MX166697B - Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes de la electrodeposicion de metal - Google Patents

Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes de la electrodeposicion de metal

Info

Publication number
MX166697B
MX166697B MX012788A MX1278888A MX166697B MX 166697 B MX166697 B MX 166697B MX 012788 A MX012788 A MX 012788A MX 1278888 A MX1278888 A MX 1278888A MX 166697 B MX166697 B MX 166697B
Authority
MX
Mexico
Prior art keywords
composition
conditioning
procedure
polycarbonate resins
metal electrical
Prior art date
Application number
MX012788A
Other languages
English (en)
Inventor
Edwin W Bastenbeck
Juan Haydu
Richard A Bellemare Jr
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of MX166697B publication Critical patent/MX166697B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Materials For Medical Uses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La presente invención se refiere a un procedimiento para tratar una resina de policarbonato, antes del ataque químico, para mejorar el cubrimiento y adhesividad de chapado de metal a la resina grabada, que comprende: 1) poner en contacto la resina, durante un tiempo efectivo y una temperatura efectiva, con una composición dilatadora que comprende: un compuesto representado por la fórmula general: R1 (OCn H2n)m 0 - R2 en donde R1 y R2 se seleccionan independientemente a partir del grupo que consiste en grupos arilo y grupos alquilo de 1-4 átomos de carbono, n es 2 a 4 y m es 1 a 5, en una cantidad en volumen mayor de aproximadamente 10 por ciento.
MX012788A 1987-11-09 1988-08-23 Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes de la electrodeposicion de metal MX166697B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/118,811 US4775557A (en) 1987-11-09 1987-11-09 Composition and process for conditioning the surface of polycarbonate resins prior to metal plating

Publications (1)

Publication Number Publication Date
MX166697B true MX166697B (es) 1993-01-28

Family

ID=22380887

Family Applications (1)

Application Number Title Priority Date Filing Date
MX012788A MX166697B (es) 1987-11-09 1988-08-23 Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes de la electrodeposicion de metal

Country Status (13)

Country Link
US (1) US4775557A (es)
EP (1) EP0316061B1 (es)
JP (1) JPH01142085A (es)
KR (1) KR960003735B1 (es)
AT (1) ATE82776T1 (es)
AU (1) AU609506B2 (es)
BR (1) BR8804411A (es)
CA (1) CA1306409C (es)
DE (1) DE3876215T2 (es)
DK (1) DK443488A (es)
ES (1) ES2008638A6 (es)
IL (1) IL87392A (es)
MX (1) MX166697B (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3740369A1 (de) * 1987-11-25 1989-06-08 Schering Ag Verfahren zur vorbehandlung von kunststoffen
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US4921736A (en) * 1988-10-12 1990-05-01 Occidental Chemical Corporation Low friction, wear resistant plastic parts
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US4941940A (en) * 1988-11-07 1990-07-17 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5049230A (en) * 1988-11-07 1991-09-17 Jp Laboratories, Inc. Single step pre-swelling and etching of plastics for plating
DE3922477A1 (de) * 1989-07-06 1991-01-17 Schering Ag Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung
US4978569A (en) * 1989-08-14 1990-12-18 Eastman Kodak Company Process for preparing selectively metallized articles
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5132191A (en) * 1990-10-26 1992-07-21 General Electric Company Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5180639A (en) * 1990-10-26 1993-01-19 General Electric Company Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5198096A (en) * 1990-11-28 1993-03-30 General Electric Company Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
DE4108461C1 (es) * 1991-03-13 1992-06-25 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5498440A (en) * 1992-01-21 1996-03-12 General Electric Company Adhesion of electroless coating to resinous articles
US5229169A (en) * 1992-01-21 1993-07-20 General Electric Company Adhesion of electroless coatings to resinous articles by treatment with permanganate
DE4221948C1 (de) * 1992-07-02 1993-10-21 Schering Ag Verfahren zur Metallisierung von Kunststoffen und Verwendung
DE4326079A1 (de) * 1993-07-30 1995-02-02 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung
US5332465A (en) * 1993-09-08 1994-07-26 Macdermid, Incorporated Process for preparing plastic surfaces to be plated
US5336370A (en) * 1993-12-09 1994-08-09 Chipalkatti Makarand H Pre-treatment for plating technique
US5985040A (en) * 1998-09-21 1999-11-16 Electrochemicals Inc. Permanganate desmear process for printed wiring boards
KR100336297B1 (ko) * 1999-05-17 2002-05-13 남상진 페수처리시스템
US6454868B1 (en) 2000-04-17 2002-09-24 Electrochemicals Inc. Permanganate desmear process for printed wiring boards
US7354870B2 (en) 2005-11-14 2008-04-08 National Research Council Of Canada Process for chemical etching of parts fabricated by stereolithography
JP5482343B2 (ja) * 2010-03-18 2014-05-07 コニカミノルタ株式会社 難燃性ポリエステル樹脂組成物
KR101628806B1 (ko) * 2014-05-16 2016-06-09 주식회사 아모센스 발광소자 패키지의 제조방법
KR102428185B1 (ko) 2016-05-04 2022-08-01 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판의 표면 상에 대한 금속 또는 금속 합금의 활성화를 포함하는 이의 전착 방법

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FR2037988A5 (en) * 1969-03-13 1970-12-31 Ampex Surface treatment of hydro-phobic plastics - surfaces to make them hydrophilic and plat
US3770528A (en) * 1971-09-29 1973-11-06 Martin Processing Co Inc Method for the surface treatment of polyimide materials
FR2223438A1 (fr) * 1973-03-28 1974-10-25 Air Ind Compositions de denaturation des peintures, notamment pour le nettoyage des cabines de peinture
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
AT367081B (de) * 1977-09-19 1982-05-25 Semperit Ag Elastomerkoerper
US4131698A (en) * 1977-12-16 1978-12-26 Rca Corporation Pretreatment of polyvinyl chloride plastics for electroless deposition
JPS575855A (en) * 1980-06-12 1982-01-12 Kakihara Kogyo Kk Formation of metal film onto electric unconductive resin
FR2565699A1 (fr) * 1984-06-11 1985-12-13 Suwa Seikosha Kk Procede de modification de la surface d'une matiere de base comprenant des motifs carbonate et ester d'allyle, pour former ensuite un revetement superficiel dur, dans le cas de lentilles pour verres ophtalmiques
DE3582234D1 (de) * 1985-01-08 1991-04-25 Toray Industries Metallplattierter formgegenstand.
JPS61252691A (ja) * 1985-05-02 1986-11-10 キヤノン株式会社 プリント配線板の製造方法
EP0309243B1 (en) * 1987-09-25 1993-08-18 Engelhard Technologies Limited Pre-etch treatment of a plastics substrate

Also Published As

Publication number Publication date
DK443488D0 (da) 1988-08-08
ES2008638A6 (es) 1989-07-16
IL87392A (en) 1991-11-21
US4775557A (en) 1988-10-04
ATE82776T1 (de) 1992-12-15
KR960003735B1 (ko) 1996-03-21
JPH01142085A (ja) 1989-06-02
IL87392A0 (en) 1989-01-31
EP0316061A1 (en) 1989-05-17
AU609506B2 (en) 1991-05-02
DK443488A (da) 1989-05-10
DE3876215D1 (de) 1993-01-07
EP0316061B1 (en) 1992-11-25
KR890008345A (ko) 1989-07-10
AU2066688A (en) 1989-05-11
DE3876215T2 (de) 1993-04-15
BR8804411A (pt) 1989-05-23
CA1306409C (en) 1992-08-18

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