MX163728B - Empaque para semiconductores de aleacion de aluminio y procedimientom para su emsamble - Google Patents

Empaque para semiconductores de aleacion de aluminio y procedimientom para su emsamble

Info

Publication number
MX163728B
MX163728B MX17647A MX1764789A MX163728B MX 163728 B MX163728 B MX 163728B MX 17647 A MX17647 A MX 17647A MX 1764789 A MX1764789 A MX 1764789A MX 163728 B MX163728 B MX 163728B
Authority
MX
Mexico
Prior art keywords
packaging
procedures
assembly
aluminum alloy
alloy semiconductors
Prior art date
Application number
MX17647A
Other languages
English (en)
Spanish (es)
Inventor
Deepak Mahulikar
James Malcolm Popplewell
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX163728B publication Critical patent/MX163728B/es

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
MX17647A 1988-10-05 1989-09-22 Empaque para semiconductores de aleacion de aluminio y procedimientom para su emsamble MX163728B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/253,639 US4939316A (en) 1988-10-05 1988-10-05 Aluminum alloy semiconductor packages

Publications (1)

Publication Number Publication Date
MX163728B true MX163728B (es) 1992-06-17

Family

ID=22961101

Family Applications (1)

Application Number Title Priority Date Filing Date
MX17647A MX163728B (es) 1988-10-05 1989-09-22 Empaque para semiconductores de aleacion de aluminio y procedimientom para su emsamble

Country Status (11)

Country Link
US (1) US4939316A (show.php)
EP (2) EP0438444B1 (show.php)
JP (2) JP3016227B2 (show.php)
KR (1) KR0154111B1 (show.php)
AU (1) AU629864B2 (show.php)
CA (1) CA1296815C (show.php)
DE (2) DE68927296T2 (show.php)
HK (1) HK1008114A1 (show.php)
MX (1) MX163728B (show.php)
PH (1) PH25542A (show.php)
WO (1) WO1990004262A1 (show.php)

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DE102008004642A1 (de) * 2008-01-16 2009-07-23 Robert Bosch Gmbh Kondensationsfalle für feuchtigkeitsempfindliche Geräte
CN101578018B (zh) * 2008-05-09 2012-07-25 富准精密工业(深圳)有限公司 金属与塑料的结合件及其制造方法
EP2461378B1 (en) * 2009-07-30 2018-03-21 Nichia Corporation Light emitting device and method for manufacturing same
KR101064084B1 (ko) 2010-03-25 2011-09-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR101095202B1 (ko) * 2010-06-15 2011-12-16 삼성전기주식회사 하이브리드형 방열기판 및 그 제조방법
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Also Published As

Publication number Publication date
KR0154111B1 (ko) 1998-10-15
CA1296815C (en) 1992-03-03
JP3168196B2 (ja) 2001-05-21
JP2000068395A (ja) 2000-03-03
WO1990004262A1 (en) 1990-04-19
AU4337389A (en) 1990-05-01
US4939316A (en) 1990-07-03
EP0438444B1 (en) 1996-10-02
DE68927296T2 (de) 1997-04-30
EP0438444A4 (en) 1992-07-22
JP3016227B2 (ja) 2000-03-06
EP0700083A3 (show.php) 1996-04-10
JPH04505075A (ja) 1992-09-03
HK1014611A1 (en) 1999-09-30
DE68929103T2 (de) 2000-06-29
DE68927296D1 (de) 1996-11-07
EP0700083B1 (en) 1999-11-24
DE68929103D1 (de) 1999-12-30
EP0700083A2 (en) 1996-03-06
EP0438444A1 (en) 1991-07-31
PH25542A (en) 1991-07-24
AU629864B2 (en) 1992-10-15
HK1008114A1 (en) 1999-04-30
KR900702565A (ko) 1990-12-07

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