MD3418F1 - Procedeu de obtinere a acoperirii chimice cu continut de bor - Google Patents
Procedeu de obtinere a acoperirii chimice cu continut de borInfo
- Publication number
- MD3418F1 MD3418F1 MDA20060173A MD20060173A MD3418F1 MD 3418 F1 MD3418 F1 MD 3418F1 MD A20060173 A MDA20060173 A MD A20060173A MD 20060173 A MD20060173 A MD 20060173A MD 3418 F1 MD3418 F1 MD 3418F1
- Authority
- MD
- Moldova
- Prior art keywords
- boron
- containing coating
- chloride
- electrolyte
- chemical
- Prior art date
Links
Landscapes
- Paints Or Removers (AREA)
Abstract
Inventia se refera la acoperirile chimice, in special la o acoperire cu continut de bor.Procedeul de obtinere a acoperirii chimice cu continut de borinclude dizolvarea in apa a agentului de complexare, activarea electrochimica a solutiei obtinute in spatiul catodic al electrolizorului cu diafragma, la un pH 9,5…11,0, dizolvarea in solutia activata a sarurilor de electroliti, a agentului reducator cu continut de bor, a stabilizatorului, incalzirea solutiei de electrolit si depunerea acoperirii la temperatura de 60…70°C. In calitate de agent decomplexare poate fi utilizat citrat de sodiu, de agent reducator - dimetilaminoboran, de electrolit- clorura de nichel si/sau clorura de cobalt, iarin calitate de stabilizator - nitrat de taliu(I),in urmatorul raport al componentelor, in g/l:clorura de nichel 10,0…15,0clorura de cobalt 10,0…20,0citrat de sodiu 20,0…25,0dimetilaminoboran 1,0…4,0nitrat de taliu(I) 0,001…0,005.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MDA20060173A MD3418G2 (ro) | 2006-06-30 | 2006-06-30 | Procedeu de obţinere a acoperirii chimice cu conţinut de bor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MDA20060173A MD3418G2 (ro) | 2006-06-30 | 2006-06-30 | Procedeu de obţinere a acoperirii chimice cu conţinut de bor |
Publications (2)
Publication Number | Publication Date |
---|---|
MD3418F1 true MD3418F1 (ro) | 2007-10-31 |
MD3418G2 MD3418G2 (ro) | 2008-05-31 |
Family
ID=38664416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MDA20060173A MD3418G2 (ro) | 2006-06-30 | 2006-06-30 | Procedeu de obţinere a acoperirii chimice cu conţinut de bor |
Country Status (1)
Country | Link |
---|---|
MD (1) | MD3418G2 (ro) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MD4087C1 (ro) * | 2010-02-10 | 2011-08-31 | Государственный Университет Молд0 | Procedeu chimico-catalitic de depunere a acoperirilor metalice |
-
2006
- 2006-06-30 MD MDA20060173A patent/MD3418G2/ro not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MD4087C1 (ro) * | 2010-02-10 | 2011-08-31 | Государственный Университет Молд0 | Procedeu chimico-catalitic de depunere a acoperirilor metalice |
Also Published As
Publication number | Publication date |
---|---|
MD3418G2 (ro) | 2008-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5696134B2 (ja) | 塩化カルシウム環境における耐食性が強化されたクロム合金コーティング | |
TW200706707A (en) | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution | |
CN107841771A (zh) | 一种基于复合配位体系的无氰镀银液组合物及其应用 | |
MY147845A (en) | Plating solutions for electroless deposition of copper | |
MY161119A (en) | Steel sheet for container and method of manufacturing the same | |
CN102560571B (zh) | 无氰镀银稳定电镀液、制备方法及其镀银的方法 | |
Lu et al. | Study of the electroless deposition process of Ni-P-based ternary alloys | |
WO2008012403A3 (fr) | Dispositif d'electrolyse de l'eau | |
CN106222633A (zh) | 一种碱性半光亮无氰置换化学镀银镀液及其制备方法 | |
JPWO2010061766A1 (ja) | 電解用活性陰極の製造方法 | |
JPWO2019117178A1 (ja) | 3価クロムメッキ液およびこれを用いたクロムメッキ方法 | |
KR20060128739A (ko) | 비-전도성 기판의 직접적인 금속화 방법 | |
EP2011903A3 (en) | Etching solution and method of its manufacturing as well as method of etching metal surfaces and microtextured implants made using such a method | |
WO2009114217A8 (en) | Method of electrolytically dissolving nickel into electroless nickel plating solutions | |
MX339242B (es) | Proceso para deposicion por via quimica de metales utilizando baño de chapado altamente alcalino. | |
MD3418F1 (ro) | Procedeu de obtinere a acoperirii chimice cu continut de bor | |
MD3151G2 (ro) | Electrod şi procedeu de obţinere a acestuia pentru electroliza soluţiei apoase alcaline | |
CN101709460A (zh) | 化学镀Ni-P阳极复合镀层结构及制备工艺 | |
MD3383F1 (ro) | Electrod si procedeu pentru separarea prinelectroflotare a sistemelor disperse si procedeu de obtinere a electrodului | |
KR20090017744A (ko) | 무전해 니켈 도금액의 안정제 | |
EP2270255A1 (en) | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer | |
MD3753G2 (ro) | Electrod pentru obţinerea electrolitică a hidrogenului şi procedeu de confecţionare a acestuia | |
JPS5980766A (ja) | ルテニウムの無電解メツキ浴 | |
CN101215695A (zh) | 铝合金活化液 | |
JP5051970B2 (ja) | ニッケル、銅又は銀を含む基体表面のための処理液、その調製方法及び表面処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
KA4A | Patent for invention lapsed due to non-payment of fees (with right of restoration) | ||
MM4A | Patent for invention definitely lapsed due to non-payment of fees |