MX159938A - Mejoras al sistema de introduccion y canalizacion de gas en un aparato de deposicion por descarga incandescente - Google Patents
Mejoras al sistema de introduccion y canalizacion de gas en un aparato de deposicion por descarga incandescenteInfo
- Publication number
- MX159938A MX159938A MX200650A MX20065084A MX159938A MX 159938 A MX159938 A MX 159938A MX 200650 A MX200650 A MX 200650A MX 20065084 A MX20065084 A MX 20065084A MX 159938 A MX159938 A MX 159938A
- Authority
- MX
- Mexico
- Prior art keywords
- gas introduction
- deposition device
- channeling system
- incandescent discharge
- incandescent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/475,289 US4479455A (en) | 1983-03-14 | 1983-03-14 | Process gas introduction and channeling system to produce a profiled semiconductor layer |
Publications (1)
Publication Number | Publication Date |
---|---|
MX159938A true MX159938A (es) | 1989-10-06 |
Family
ID=23886948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX200650A MX159938A (es) | 1983-03-14 | 1984-03-13 | Mejoras al sistema de introduccion y canalizacion de gas en un aparato de deposicion por descarga incandescente |
Country Status (6)
Country | Link |
---|---|
US (1) | US4479455A (es) |
EP (1) | EP0119103A3 (es) |
JP (1) | JPH0824107B2 (es) |
KR (1) | KR920003309B1 (es) |
CA (1) | CA1206244A (es) |
MX (1) | MX159938A (es) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3429899A1 (de) * | 1983-08-16 | 1985-03-07 | Canon K.K., Tokio/Tokyo | Verfahren zur bildung eines abscheidungsfilms |
JPS617624A (ja) * | 1984-06-22 | 1986-01-14 | Fuji Xerox Co Ltd | 密着型イメージセンサ |
US4678679A (en) * | 1984-06-25 | 1987-07-07 | Energy Conversion Devices, Inc. | Continuous deposition of activated process gases |
US4608943A (en) * | 1984-10-24 | 1986-09-02 | Sovonics Solar Systems | Cathode assembly with localized profiling capabilities |
JPH0722127B2 (ja) * | 1985-02-20 | 1995-03-08 | 株式会社日立製作所 | 反応・処理装置内の清浄化および反応・処理用気相物質の純化方法、および反応・処理装置 |
US4626447A (en) * | 1985-03-18 | 1986-12-02 | Energy Conversion Devices, Inc. | Plasma confining apparatus |
US4816324A (en) * | 1986-05-14 | 1989-03-28 | Atlantic Richfield Company | Flexible photovoltaic device |
JPH0423429A (ja) * | 1990-05-18 | 1992-01-27 | Mitsubishi Electric Corp | 半導体装置のプラズマ処理装置及びプラズマ処理方法 |
US5180434A (en) * | 1991-03-11 | 1993-01-19 | United Solar Systems Corporation | Interfacial plasma bars for photovoltaic deposition apparatus |
US6066826A (en) * | 1998-03-16 | 2000-05-23 | Yializis; Angelo | Apparatus for plasma treatment of moving webs |
JP4316767B2 (ja) | 2000-03-22 | 2009-08-19 | 株式会社半導体エネルギー研究所 | 基板処理装置 |
JP4439665B2 (ja) | 2000-03-29 | 2010-03-24 | 株式会社半導体エネルギー研究所 | プラズマcvd装置 |
US20060278163A1 (en) * | 2002-08-27 | 2006-12-14 | Ovshinsky Stanford R | High throughput deposition apparatus with magnetic support |
EP1810344A2 (en) * | 2004-11-10 | 2007-07-25 | Daystar Technologies, Inc. | Pallet based system for forming thin-film solar cells |
US20060096536A1 (en) * | 2004-11-10 | 2006-05-11 | Daystar Technologies, Inc. | Pressure control system in a photovoltaic substrate deposition apparatus |
US9252318B2 (en) * | 2008-03-05 | 2016-02-02 | Hanergy Hi-Tech Power (Hk) Limited | Solution containment during buffer layer deposition |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3441454A (en) * | 1965-10-29 | 1969-04-29 | Westinghouse Electric Corp | Method of fabricating a semiconductor by diffusion |
GB1282866A (en) * | 1968-08-16 | 1972-07-26 | Pilkington Brothers Ltd | Improvements in or relating to the production of glass having desired surface characteristics |
GB1282322A (en) * | 1968-08-29 | 1972-07-19 | Texas Instruments Inc | Continuous deposition system |
US3660179A (en) * | 1970-08-17 | 1972-05-02 | Westinghouse Electric Corp | Gaseous diffusion technique |
JPS4834798A (es) * | 1971-09-06 | 1973-05-22 | ||
JPS53105366A (en) * | 1977-02-25 | 1978-09-13 | Hitachi Ltd | Manufacture for semiconductor element substrate |
JPS53106392A (en) * | 1977-02-28 | 1978-09-16 | Nissan Motor Co Ltd | Chemical plating method in gas phase |
JPS5437077A (en) * | 1977-08-02 | 1979-03-19 | Agency Of Ind Science & Technol | Chemical evaporation method and apparatus for same |
JPS60431B2 (ja) * | 1979-06-27 | 1985-01-08 | キヤノン株式会社 | 膜形成法 |
US4400409A (en) * | 1980-05-19 | 1983-08-23 | Energy Conversion Devices, Inc. | Method of making p-doped silicon films |
JPS5927611B2 (ja) * | 1981-08-08 | 1984-07-06 | 富士通株式会社 | 気相成長方法 |
-
1983
- 1983-03-14 US US06/475,289 patent/US4479455A/en not_active Expired - Lifetime
-
1984
- 1984-03-13 MX MX200650A patent/MX159938A/es unknown
- 1984-03-13 JP JP59048009A patent/JPH0824107B2/ja not_active Expired - Lifetime
- 1984-03-13 CA CA000449486A patent/CA1206244A/en not_active Expired
- 1984-03-14 EP EP84301749A patent/EP0119103A3/en not_active Withdrawn
- 1984-03-14 KR KR1019840001289A patent/KR920003309B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920003309B1 (ko) | 1992-04-27 |
JPH0824107B2 (ja) | 1996-03-06 |
EP0119103A3 (en) | 1986-06-18 |
KR840008211A (ko) | 1984-12-13 |
EP0119103A2 (en) | 1984-09-19 |
US4479455A (en) | 1984-10-30 |
JPS59177922A (ja) | 1984-10-08 |
CA1206244A (en) | 1986-06-17 |
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