MX2009012902A - Modulo de memoria electrico. - Google Patents

Modulo de memoria electrico.

Info

Publication number
MX2009012902A
MX2009012902A MX2009012902A MX2009012902A MX2009012902A MX 2009012902 A MX2009012902 A MX 2009012902A MX 2009012902 A MX2009012902 A MX 2009012902A MX 2009012902 A MX2009012902 A MX 2009012902A MX 2009012902 A MX2009012902 A MX 2009012902A
Authority
MX
Mexico
Prior art keywords
memory module
cooling bodies
electric memory
cooling body
electric
Prior art date
Application number
MX2009012902A
Other languages
English (en)
Inventor
Karsten Rechenberg
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of MX2009012902A publication Critical patent/MX2009012902A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78—Cases; Housings; Encapsulations; Mountings
    • H01G11/82—Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Abstract

La presente invención hace referencia, entre otras cosas, a un módulo de memoria eléctrico (100) con, al menos, dos condensadores (20, 30, 40) que se encuentran conectados entre sí a través de un dispositivo de conexión electroconductor (50, 60), con lo que el módulo de memoria presenta un aislamiento eléctrico que aísla eléctricamente al módulo de memoria, y con lo que el módulo de memoria presenta un cuerpo refrigerante. Conforme a la invención se encuentra previsto, que el cuerpo refrigerante (110, 120) forme el dispositivo de conexión y que el aislamiento eléctrico (150) se encuentre colocado sobre el lado exterior de este cuerpo refrigerante (110, 120).
MX2009012902A 2007-06-28 2008-06-24 Modulo de memoria electrico. MX2009012902A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007029851A DE102007029851A1 (de) 2007-06-28 2007-06-28 Elektrisches Speichermodul
PCT/EP2008/058017 WO2009000833A2 (de) 2007-06-28 2008-06-24 Elektrisches speichermodul mit kühlkörpern

Publications (1)

Publication Number Publication Date
MX2009012902A true MX2009012902A (es) 2010-01-14

Family

ID=40075931

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2009012902A MX2009012902A (es) 2007-06-28 2008-06-24 Modulo de memoria electrico.

Country Status (15)

Country Link
US (1) US20100134983A1 (es)
EP (1) EP2165343B1 (es)
JP (1) JP2010531545A (es)
KR (1) KR20100029776A (es)
CN (1) CN101689425A (es)
AT (1) ATE487223T1 (es)
AU (1) AU2008267217A1 (es)
BR (1) BRPI0812928A2 (es)
CA (1) CA2692969A1 (es)
DE (2) DE102007029851A1 (es)
ES (1) ES2354646T3 (es)
IL (1) IL202531A0 (es)
MX (1) MX2009012902A (es)
RU (1) RU2010102782A (es)
WO (1) WO2009000833A2 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010018498B4 (de) 2010-04-22 2021-08-19 Andreas Obrebski Optische Anordnung und optische Vorrichtung oder Gerät
DE102011007315A1 (de) * 2011-04-13 2012-10-18 Robert Bosch Gmbh Speichereinheit zum Speichern elektrischer Energie mit einem Kühlelement
TW201403295A (zh) * 2012-07-11 2014-01-16 Foxconn Tech Co Ltd 電子裝置
US9048124B2 (en) * 2012-09-20 2015-06-02 Apple Inc. Heat sinking and electromagnetic shielding structures
KR102280477B1 (ko) * 2015-10-08 2021-07-22 삼성전자주식회사 히트 싱크 및 이를 갖는 메모리 모듈
US10636725B2 (en) * 2017-12-19 2020-04-28 Veoneer Us Inc. Electrical module cooling through waste heat recovery
US10765042B1 (en) * 2019-02-22 2020-09-01 Ford Global Technologies, Llc Integrated power module and capacitor module thermal and packaging design

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187812A (en) * 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry
DE2511010A1 (de) * 1975-03-13 1976-09-23 Bosch Gmbh Robert Elektrisches bauelement mit kuehlkoerper
US5214564A (en) * 1992-04-23 1993-05-25 Sunstrand Corporation Capacitor assembly with integral cooling apparatus
US7016177B1 (en) * 2003-11-07 2006-03-21 Maxwell Technologies, Inc. Capacitor heat protection
US7203056B2 (en) * 2003-11-07 2007-04-10 Maxwell Technologies, Inc. Thermal interconnection for capacitor systems
US7027290B1 (en) * 2003-11-07 2006-04-11 Maxwell Technologies, Inc. Capacitor heat reduction apparatus and method
US7180726B2 (en) * 2003-11-07 2007-02-20 Maxwell Technologies, Inc. Self-supporting capacitor structure
FR2863400B1 (fr) * 2003-12-03 2006-03-24 Electricite De France Systeme a supercondensateurs et procede d'assemblage d'un tel systeme
DE102004063986A1 (de) * 2004-11-05 2006-07-27 Siemens Ag Schienenfahrzeug mit einem Energiespeicher aus Doppelschichtkondensatoren

Also Published As

Publication number Publication date
EP2165343A2 (de) 2010-03-24
WO2009000833A3 (de) 2009-04-02
ATE487223T1 (de) 2010-11-15
WO2009000833A2 (de) 2008-12-31
DE102007029851A1 (de) 2009-01-02
CN101689425A (zh) 2010-03-31
DE502008001734D1 (de) 2010-12-16
KR20100029776A (ko) 2010-03-17
AU2008267217A1 (en) 2008-12-31
IL202531A0 (en) 2010-06-30
CA2692969A1 (en) 2008-12-31
JP2010531545A (ja) 2010-09-24
BRPI0812928A2 (pt) 2014-12-09
EP2165343B1 (de) 2010-11-03
US20100134983A1 (en) 2010-06-03
ES2354646T3 (es) 2011-03-16
RU2010102782A (ru) 2011-08-10

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