MX171142B - Dispositivo enfriador de tipo de transferencia de calor de ebullicion y condensacion para elementos de conmutacion y semiconductores de energia - Google Patents

Dispositivo enfriador de tipo de transferencia de calor de ebullicion y condensacion para elementos de conmutacion y semiconductores de energia

Info

Publication number
MX171142B
MX171142B MX023045A MX2304590A MX171142B MX 171142 B MX171142 B MX 171142B MX 023045 A MX023045 A MX 023045A MX 2304590 A MX2304590 A MX 2304590A MX 171142 B MX171142 B MX 171142B
Authority
MX
Mexico
Prior art keywords
evaporator
condenser
cooling medium
boiling
cooling device
Prior art date
Application number
MX023045A
Other languages
English (en)
Inventor
Kenichi Mori
Masahiro Ashiya
Takeshi Kameda
Nobuyoshi Takahashi
Takeo Yoshioka
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18960290A external-priority patent/JPH0428983A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of MX171142B publication Critical patent/MX171142B/es

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

La presente invención se refiere a un dispositivo enfriador del tipo de ebullición que comprende un evaporador que contiene medio refrigerante que comprende agua y un líquido anticongelante para descender la temperatura de congelación del medio refrigerante, evaporador que está en contacto térmico con el cuerpo que va a ser enfraado de tal manera que, debido al calor transmitido del cuerpo enfriado, el medio refrigerante hierve para generar vapor del mismo, un condensador para condensar el vapor del medio refrigerante generado en el evaporador un tubo de vapor que conecta y comunica el evaporador con el condensador para transferir del condensador el vapor del medio refrigrante generado en el evaporador y un tubo para el regreso del líquido que conecta y comunica una porción de fondo más inferior del condensador a una porción del evaporador elegido del grupo que consiste de un fondo y una proximidad al fondo del evaporador, para transferir el medio refrigerante condensado en el condensador del evaporador, estando al fondo más inferior del condensador a un nivel no inferior que un nivel de la superficie superior del medio refrigerante en el evaporador, en donde una superficie del fondo del condensador está inclinada hacia abajo hacia la porción de fondo más inferior del mismo.
MX023045A 1989-10-26 1990-10-26 Dispositivo enfriador de tipo de transferencia de calor de ebullicion y condensacion para elementos de conmutacion y semiconductores de energia MX171142B (es)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP12457089 1989-10-26
JP12656589 1989-10-31
JP2443890 1990-02-05
JP5683690 1990-03-07
JP10601190 1990-04-20
JP18960290A JPH0428983A (ja) 1989-10-26 1990-07-19 沸騰冷却装置

Publications (1)

Publication Number Publication Date
MX171142B true MX171142B (es) 1993-10-04

Family

ID=27549170

Family Applications (1)

Application Number Title Priority Date Filing Date
MX023045A MX171142B (es) 1989-10-26 1990-10-26 Dispositivo enfriador de tipo de transferencia de calor de ebullicion y condensacion para elementos de conmutacion y semiconductores de energia

Country Status (5)

Country Link
US (1) US5195577A (es)
EP (1) EP0429188A3 (es)
KR (1) KR910008358A (es)
AU (1) AU617957B2 (es)
MX (1) MX171142B (es)

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DE19758444C2 (de) * 1997-04-04 1999-12-09 Gruendl & Hoffmann Fluidgekühlte, Rechnereinheit - gesteuerte Baugruppe zum Schalten elektrischer Leistungen
US6050333A (en) * 1997-11-10 2000-04-18 Albaroudi; Homam M. Rotary heat exchange apparatus for condensing vapor
US6515383B1 (en) 2000-11-06 2003-02-04 Satcon Technology Corporation Passive, phase-change, stator winding end-turn cooled electric machine
JP2002168547A (ja) * 2000-11-20 2002-06-14 Global Cooling Bv 熱サイホンによるｃｐｕ冷却装置
JP2004028516A (ja) * 2002-06-28 2004-01-29 Sanyo Electric Co Ltd 保存装置
US7836706B2 (en) * 2002-09-27 2010-11-23 Parker Intangibles Llc Thermal management system for evaporative spray cooling
JP4214881B2 (ja) * 2003-01-21 2009-01-28 三菱電機株式会社 気泡ポンプ型熱輸送機器
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7677299B2 (en) * 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
CN100489433C (zh) * 2004-12-17 2009-05-20 尹学军 自然冷能的热管装置及其应用
US20060207752A1 (en) * 2005-03-15 2006-09-21 Inventec Corporation Micro liquid cooling device
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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GB0706196D0 (en) * 2007-03-29 2007-05-09 E2V Tech Uk Ltd Sealed and cooled enclosure with coltage isolation
US20080283221A1 (en) * 2007-05-15 2008-11-20 Christian Blicher Terp Direct Air Contact Liquid Cooling System Heat Exchanger Assembly
JP4661839B2 (ja) * 2007-07-31 2011-03-30 株式会社デンソー 排気熱回収器
DE102008020328B4 (de) * 2008-04-23 2010-07-29 Continental Automotive Gmbh Wärmeabfuhrsystem, elektronische Schaltung mit dem Wärmeabfuhrsystem und Verfahren zur Wärmeabfuhr
EP2119994A1 (en) * 2008-05-14 2009-11-18 Abb Research Ltd. Evaporator for a cooling circuit
EP2119993A1 (en) * 2008-05-14 2009-11-18 ABB Research Ltd. Two-phase cooling circuit
EP2282624B1 (en) 2009-08-05 2012-04-18 ABB Research Ltd. Evaporator and cooling circuit
US20110127254A1 (en) * 2009-11-30 2011-06-02 Cypress Technology Llc Electric Heating Systems and Associated Methods
WO2011149487A2 (en) 2010-05-27 2011-12-01 Johnson Controls Technology Company Thermosyphon coolers for cooling systems with cooling towers
JP5079175B1 (ja) * 2011-10-06 2012-11-21 三菱電機株式会社 電力変換装置
KR20130095421A (ko) * 2012-02-20 2013-08-28 삼성전자주식회사 전구물질 기화 장치 및 이를 이용한 막 형성 방법
CN105806111B (zh) * 2014-12-31 2018-01-05 亚申科技研发中心（上海）有限公司 一种基于超热导原理的换热系统
JP7011938B2 (ja) 2017-12-28 2022-01-27 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
DE102018211666A1 (de) * 2018-07-12 2020-01-16 Mahle International Gmbh Kühlanordnung
JP2020029967A (ja) * 2018-08-21 2020-02-27 セイコーエプソン株式会社 冷却装置及びプロジェクター
JP7299017B2 (ja) * 2018-12-27 2023-06-27 川崎重工業株式会社 ループ型ヒートパイプ及び輸送機
US11516948B2 (en) * 2019-04-02 2022-11-29 Eaton Intelligent Power Limited Immersion cooling systems and methods for electrical power components
US20220232734A1 (en) * 2021-01-15 2022-07-21 Microsoft Technology Licensing, Llc Systems and methods for immersion cooling with an air-cooled condenser
CN112885497A (zh) * 2021-01-22 2021-06-01 散裂中子源科学中心 热负载斩波器水冷降温系统

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Also Published As

Publication number Publication date
EP0429188A3 (en) 1991-11-06
EP0429188A2 (en) 1991-05-29
KR910008358A (ko) 1991-05-31
AU617957B2 (en) 1991-12-05
US5195577A (en) 1993-03-23
AU6495290A (en) 1991-05-02

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