MX2015009460A - Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico. - Google Patents
Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico.Info
- Publication number
- MX2015009460A MX2015009460A MX2015009460A MX2015009460A MX2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A
- Authority
- MX
- Mexico
- Prior art keywords
- liquid cooling
- electronic device
- cooling
- cooling mediums
- liquid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Lubricants (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Medios líquidos de enfriamiento empleados para inmersión fría de dispositivos de hardware electrónico. Tales medios líquidos de enfriamiento tienen un punto de inflamación de al menos 190°C, según lo determinado de acuerdo con ASTM D92 y una viscosidad de 27 centistokes ("cSt") o menos a 40 ° C, tal como se determina de acuerdo con ASTM D445. Tales medios líquidos de enfriamiento se pueden emplear para inmersión fría de tales dispositivos como servidores informáticos, motherboards del servidor, y microprocesadores.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361756019P | 2013-01-24 | 2013-01-24 | |
PCT/US2013/075670 WO2014116369A1 (en) | 2013-01-24 | 2013-12-17 | Liquid cooling medium for electronic device cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2015009460A true MX2015009460A (es) | 2015-09-24 |
Family
ID=49956377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015009460A MX2015009460A (es) | 2013-01-24 | 2013-12-17 | Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico. |
Country Status (9)
Country | Link |
---|---|
US (1) | US20150319889A1 (es) |
EP (1) | EP2948516A1 (es) |
JP (1) | JP6282289B2 (es) |
KR (1) | KR20150109368A (es) |
CN (1) | CN104903420A (es) |
BR (1) | BR112015015845A2 (es) |
CA (1) | CA2897962A1 (es) |
MX (1) | MX2015009460A (es) |
WO (1) | WO2014116369A1 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017171697A1 (en) * | 2016-03-28 | 2017-10-05 | Intel Corporation | User protection from thermal hot spots through device skin morphing |
GB2549946A (en) | 2016-05-03 | 2017-11-08 | Bitfury Group Ltd | Immersion cooling |
JP6217835B1 (ja) * | 2016-09-16 | 2017-10-25 | 富士通株式会社 | 液浸冷却装置 |
JP6217885B1 (ja) | 2016-09-16 | 2017-10-25 | 富士通株式会社 | 液浸槽および液浸槽を有する装置 |
CN106569565A (zh) * | 2016-10-31 | 2017-04-19 | 曙光信息产业(北京)有限公司 | 浸没式液冷服务器 |
JP6237942B1 (ja) * | 2017-01-30 | 2017-11-29 | 富士通株式会社 | 液浸冷却装置 |
CN106833544A (zh) * | 2017-03-27 | 2017-06-13 | 卓聪(上海)环保科技发展有限公司 | It通信设备浸没式冷却剂及其制备方法 |
US20220259476A1 (en) | 2019-06-12 | 2022-08-18 | The Lubrizol Corporation | Organic heat transfer system, method and fluid |
FI20205816A1 (en) * | 2020-08-21 | 2022-02-22 | Neste Oyj | Coolant for direct single-phase immersion cooling |
CN117693573A (zh) * | 2021-07-26 | 2024-03-12 | 路博润公司 | 有机热传递系统、方法和流体 |
US11608217B1 (en) | 2022-01-01 | 2023-03-21 | Liquidstack Holding B.V. | Automated closure for hermetically sealing an immersion cooling tank during a hot swap of equipment therein |
JPWO2024014539A1 (es) * | 2022-07-14 | 2024-01-18 | ||
EP4321592A1 (de) | 2022-08-08 | 2024-02-14 | OQ Chemicals GmbH | Effiziente und umweltfreundliche kühlmittel zur direkten kühlung elektrischer akkumulatoren |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB640530A (en) * | 1947-10-28 | 1950-07-19 | Shell Refining & Marketing Co | Improvements in or relating to lubricating compositions |
US2717242A (en) * | 1951-12-05 | 1955-09-06 | California Research Corp | Polyoxyalkylene lubricant composition |
US4239638A (en) * | 1977-11-22 | 1980-12-16 | Uniroyal, Inc. | Use of synthetic hydrocarbon oils as heat transfer fluids |
US4422962A (en) * | 1981-02-19 | 1983-12-27 | General Electric Company | Polyglycol dielectric capacitor fluid |
US20040069454A1 (en) * | 1998-11-02 | 2004-04-15 | Bonsignore Patrick V. | Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof |
JP3804379B2 (ja) * | 1999-12-24 | 2006-08-02 | 日本油脂株式会社 | 液状油組成物 |
US6355850B1 (en) * | 2000-01-18 | 2002-03-12 | Exxon Research And Engineering Company | Manufacture of electrical oil enriched with hydrofined gas oil for improved oxidation and electrical resistance |
DE60324771D1 (de) * | 2002-02-19 | 2009-01-02 | Honeywell Int Inc | Wärmeträger mit hohem elektrischem widerstand für brennstoffzellaggregate |
JP2006057920A (ja) * | 2004-08-20 | 2006-03-02 | Hitachi Ltd | 電子機器の液冷システム、及び、これを用いた電子機器 |
US7510674B2 (en) * | 2004-12-01 | 2009-03-31 | Chevron U.S.A. Inc. | Dielectric fluids and processes for making same |
US7413677B2 (en) * | 2005-02-25 | 2008-08-19 | E. I. Du Pont De Nemours And Company | Process for heat transfer utilizing a polytrimethylene homo- or copolyether glycol based heat transfer fluid |
US7682499B2 (en) * | 2005-08-31 | 2010-03-23 | Shell Oil Company | Mineral insulating oil, a process for preparing a mineral insulating oil, and a process for using a mineral insulating oil |
US8187508B2 (en) * | 2005-09-09 | 2012-05-29 | Lion Corporation | Base agent for electrical insulating oil |
US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
US20080315152A1 (en) * | 2007-06-22 | 2008-12-25 | Daly Glendon C | Heat transfer fluid |
US20090001372A1 (en) * | 2007-06-29 | 2009-01-01 | Lumination Llc | Efficient cooling of lasers, LEDs and photonics devices |
US20090152713A1 (en) * | 2007-12-18 | 2009-06-18 | Ioan Sauciuc | Integrated circuit assembly including thermal interface material comprised of oil or wax |
WO2010019517A1 (en) | 2008-08-11 | 2010-02-18 | Green Revolution Cooling, Inc. | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
CN201262729Y (zh) * | 2008-09-23 | 2009-06-24 | 朱勇 | 油冷观赏式计算机主机箱 |
DE102009001130A1 (de) * | 2009-02-25 | 2010-08-26 | Rhein Chemie Rheinau Gmbh | Transformatorölzusammensetzung, umfassend mindestens einen Säurefänger |
US8378042B2 (en) * | 2009-04-28 | 2013-02-19 | Exxonmobil Chemical Patents Inc. | Finishing process for amorphous polymers |
US8826984B2 (en) * | 2009-07-17 | 2014-09-09 | Baker Hughes Incorporated | Method and apparatus of heat dissipaters for electronic components in downhole tools |
JP6046731B2 (ja) * | 2011-09-30 | 2016-12-21 | ダウ グローバル テクノロジーズ エルエルシー | 改善された温度管理のための誘電性流体組成物 |
-
2013
- 2013-12-17 CA CA2897962A patent/CA2897962A1/en not_active Abandoned
- 2013-12-17 US US14/648,015 patent/US20150319889A1/en not_active Abandoned
- 2013-12-17 KR KR1020157019827A patent/KR20150109368A/ko not_active Application Discontinuation
- 2013-12-17 EP EP13821259.2A patent/EP2948516A1/en not_active Withdrawn
- 2013-12-17 BR BR112015015845A patent/BR112015015845A2/pt not_active IP Right Cessation
- 2013-12-17 JP JP2015555158A patent/JP6282289B2/ja not_active Expired - Fee Related
- 2013-12-17 CN CN201380069944.8A patent/CN104903420A/zh active Pending
- 2013-12-17 MX MX2015009460A patent/MX2015009460A/es unknown
- 2013-12-17 WO PCT/US2013/075670 patent/WO2014116369A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP6282289B2 (ja) | 2018-02-21 |
EP2948516A1 (en) | 2015-12-02 |
CN104903420A (zh) | 2015-09-09 |
JP2016513304A (ja) | 2016-05-12 |
BR112015015845A2 (pt) | 2017-07-11 |
WO2014116369A1 (en) | 2014-07-31 |
CA2897962A1 (en) | 2014-07-31 |
US20150319889A1 (en) | 2015-11-05 |
KR20150109368A (ko) | 2015-10-01 |
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