LT3384364T - Skysčio aušinimo sistema ir būdas elektroninei įrangai - Google Patents

Skysčio aušinimo sistema ir būdas elektroninei įrangai

Info

Publication number
LT3384364T
LT3384364T LTEPPCT/AU2016/051186T LT16051186T LT3384364T LT 3384364 T LT3384364 T LT 3384364T LT 16051186 T LT16051186 T LT 16051186T LT 3384364 T LT3384364 T LT 3384364T
Authority
LT
Lithuania
Prior art keywords
cooling system
fluid cooling
electronics equipment
electronics
equipment
Prior art date
Application number
LTEPPCT/AU2016/051186T
Other languages
English (en)
Inventor
Stuart David MIDGLEY
Mark LOMMERS
Original Assignee
Dug Technology (Australia) Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2015904999A external-priority patent/AU2015904999A0/en
Application filed by Dug Technology (Australia) Pty Ltd filed Critical Dug Technology (Australia) Pty Ltd
Publication of LT3384364T publication Critical patent/LT3384364T/lt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
LTEPPCT/AU2016/051186T 2015-12-02 2016-12-01 Skysčio aušinimo sistema ir būdas elektroninei įrangai LT3384364T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AU2015904999A AU2015904999A0 (en) 2015-12-02 Fluid Conditioner for Cooling Fluid in a Tank Holding Computers and/or Other Electronics Equipment, a Cooling System Incorporating such a Fluid Conditioner, and a Method of Cooling Fluid in a Tank Holding Computers and/or Other Electronics Equipment
PCT/AU2016/051186 WO2017091862A1 (en) 2015-12-02 2016-12-01 Fluid cooling system and method for electronics equipment

Publications (1)

Publication Number Publication Date
LT3384364T true LT3384364T (lt) 2022-05-10

Family

ID=58795986

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEPPCT/AU2016/051186T LT3384364T (lt) 2015-12-02 2016-12-01 Skysčio aušinimo sistema ir būdas elektroninei įrangai

Country Status (15)

Country Link
US (1) US11026344B2 (lt)
EP (1) EP3384364B1 (lt)
JP (1) JP6659869B2 (lt)
CN (1) CN108292152A (lt)
AU (1) AU2016363679B2 (lt)
BR (1) BR112018011022B1 (lt)
CA (1) CA3006594C (lt)
DK (1) DK3384364T3 (lt)
ES (1) ES2910703T3 (lt)
HK (1) HK1251057A1 (lt)
LT (1) LT3384364T (lt)
MY (1) MY193528A (lt)
RU (1) RU2698777C1 (lt)
SG (1) SG11201804241UA (lt)
WO (1) WO2017091862A1 (lt)

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US10020242B2 (en) * 2016-04-14 2018-07-10 Hamilton Sundstrand Corporation Immersion cooling arrangements for electronic devices
RU2695089C2 (ru) * 2017-12-26 2019-07-19 Общество с ограниченной ответственностью "Научно-Технический Центр ИннТех" Система непосредственного жидкостного охлаждения электронных компонентов
US20190357378A1 (en) * 2018-05-18 2019-11-21 Tas Energy Inc. Two-phase immersion cooling system and method with enhanced circulation of vapor flow through a condenser
AT520915B1 (de) * 2018-09-04 2019-07-15 Claus Hinterecker Vorrichtung zur Kühlung von Hochleistungsrechnern- oder Schaltungen mit Temperaturregelung
JP7151503B2 (ja) * 2019-01-23 2022-10-12 富士通株式会社 冷却装置及び電子機器
US11592795B2 (en) * 2019-02-08 2023-02-28 Dell Products L.P. System and method of managing liquids with information handling systems
KR20220005450A (ko) * 2019-03-13 2022-01-13 서브머 테크놀러지스 에스.엘. 컴퓨터 구성 요소들의 냉각 시스템
TWI714037B (zh) * 2019-03-26 2020-12-21 緯創資通股份有限公司 用於儲液槽體的氣流產生系統、具有其之浸沒式冷卻設備以及其操作方法
US10765033B1 (en) * 2019-05-23 2020-09-01 Microsoft Technology Licensing, Llc Immersion cooling enclosures with insulating liners
CN112020265B (zh) * 2019-05-31 2022-06-28 华为技术有限公司 一种散热装置及处理器
CN113721718B (zh) * 2020-05-26 2024-06-25 富联精密电子(天津)有限公司 散热装置及服务器
US10966349B1 (en) * 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
WO2022058915A1 (en) * 2020-09-18 2022-03-24 3M Innovative Properties Company Sensors for contaminants
US11412636B2 (en) * 2021-01-12 2022-08-09 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
AU2022270710A1 (en) 2021-05-06 2023-12-21 Tyco Fire & Security Gmbh Electrical power distribution optimized liquid immersion cooling tank with variable flow for high density computer server equipment
US11696423B2 (en) 2021-05-06 2023-07-04 Tyco Fire & Security Gmbh Liquid immersion cooling tank with variable flow for high density computer server equipment
TWI816465B (zh) * 2022-07-08 2023-09-21 緯穎科技服務股份有限公司 浸潤冷卻系統

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KR900001393B1 (en) * 1985-04-30 1990-03-09 Fujitsu Ltd Evaporation cooling module for semiconductor device
JPH0727998B2 (ja) * 1986-10-20 1995-03-29 富士通株式会社 半導体装置の冷却方法
JPH04170097A (ja) * 1990-11-01 1992-06-17 Koufu Nippon Denki Kk 冷却機構
US6955062B2 (en) * 2002-03-11 2005-10-18 Isothermal Systems Research, Inc. Spray cooling system for transverse thin-film evaporative spray cooling
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US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US20070227710A1 (en) * 2006-04-03 2007-10-04 Belady Christian L Cooling system for electrical devices
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US7905106B2 (en) * 2008-04-21 2011-03-15 Hardcore Computer, Inc. Case and rack system for liquid submersion cooling of electronic devices connected in an array
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Also Published As

Publication number Publication date
EP3384364B1 (en) 2022-03-30
MY193528A (en) 2022-10-18
JP2019500759A (ja) 2019-01-10
WO2017091862A1 (en) 2017-06-08
BR112018011022B1 (pt) 2022-11-22
DK3384364T3 (da) 2022-04-19
JP6659869B2 (ja) 2020-03-04
CA3006594C (en) 2023-10-10
RU2698777C1 (ru) 2019-08-29
BR112018011022A2 (pt) 2018-11-21
EP3384364A1 (en) 2018-10-10
HK1251057A1 (zh) 2019-01-18
ES2910703T3 (es) 2022-05-13
AU2016363679B2 (en) 2020-03-12
US11026344B2 (en) 2021-06-01
SG11201804241UA (en) 2018-06-28
AU2016363679A1 (en) 2018-06-07
CA3006594A1 (en) 2017-06-08
EP3384364A4 (en) 2019-08-21
US20180279507A1 (en) 2018-09-27
CN108292152A (zh) 2018-07-17

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