MX2015009460A - Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico. - Google Patents

Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico.

Info

Publication number
MX2015009460A
MX2015009460A MX2015009460A MX2015009460A MX2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A
Authority
MX
Mexico
Prior art keywords
liquid cooling
electronic device
cooling
cooling mediums
liquid
Prior art date
Application number
MX2015009460A
Other languages
English (en)
Inventor
Mohamed Esseghir
Anny L Flory
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2015009460A publication Critical patent/MX2015009460A/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/10Liquid materials
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Lubricants (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Medios líquidos de enfriamiento empleados para inmersión fría de dispositivos de hardware electrónico. Tales medios líquidos de enfriamiento tienen un punto de inflamación de al menos 190°C, según lo determinado de acuerdo con ASTM D92 y una viscosidad de 27 centistokes ("cSt") o menos a 40 ° C, tal como se determina de acuerdo con ASTM D445. Tales medios líquidos de enfriamiento se pueden emplear para inmersión fría de tales dispositivos como servidores informáticos, motherboards del servidor, y microprocesadores.
MX2015009460A 2013-01-24 2013-12-17 Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico. MX2015009460A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361756019P 2013-01-24 2013-01-24
PCT/US2013/075670 WO2014116369A1 (en) 2013-01-24 2013-12-17 Liquid cooling medium for electronic device cooling

Publications (1)

Publication Number Publication Date
MX2015009460A true MX2015009460A (es) 2015-09-24

Family

ID=49956377

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015009460A MX2015009460A (es) 2013-01-24 2013-12-17 Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico.

Country Status (9)

Country Link
US (1) US20150319889A1 (es)
EP (1) EP2948516A1 (es)
JP (1) JP6282289B2 (es)
KR (1) KR20150109368A (es)
CN (1) CN104903420A (es)
BR (1) BR112015015845A2 (es)
CA (1) CA2897962A1 (es)
MX (1) MX2015009460A (es)
WO (1) WO2014116369A1 (es)

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WO2017171697A1 (en) * 2016-03-28 2017-10-05 Intel Corporation User protection from thermal hot spots through device skin morphing
GB2549946A (en) 2016-05-03 2017-11-08 Bitfury Group Ltd Immersion cooling
JP6217835B1 (ja) * 2016-09-16 2017-10-25 富士通株式会社 液浸冷却装置
JP6217885B1 (ja) 2016-09-16 2017-10-25 富士通株式会社 液浸槽および液浸槽を有する装置
CN106569565A (zh) * 2016-10-31 2017-04-19 曙光信息产业(北京)有限公司 浸没式液冷服务器
JP6237942B1 (ja) * 2017-01-30 2017-11-29 富士通株式会社 液浸冷却装置
CN106833544A (zh) * 2017-03-27 2017-06-13 卓聪(上海)环保科技发展有限公司 It通信设备浸没式冷却剂及其制备方法
US20220259476A1 (en) 2019-06-12 2022-08-18 The Lubrizol Corporation Organic heat transfer system, method and fluid
FI20205816A1 (en) * 2020-08-21 2022-02-22 Neste Oyj Coolant for direct single-phase immersion cooling
CN117693573A (zh) * 2021-07-26 2024-03-12 路博润公司 有机热传递系统、方法和流体
US11608217B1 (en) 2022-01-01 2023-03-21 Liquidstack Holding B.V. Automated closure for hermetically sealing an immersion cooling tank during a hot swap of equipment therein
JPWO2024014539A1 (es) * 2022-07-14 2024-01-18
EP4321592A1 (de) 2022-08-08 2024-02-14 OQ Chemicals GmbH Effiziente und umweltfreundliche kühlmittel zur direkten kühlung elektrischer akkumulatoren

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US20040069454A1 (en) * 1998-11-02 2004-04-15 Bonsignore Patrick V. Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof
JP3804379B2 (ja) * 1999-12-24 2006-08-02 日本油脂株式会社 液状油組成物
US6355850B1 (en) * 2000-01-18 2002-03-12 Exxon Research And Engineering Company Manufacture of electrical oil enriched with hydrofined gas oil for improved oxidation and electrical resistance
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Also Published As

Publication number Publication date
JP6282289B2 (ja) 2018-02-21
EP2948516A1 (en) 2015-12-02
CN104903420A (zh) 2015-09-09
JP2016513304A (ja) 2016-05-12
BR112015015845A2 (pt) 2017-07-11
WO2014116369A1 (en) 2014-07-31
CA2897962A1 (en) 2014-07-31
US20150319889A1 (en) 2015-11-05
KR20150109368A (ko) 2015-10-01

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