MX2014002485A - Escudo de interferencia electromagnetica. - Google Patents

Escudo de interferencia electromagnetica.

Info

Publication number
MX2014002485A
MX2014002485A MX2014002485A MX2014002485A MX2014002485A MX 2014002485 A MX2014002485 A MX 2014002485A MX 2014002485 A MX2014002485 A MX 2014002485A MX 2014002485 A MX2014002485 A MX 2014002485A MX 2014002485 A MX2014002485 A MX 2014002485A
Authority
MX
Mexico
Prior art keywords
bridge
tangs
circuit board
metal plate
electromagnetic interference
Prior art date
Application number
MX2014002485A
Other languages
English (en)
Spanish (es)
Inventor
Barry L Gaarder
Scott R Kratzer
Davin S Nicholas
Original Assignee
Fisher Controls Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fisher Controls Int filed Critical Fisher Controls Int
Publication of MX2014002485A publication Critical patent/MX2014002485A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B17/00—Screening
    • G12B17/02—Screening from electric or magnetic fields, e.g. radio waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)
  • Waveguide Aerials (AREA)
MX2014002485A 2011-08-29 2012-08-23 Escudo de interferencia electromagnetica. MX2014002485A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/220,138 US8792246B2 (en) 2011-08-29 2011-08-29 Electromagnetic interference shield
PCT/US2012/052003 WO2013032840A1 (fr) 2011-08-29 2012-08-23 Protection vis-à-vis d'interférence électromagnétique

Publications (1)

Publication Number Publication Date
MX2014002485A true MX2014002485A (es) 2014-05-30

Family

ID=46832613

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014002485A MX2014002485A (es) 2011-08-29 2012-08-23 Escudo de interferencia electromagnetica.

Country Status (10)

Country Link
US (2) US8792246B2 (fr)
EP (1) EP2752105B1 (fr)
JP (1) JP6134318B2 (fr)
CN (1) CN103782671B (fr)
AR (1) AR087704A1 (fr)
BR (1) BR112014004563A2 (fr)
CA (1) CA2844698C (fr)
MX (1) MX2014002485A (fr)
RU (1) RU2605461C2 (fr)
WO (1) WO2013032840A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2952740B1 (fr) * 2009-11-16 2011-12-09 Oberthur Technologies Dispositif electronique sans contact, procede de fabrication du dispositif et etiquette electronique sans contact
KR101362398B1 (ko) * 2012-07-10 2014-02-13 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US20140286009A1 (en) * 2013-03-22 2014-09-25 Billboard Video, Inc. Modular solid state electronic display panels with electromagnetic radiation shielding
US9521741B1 (en) * 2014-06-04 2016-12-13 Amazon Technologies, Inc. Side surface mounting of shields for a circuit board assembly
US10061363B2 (en) * 2015-09-04 2018-08-28 Apple Inc. Combination parallel path heatsink and EMI shield
DE102015122000B4 (de) * 2015-12-16 2019-02-07 Fujitsu Client Computing Limited Anordnung und elektronisches Gerät
US9647366B1 (en) 2016-04-12 2017-05-09 Microsoft Technology Licensing, Llc Connector shielding in an electronic device
US10645797B2 (en) * 2017-07-26 2020-05-05 Intel Corporation Electromagnetic interference (EMI) shield for a printed circuit board (PCB)
CN107567274B (zh) * 2017-11-03 2020-03-31 成都芯通科技股份有限公司 Pcb信号单元屏蔽接地装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
JPH10335873A (ja) * 1997-05-28 1998-12-18 Kyocera Corp 高周波回路部品
JP3056498U (ja) * 1998-08-06 1999-02-16 船井電機株式会社 シールド付きユニット
US6239359B1 (en) * 1999-05-11 2001-05-29 Lucent Technologies, Inc. Circuit board RF shielding
JP2001148594A (ja) * 1999-11-19 2001-05-29 Murata Mfg Co Ltd シールドケース付き電子部品
US6552261B2 (en) * 2001-04-27 2003-04-22 Bmi, Inc. Push-fit shield
DE10260447A1 (de) * 2002-01-08 2003-08-21 Mitsumi Electric Co Ltd Abschirmkasten für einen elektronischen Apparat
DE10231145A1 (de) * 2002-07-10 2004-01-29 Siemens Ag Abschirmeinrichtung für elektronische Baugruppen auf einer Leiterplatte
US6872880B2 (en) * 2003-06-17 2005-03-29 Delphi Technologies, Inc. Two-piece solderless EMC/EMI shield
CN100508714C (zh) * 2004-09-27 2009-07-01 株式会社村田制作所 屏蔽罩
US20070139904A1 (en) * 2005-12-16 2007-06-21 English Gerald R Low-profile assemblies for providing board level EMI shielding for electrical components on opposite sides of printed circuit boards
US20080043453A1 (en) * 2006-08-18 2008-02-21 Chin-Fu Horng Electromagnetic-shielding device
TWM324049U (en) * 2007-05-21 2007-12-21 Universal Scient Ind Co Ltd Packaging structure of wireless communication module
JP2010192759A (ja) * 2009-02-19 2010-09-02 Sanyo Electric Co Ltd 電子機器用筐体の電磁シールド構造
CN101883481A (zh) * 2009-05-04 2010-11-10 鸿富锦精密工业（深圳）有限公司 卡勾及使用该卡勾的卡合结构

Also Published As

Publication number Publication date
AR087704A1 (es) 2014-04-09
US8792246B2 (en) 2014-07-29
RU2014109554A (ru) 2015-10-10
CN103782671A (zh) 2014-05-07
RU2605461C2 (ru) 2016-12-20
WO2013032840A1 (fr) 2013-03-07
JP6134318B2 (ja) 2017-05-24
CA2844698C (fr) 2019-10-29
EP2752105A1 (fr) 2014-07-09
CN103782671B (zh) 2017-05-10
US20140231128A1 (en) 2014-08-21
US9192082B2 (en) 2015-11-17
US20130050962A1 (en) 2013-02-28
CA2844698A1 (fr) 2013-03-07
JP2014525688A (ja) 2014-09-29
BR112014004563A2 (pt) 2017-04-04
EP2752105B1 (fr) 2019-10-23

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