LU60904A1 - - Google Patents

Info

Publication number
LU60904A1
LU60904A1 LU60904DA LU60904A1 LU 60904 A1 LU60904 A1 LU 60904A1 LU 60904D A LU60904D A LU 60904DA LU 60904 A1 LU60904 A1 LU 60904A1
Authority
LU
Luxembourg
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of LU60904A1 publication Critical patent/LU60904A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
LU60904D 1969-05-14 1970-05-12 LU60904A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691924775 DE1924775B2 (de) 1969-05-14 1969-05-14 Verfahren zur herstellung einer leiterplatte

Publications (1)

Publication Number Publication Date
LU60904A1 true LU60904A1 (ja) 1970-07-16

Family

ID=5734245

Family Applications (1)

Application Number Title Priority Date Filing Date
LU60904D LU60904A1 (ja) 1969-05-14 1970-05-12

Country Status (9)

Country Link
US (1) US3675318A (ja)
JP (1) JPS5026020B1 (ja)
BE (1) BE750411A (ja)
CH (1) CH504148A (ja)
DE (1) DE1924775B2 (ja)
FR (1) FR2047563A5 (ja)
GB (1) GB1268317A (ja)
LU (1) LU60904A1 (ja)
NL (1) NL7006717A (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5217779U (ja) * 1975-07-22 1977-02-08
JPS53121371U (ja) * 1977-03-04 1978-09-27
DE2838982B2 (de) * 1978-09-07 1980-09-18 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verfahren zum Herstellen von Mehrebenen-Leiterplatten
DE2920940A1 (de) * 1979-05-21 1980-12-04 Schering Ag Verfahren zur herstellung von gedruckten schaltungen
DE3137279C2 (de) * 1981-09-18 1986-12-11 Wilhelm Ruf KG, 8000 München Verfahren zur Herstellung von Mehrlagen-Leiterplatten sowie nach dem Verfahren hergestellte mehrlagige Leiterplatte
JPS59181094A (ja) * 1983-03-30 1984-10-15 日本メクトロン株式会社 回路基板相互のスル−ホ−ル導通法
DE3427015A1 (de) * 1984-07-21 1986-01-30 Nippon Mektron, Ltd., Tokio/Tokyo Verfahren zur herstellung von durchkontaktierungen in gedruckten schaltungen
DE3576900D1 (de) * 1985-12-30 1990-05-03 Ibm Deutschland Verfahren zum herstellen von gedruckten schaltungen.
JPH0423485A (ja) * 1990-05-18 1992-01-27 Cmk Corp プリント配線板とその製造法
US5142775A (en) * 1990-10-30 1992-09-01 International Business Machines Corporation Bondable via
US5802714A (en) * 1994-07-19 1998-09-08 Hitachi, Ltd. Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
WO1996015651A1 (de) * 1994-11-09 1996-05-23 Blaupunkt-Werke Gmbh Verfahren zur herstellung einer durchkontaktierung auf einer leiterplatte
US5509200A (en) * 1994-11-21 1996-04-23 International Business Machines Corporation Method of making laminar stackable circuit board structure
US6349456B1 (en) * 1998-12-31 2002-02-26 Motorola, Inc. Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
TWI286826B (en) * 2001-12-28 2007-09-11 Via Tech Inc Semiconductor package substrate and process thereof
JP4772702B2 (ja) * 2007-01-11 2011-09-14 富士通株式会社 プリント基板およびプリント基板ユニット並びに導電体の上がり量検出方法
US8104171B2 (en) * 2008-08-27 2012-01-31 Advanced Semiconductor Engineering, Inc. Method of fabricating multi-layered substrate
CN106455333A (zh) * 2016-11-15 2017-02-22 清远市富盈电子有限公司 一种pcb金属包边板改善锣边铜披锋的制作工艺
CN110545634A (zh) * 2019-08-29 2019-12-06 江苏上达电子有限公司 一种先做线路再镀孔铜的多层精细线路板的制作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3371249A (en) * 1962-03-19 1968-02-27 Sperry Rand Corp Laminar circuit assmebly
US3334395A (en) * 1962-11-26 1967-08-08 Northrop Corp Method of making a metal printed circuit board

Also Published As

Publication number Publication date
JPS5026020B1 (ja) 1975-08-28
BE750411A (fr) 1970-11-16
FR2047563A5 (ja) 1971-03-12
NL7006717A (ja) 1970-11-17
US3675318A (en) 1972-07-11
DE1924775B2 (de) 1971-06-09
DE1924775A1 (de) 1971-03-11
CH504148A (de) 1971-02-28
GB1268317A (en) 1972-03-29

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