MX2015008124A - Componentes de compuestos polimericos para torres de comunicaciones inalambricas. - Google Patents

Componentes de compuestos polimericos para torres de comunicaciones inalambricas.

Info

Publication number
MX2015008124A
MX2015008124A MX2015008124A MX2015008124A MX2015008124A MX 2015008124 A MX2015008124 A MX 2015008124A MX 2015008124 A MX2015008124 A MX 2015008124A MX 2015008124 A MX2015008124 A MX 2015008124A MX 2015008124 A MX2015008124 A MX 2015008124A
Authority
MX
Mexico
Prior art keywords
polymer composite
wireless
composite components
communication towers
communications
Prior art date
Application number
MX2015008124A
Other languages
English (en)
Other versions
MX361304B (es
Inventor
William J Harris
Bret P Neese
Mohamed Essenghir
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2015008124A publication Critical patent/MX2015008124A/es
Publication of MX361304B publication Critical patent/MX361304B/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • C08K7/24Expanded, porous or hollow particles inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06Polysulfones; Polyethersulfones
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • B32B2255/205Metallic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/72Density
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • B32B2307/734Dimensional stability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/02Noble metals
    • B32B2311/08Silver
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2369/00Polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0812Aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/06Cavity resonators
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06Receivers
    • H04B1/10Means associated with receiver for limiting or suppressing noise or interference
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
    • Y10T428/1314Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971Preformed hollow element-containing
    • Y10T428/249974Metal- or silicon-containing element
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31507Of polycarbonate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)

Abstract

La presente invención se refiere a un componente de torres de comunicaciones inalámbricas que se forma al menos parcialmente por un compuesto polimérico. El compuesto polimérico comprende un polímero termoplástico y un material de relleno, en el que el polímero termoplástico es no espumado. El compuesto polimérico tiene una conductividad térmica de al menos 0.5 vatios por metro Kelvin ('W/mK") medida a 25°C. Tales componentes de torres de comunicaciones inalámbricas incluyen filtros de cavidad de radio frecuencia ("RF"), disipadores térmicos, cubiertas y combinaciones de los mismos.
MX2015008124A 2012-12-20 2013-11-13 Componentes de compuestos polimericos para torres de comunicaciones inalambricas. MX361304B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261739839P 2012-12-20 2012-12-20
PCT/US2013/069824 WO2014099187A1 (en) 2012-12-20 2013-11-13 Polymer composite components for wireless-communication towers

Publications (2)

Publication Number Publication Date
MX2015008124A true MX2015008124A (es) 2015-09-23
MX361304B MX361304B (es) 2018-12-03

Family

ID=49667605

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015008124A MX361304B (es) 2012-12-20 2013-11-13 Componentes de compuestos polimericos para torres de comunicaciones inalambricas.

Country Status (9)

Country Link
US (1) US10287473B2 (es)
EP (1) EP2935464B1 (es)
JP (1) JP6377074B2 (es)
KR (1) KR102137296B1 (es)
CN (1) CN104837931B (es)
BR (1) BR112015014041B1 (es)
CA (1) CA2894268C (es)
MX (1) MX361304B (es)
WO (1) WO2014099187A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9541678B2 (en) 2013-11-13 2017-01-10 Arc Technologies, Inc. Multi-layer absorber
KR101612454B1 (ko) * 2014-09-30 2016-04-15 한국과학기술연구원 필러 및 고분자 수지의 복합 재료 층이 포함된 방열 시트 및 그 제조방법
DE202014008607U1 (de) * 2014-10-31 2014-11-24 Lanxess Deutschland Gmbh Polyamidzusammensetzungen
US9832918B2 (en) * 2015-08-13 2017-11-28 Arc Technologies, Inc. EMR absorbing server vent
KR20190023080A (ko) * 2016-06-24 2019-03-07 다우 글로벌 테크놀로지스 엘엘씨 금속화된 폴리우레탄 복합체 및 이의 제조 방법
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11359062B1 (en) 2021-01-20 2022-06-14 Thintronics, Inc. Polymer compositions and their uses
WO2022180221A1 (en) 2021-02-25 2022-09-01 Basf Se Polymers having improved thermal conductivity
GB2605403A (en) * 2021-03-30 2022-10-05 Sumitomo Chemical Co Thermally conductive composition
CN113402202B (zh) * 2021-06-03 2022-07-12 Oppo广东移动通信有限公司 制备壳体组件的方法、壳体组件和电子设备
US11596066B1 (en) 2022-03-22 2023-02-28 Thintronics. Inc. Materials for printed circuit boards
CN117362804B (zh) * 2023-12-07 2024-04-12 弘飞线缆集团股份公司 一种环保型线缆护套材料及线缆

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250064A (en) * 1978-06-05 1981-02-10 Gaf Corporation Plastic formulation reinforced with organic fibers
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
GB8728887D0 (en) * 1987-12-10 1988-01-27 Ici Plc Fibre reinforced thermoplastic composite structures
US4888387A (en) * 1988-03-10 1989-12-19 Asahi Kasei Kogyo Kabushiki Kaisha Resin composition comprising a polyamide or polycarbonate
US4963644A (en) * 1989-09-18 1990-10-16 The Goodyear Tire & Rubber Company Process for crystallization of polyethylene naphthalate
US5329687A (en) * 1992-10-30 1994-07-19 Teledyne Industries, Inc. Method of forming a filter with integrally formed resonators
US5294695A (en) * 1993-03-15 1994-03-15 Skc Limited Process for preparing polyethylene naphthalate
KR980700158A (ko) * 1994-11-30 1998-03-30 유미꾸라 레이이찌 합성수지 성형용 금형 및 이를 이용한 성형법(Mold for Molding Synthetic Resins and Molding Method Using the Same)
US5962122A (en) * 1995-11-28 1999-10-05 Hoechst Celanese Corporation Liquid crystalline polymer composites having high dielectric constant
US5739193A (en) * 1996-05-07 1998-04-14 Hoechst Celanese Corp. Polymeric compositions having a temperature-stable dielectric constant
US5767223A (en) * 1996-07-29 1998-06-16 Nippon Petrochemicals Company, Limited Wholly-aromatic thermotropic liquid crystal polyester and sealing material for electric and electronic parts
US6057035A (en) * 1997-06-06 2000-05-02 Triton Systems, Inc. High-temperature polymer/inorganic nanocomposites
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6503964B2 (en) 2000-01-11 2003-01-07 Cool Options, Inc. Polymer composition with metal coated carbon flakes
US6620497B2 (en) 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
US6384128B1 (en) * 2000-07-19 2002-05-07 Toray Industries, Inc. Thermoplastic resin composition, molding material, and molded article thereof
US20050191515A1 (en) * 2000-07-20 2005-09-01 Shipley Company, L.L.C. Very low thermal expansion composite
US20030181560A1 (en) * 2000-08-29 2003-09-25 Akiyoshi Kawaguchi Resin composition, molded object thereof, and use thereof
JP4759122B2 (ja) * 2000-09-12 2011-08-31 ポリマテック株式会社 熱伝導性シート及び熱伝導性グリス
US6543524B2 (en) 2000-11-29 2003-04-08 Cool Options, Inc. Overplated thermally conductive part with EMI shielding
GB2421506B (en) * 2003-05-22 2008-07-09 Zyvex Corp Nanocomposites and methods thereto
EP1544938A1 (en) * 2003-12-19 2005-06-22 Alcatel Multiple cavity filter
EP1544940A1 (en) * 2003-12-19 2005-06-22 Alcatel Tower mounted amplifier filter and manufacturing method thereof
JP4089636B2 (ja) * 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
US8221885B2 (en) * 2004-06-02 2012-07-17 Cool Options, Inc. a corporation of the State of New Hampshire Thermally conductive polymer compositions having low thermal expansion characteristics
JP2006129373A (ja) * 2004-11-01 2006-05-18 Broad Wireless Kk 中継アンテナ装置
JP5260055B2 (ja) * 2004-11-10 2013-08-14 ダウ グローバル テクノロジーズ エルエルシー 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造されたパウダーコーティング
JP2008519888A (ja) * 2004-11-10 2008-06-12 ダウ グローバル テクノロジーズ インコーポレイティド 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂
WO2006052725A1 (en) * 2004-11-10 2006-05-18 Dow Global Technologies Inc. Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom
JP5248860B2 (ja) * 2004-11-10 2013-07-31 ダウ グローバル テクノロジーズ エルエルシー 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板
JP2008519885A (ja) * 2004-11-10 2008-06-12 ダウ グローバル テクノロジーズ インコーポレイティド 両親媒性ブロックコポリマーで変性したエポキシ樹脂及びそれらから製造した接着剤
US8029889B1 (en) * 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7193489B2 (en) * 2004-12-03 2007-03-20 Motorola, Inc. Radio frequency cavity resonator with heat transport apparatus
DE602006021155D1 (de) * 2005-02-03 2011-05-19 Asahi Kasei Chemicals Corp Harzzusammensetzung für elektronische und elektrische bauteile von hochfrequenzanwendungen und geformtes produkt daraus
KR20080044304A (ko) * 2005-08-26 2008-05-20 쿨 옵션스, 인코포레이티드 마이크로전자기기의 다이-레벨 패키지용 열전도성 열가소성물질
US20070080162A1 (en) * 2005-10-11 2007-04-12 Cool Options, Inc. Thermally conductive resin article for food contact and food processing and method for manufacturing same
JP4747918B2 (ja) * 2005-11-04 2011-08-17 東ソー株式会社 ポリアリーレンスルフィド組成物
US20070121648A1 (en) * 2005-11-28 2007-05-31 Philip Hahn Wireless communication system
US8194585B2 (en) * 2005-11-28 2012-06-05 OMNI-WiFi, LLC. Wireless communication system
WO2007076014A2 (en) * 2005-12-23 2007-07-05 World Properties, Inc. Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
WO2008060012A1 (en) 2006-11-13 2008-05-22 Kmw Inc. Radio frequency filter
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
US20080166563A1 (en) * 2007-01-04 2008-07-10 Goodrich Corporation Electrothermal heater made from thermally conducting electrically insulating polymer material
JP2008208316A (ja) * 2007-02-28 2008-09-11 Teijin Ltd 炭素繊維複合材料
ES2377168T3 (es) * 2007-06-12 2012-03-23 Zephyros Inc. Material adhesivo endurecido
KR101546983B1 (ko) * 2007-08-02 2015-08-24 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
JP2009108425A (ja) 2007-10-26 2009-05-21 Teijin Ltd 炭素繊維およびそれを用いた複合材料
US20090142567A1 (en) * 2007-12-03 2009-06-04 E.I. Du Pont De Nemours And Company Thermally conductive aramid-based dielectric substrates for printed circuit boards and integrated circuit chip packaging
KR100956888B1 (ko) * 2008-01-24 2010-05-11 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
KR101637616B1 (ko) 2008-03-20 2016-07-07 디에스엠 아이피 어셋츠 비.브이. 열전도성 플라스틱 물질의 히트싱크
US9018667B2 (en) * 2008-03-25 2015-04-28 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and dual adhesives
US7847658B2 (en) * 2008-06-04 2010-12-07 Alcatel-Lucent Usa Inc. Light-weight low-thermal-expansion polymer foam for radiofrequency filtering applications
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
JP5327024B2 (ja) * 2009-12-03 2013-10-30 三菱エンジニアリングプラスチックス株式会社 放熱部付き二色成形品及び発熱体付き機器
JP5482343B2 (ja) * 2010-03-18 2014-05-07 コニカミノルタ株式会社 難燃性ポリエステル樹脂組成物
FR2969167B1 (fr) * 2010-12-15 2013-01-11 Arkema France Composition thermoplastique modifiee choc amelioree
US20120153217A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Thermally conductive polymeric resin composition
JP2012180497A (ja) * 2011-02-08 2012-09-20 Kaneka Corp 高熱伝導性熱可塑性樹脂組成物
JP2012186384A (ja) * 2011-03-07 2012-09-27 Tdk Corp 電磁ノイズ抑制部材
JP5809349B2 (ja) * 2011-04-14 2015-11-10 エイディエイ テクノロジーズ インコーポレイテッドAda Technologies,Inc. サーマルインターフェースマテリアルならびにそれを含む組成物、システムおよび装置
JP2012238820A (ja) * 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
US20150299457A1 (en) * 2011-12-20 2015-10-22 Dow Global Technologies Llc Epoxy resin composites
US20150223288A1 (en) * 2012-09-28 2015-08-06 Dow Global Technologies Llc Low-density, metal-based components for wireless-communication towers
CN104662184B (zh) * 2012-09-28 2018-03-02 陶氏环球技术有限责任公司 用于无线通信塔的微球体填充的金属组件
US20150236391A1 (en) * 2012-09-28 2015-08-20 Dow Global Technologies Llc Foamed-metal components for wireless-communication towers
KR20150049452A (ko) * 2013-10-30 2015-05-08 한국전자통신연구원 튜닝 볼트 고정 부재를 포함하는 rf 캐비티 필터 및 튜닝 볼트 고정 부재

Also Published As

Publication number Publication date
BR112015014041A2 (pt) 2017-07-11
EP2935464A1 (en) 2015-10-28
CA2894268C (en) 2021-01-05
US20150284618A1 (en) 2015-10-08
US10287473B2 (en) 2019-05-14
WO2014099187A1 (en) 2014-06-26
CN104837931A (zh) 2015-08-12
EP2935464B1 (en) 2017-08-16
KR102137296B1 (ko) 2020-07-23
JP2016513139A (ja) 2016-05-12
BR112015014041B1 (pt) 2021-06-08
KR20150097521A (ko) 2015-08-26
MX361304B (es) 2018-12-03
CA2894268A1 (en) 2014-06-26
CN104837931B (zh) 2017-12-01
JP6377074B2 (ja) 2018-08-22

Similar Documents

Publication Publication Date Title
MX2015008124A (es) Componentes de compuestos polimericos para torres de comunicaciones inalambricas.
EP3035778A4 (en) Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
HK1219289A1 (zh) 用於在夾帶聚合物中形成通道的試劑、含有此種試劑的夾帶聚合物、用於生產此種夾帶聚合物和含有此種夾帶聚合物之產品的方法
GB2578987B (en) Fusible phase-change powders for thermal management, methods of manufacture thereof, and articles containing the powders
TN2016000215A1 (en) Methods and apparatus for provisioning of credentials in network deployments.
MX2017006987A (es) Materiales de interfaz termica de alto rendimiento con baja impedancia termica.
EP2610277A4 (en) RESIN COMPOSITION, MOLDED OBJECT AND SUBSTRATE MATERIAL ALL TWO OBTAINED FROM THE RESIN COMPOSITION, AND CIRCUIT BOARD USING THE SAME
WO2015057654A3 (en) Techniques for enabling asynchronous communications using unlicensed radio frequency spectrum
EP2966106A4 (en) EPOXY RESIN COMPOSITION, CURED PRODUCT, THERMAL RADIATION MATERIAL, AND ELECTRONIC ELEMENT
GB2522580A (en) Cavity resonator system
TWI350716B (en) High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards
SG11201502623YA (en) Thermally conductive polymer and resin compositions for producing same
WO2011016962A3 (en) Thermally insulating polymer foam and aerogel composite article
EP2524428A4 (en) DEVICES AND METHODS FOR TOPOLOGY OF TUNABLE ADAPTATION NETWORK CIRCUIT
EP2957601A4 (en) RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME, AND HIGHLY CONDUCTIVE RESIN MOLDED MOLDED ARTICLE
MX2017016391A (es) Composicion de resina epoxica.
GB201212345D0 (en) Radio frequency voltage temperture stabilization
EP3078710A4 (en) Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same
GB201202863D0 (en) Methods, apparatus and computer programs for device-to-device operator identification
GB201200754D0 (en) Network element,integrated circuit cellular communication system and method for capturing user equipment measurements
EP2380931A4 (en) EXPANSIBLE RESOLVABLE TYPE PHENOLIC RESIN MOLDING MATERIAL, PROCESS FOR PRODUCING THE SAME, AND PHENOLIC RESIN FOAM
MX2014010864A (es) Sistemas y métodos para ejecutar activación sobre-el-aire mientras está en itinerancia.
GEP20186901B (en) Micro-drop-pill-shaped compound and preparation method thereof
EP2940074A4 (en) CARBON-POLYOXYMETHYLENE NANOTUBE RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY AND IMPROVED PROCESSING PROPERTIES, AS WELL AS BETTER HEAT STABILITY, AND MOLDED ARTICLE OBTAINED
EP2995148A4 (en) METHOD, WIRELESS COMMUNICATION STATIONS AND SYSTEM FOR OPERATION IN THE 5 GHZ FREQUENCY BAND

Legal Events

Date Code Title Description
FG Grant or registration