thereof
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KR101564992B1 (ko) 2014-05-30 2015-11-03 엘에스산전 주식회사 배선용 차단기

Also Published As

Publication number Publication date
US20200194337A1 (en) 2020-06-18
CA2960121C (en) 2023-10-03
US20170278772A1 (en) 2017-09-28
US10115657B2 (en) 2018-10-30
US20180145008A1 (en) 2018-05-24
US10615098B2 (en) 2020-04-07
CA2960121A1 (en) 2017-09-23

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