MX146110A - IMPROVEMENTS IN BATH TO PRODUCE A SILVER COPPER AND GOLD ELECTROPLATE ON METALLIC SUBSTRATES - Google Patents

IMPROVEMENTS IN BATH TO PRODUCE A SILVER COPPER AND GOLD ELECTROPLATE ON METALLIC SUBSTRATES

Info

Publication number
MX146110A
MX146110A MX157698A MX15769875A MX146110A MX 146110 A MX146110 A MX 146110A MX 157698 A MX157698 A MX 157698A MX 15769875 A MX15769875 A MX 15769875A MX 146110 A MX146110 A MX 146110A
Authority
MX
Mexico
Prior art keywords
bath
produce
metallic substrates
silver copper
gold electroplate
Prior art date
Application number
MX157698A
Other languages
Spanish (es)
Inventor
Kenneth D Baker
Original Assignee
Engelhard Min & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Min & Chem filed Critical Engelhard Min & Chem
Publication of MX146110A publication Critical patent/MX146110A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
MX157698A 1974-04-26 1975-04-09 IMPROVEMENTS IN BATH TO PRODUCE A SILVER COPPER AND GOLD ELECTROPLATE ON METALLIC SUBSTRATES MX146110A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US464666A US3917885A (en) 1974-04-26 1974-04-26 Electroless gold plating process

Publications (1)

Publication Number Publication Date
MX146110A true MX146110A (en) 1982-05-18

Family

ID=23844812

Family Applications (1)

Application Number Title Priority Date Filing Date
MX157698A MX146110A (en) 1974-04-26 1975-04-09 IMPROVEMENTS IN BATH TO PRODUCE A SILVER COPPER AND GOLD ELECTROPLATE ON METALLIC SUBSTRATES

Country Status (10)

Country Link
US (1) US3917885A (en)
JP (1) JPS5818430B2 (en)
BR (1) BR7502540A (en)
CA (1) CA1038559A (en)
DD (1) DD117488A5 (en)
DE (1) DE2518559A1 (en)
FR (1) FR2268595B1 (en)
GB (1) GB1448659A (en)
IT (1) IT1035454B (en)
MX (1) MX146110A (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082908A (en) * 1976-05-05 1978-04-04 Burr-Brown Research Corporation Gold plating process and product produced thereby
DE2747562A1 (en) * 1977-10-20 1979-05-03 Schering Ag PROCESS AND PLANT FOR THE RECOVERY OF METALS AND OTHER RECYCLING SUBSTANCES IN WASTE WATER FROM CHEMICAL SURFACE TREATMENT PLANTS
US4162337A (en) * 1977-11-14 1979-07-24 Bell Telephone Laboratories, Incorporated Process for fabricating III-V semiconducting devices with electroless gold plating
FR2441666A1 (en) * 1978-11-16 1980-06-13 Prost Tournier Patrick PROCESS FOR CHEMICAL DEPOSITION OF GOLD BY SELF-CATALYTIC REDUCTION
US4340451A (en) * 1979-12-17 1982-07-20 Bell Telephone Laboratories, Incorporated Method of replenishing gold/in plating baths
DE3029785A1 (en) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen ACID GOLD BATH FOR ELECTRIC DEPOSIT OF GOLD
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
US4374876A (en) * 1981-06-02 1983-02-22 Occidental Chemical Corporation Process for the immersion deposition of gold
US4474838A (en) * 1982-12-01 1984-10-02 Omi International Corporation Electroless direct deposition of gold on metallized ceramics
JPS60179127U (en) * 1984-05-09 1985-11-28 ヤンマー農機株式会社 combine
US4822641A (en) * 1985-04-30 1989-04-18 Inovan Gmbh & Co. Kg Method of manufacturing a contact construction material structure
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4925491A (en) * 1986-09-30 1990-05-15 Lamerie, N.V. Solutions and creams for silver plating and polishing
US4798626A (en) * 1986-09-30 1989-01-17 Lamerie, N.V. Solutions and creams for silver plating and polishing
US4919720A (en) * 1988-06-30 1990-04-24 Learonal, Inc. Electroless gold plating solutions
ATE77570T1 (en) * 1988-11-15 1992-07-15 Holland Biotechnology COLORED SOLE OF NON-METALLIC ELEMENTS OR COMPOUNDS, THEIR PRODUCTION AND USE.
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4978559A (en) * 1989-11-03 1990-12-18 General Electric Company Autocatalytic electroless gold plating composition
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
EP1245697A3 (en) * 2002-07-17 2003-02-19 ATOTECH Deutschland GmbH Process for electroles silver plating
JP2004176171A (en) * 2002-09-30 2004-06-24 Shinko Electric Ind Co Ltd Non-cyanogen type electrolytic solution for plating gold
US20060141149A1 (en) * 2004-12-29 2006-06-29 Industrial Technology Research Institute Method for forming superparamagnetic nanoparticles
US20090139264A1 (en) * 2007-11-30 2009-06-04 Rachel Brown Antique jewelry articles and methods of making same
US20150345039A1 (en) * 2015-07-20 2015-12-03 National Institute Of Standards And Technology Composition having alkaline ph and process for forming superconformation therewith
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
CN102925933B (en) * 2012-11-05 2015-03-04 福州大学 Au-FeNi double-section type alloy nano motor and production method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals
US3515571A (en) * 1963-07-02 1970-06-02 Lockheed Aircraft Corp Deposition of gold films
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
US3506462A (en) * 1966-10-29 1970-04-14 Nippon Electric Co Electroless gold plating solutions
US3482974A (en) * 1966-12-27 1969-12-09 Gen Electric Method of plating gold films onto oxide-free silicon substrates
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
US3697296A (en) * 1971-03-09 1972-10-10 Du Pont Electroless gold plating bath and process

Also Published As

Publication number Publication date
FR2268595A1 (en) 1975-11-21
JPS5818430B2 (en) 1983-04-13
DE2518559A1 (en) 1975-11-13
AU8052375A (en) 1976-10-28
GB1448659A (en) 1976-09-08
CA1038559A (en) 1978-09-19
DD117488A5 (en) 1976-01-12
IT1035454B (en) 1979-10-20
FR2268595B1 (en) 1981-03-20
BR7502540A (en) 1976-03-03
JPS50149542A (en) 1975-11-29
US3917885A (en) 1975-11-04

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