KR980007893A - Conductive Paste Composition for Chip Resistor Terminal Electrodes - Google Patents

Conductive Paste Composition for Chip Resistor Terminal Electrodes Download PDF

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Publication number
KR980007893A
KR980007893A KR1019970026694A KR19970026694A KR980007893A KR 980007893 A KR980007893 A KR 980007893A KR 1019970026694 A KR1019970026694 A KR 1019970026694A KR 19970026694 A KR19970026694 A KR 19970026694A KR 980007893 A KR980007893 A KR 980007893A
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KR
South Korea
Prior art keywords
paste composition
resistor terminal
powder
electrically conductive
chip resistor
Prior art date
Application number
KR1019970026694A
Other languages
Korean (ko)
Other versions
KR100268699B1 (en
Inventor
아끼라 이나바
히로시 시바따
Original Assignee
미리암 디. 메코너헤이
이.아이.듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미리암 디. 메코너헤이, 이.아이.듀폰 디 네모아 앤드 캄파니 filed Critical 미리암 디. 메코너헤이
Publication of KR980007893A publication Critical patent/KR980007893A/en
Application granted granted Critical
Publication of KR100268699B1 publication Critical patent/KR100268699B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

온-기재 도체 성분을 사용하는 전기 전도성 페이스트 조성물인 도체 페이스트 조성물을 제공하면 여전히 전기 전도성, 접착 강도가 충분하고, 땜납 습윤성 및 땜납침출 방지성을 포함하는 모든 특성의 균형이 우수한 상태로 존재하는 칩 저항기 터미날 전극을 형성할 수 있다. 칩 저항기 터미날 전극용 도체 페이스트 조성물, 즉 전기 전도성 성분으로서 금속 분말, 무기 결합제, 전도성 무기 충전제 및 비히클을 포함하는 칩 저항기 터미날 전극용 전기 전도성 페이스트 조성물에서 전기 전도성 성분으로서 작용하는 상기 금속 분말은 은 분말, 팔라듐 분말, 은-팔라듐 합금 분말, 또는 상기의 둘 이상의 분말 혼합물을 포함하고, 상기 무기 결합제는 유리 결합제를 포함하고, 전도성 무기 충전제는 이성분 산화물 및(또는) 피로클로르 및(또는) 주석, 이리듐, 로듐, 루테늄 및 레늄으로 이루어진 군으로부터 선택된 금속의 붕소화물을 포함한다.Providing a conductor paste composition, which is an electrically conductive paste composition using an on-based conductor component, still provides sufficient electrical conductivity, sufficient adhesive strength, and a good balance of all properties including solder wetting and solder leach resistance. A resistor terminal electrode can be formed. The conductor powder of the chip resistor terminal electrode, i.e., the metal powder serving as the electrically conductive component in the electrically conductive paste composition for the chip resistor terminal electrode comprising a metal powder, an inorganic binder, a conductive inorganic filler and a vehicle as the electrically conductive component is a silver powder. , Palladium powder, silver-palladium alloy powder, or a mixture of two or more of the above, wherein the inorganic binder comprises a glass binder, the conductive inorganic filler comprises a bicomponent oxide and / or pyrochlor and / or tin, Borides of metals selected from the group consisting of iridium, rhodium, ruthenium and rhenium.

Description

칩 저항기 터미날 전극용 전도성 페이스트 조성물Conductive Paste Composition for Chip Resistor Terminal Electrodes

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

도 1은 도체 페이스트 조성물의 인쇄, 건조 및 연소 후에 땜납 침출로 인한 전기 전도도를 측정하기 위하여 사용된 측정 회로도.1 is a measurement circuit diagram used to measure electrical conductivity due to solder leaching after printing, drying and burning of the conductor paste composition.

Claims (1)

페이스트 기준으로, (a) 금속 은, 그의 합금 또는 그의 혼합물 50-87 중량%, (b) PbO, SiO2및 임의로 BiO3이 없는 B2O3를 주 성분으로 하는 유리 프릿으로 이루어진 무기 결합제 3-10 중량%, 및 (c) 주석 산화물, 이리듐 산화물, 로듐 산화물, 루테늄 산화물, 이리듐-기재, 로듐-기재 및 루테늄-기재 피로클로르 및 붕소화물로 이루어진 군으로부터 선택된 1종 이상의 전도성 무기 충전체 0.1-15 중량%의 미립 입자들이 모두 유기 매질 (d) 중에 분산된, 칩 저항기 터미날 전극용 도체 페이스트 조성물.A paste based on, (a) metal, an alloy thereof or a mixture of 50-87% by weight, (b) PbO, SiO 2, and optionally an inorganic binder composed of glass frit to the B 2 O 3 as a main component without BiO 3 3 -10 wt% and (c) at least one conductive inorganic filler selected from the group consisting of tin oxide, iridium oxide, rhodium oxide, ruthenium oxide, iridium-based, rhodium-based and ruthenium-based pyrochlor and borides A conductor paste composition for a chip resistor terminal electrode, wherein -15% by weight of fine particles are all dispersed in an organic medium (d).
KR1019970026694A 1996-06-25 1997-06-24 Conductive paste compositions for chip resistor terminal electrodes KR100268699B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18269996 1996-06-25
JP96-182699 1996-06-25

Publications (2)

Publication Number Publication Date
KR980007893A true KR980007893A (en) 1998-03-30
KR100268699B1 KR100268699B1 (en) 2000-11-01

Family

ID=16122896

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970026694A KR100268699B1 (en) 1996-06-25 1997-06-24 Conductive paste compositions for chip resistor terminal electrodes

Country Status (4)

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KR (1) KR100268699B1 (en)
CN (1) CN1090368C (en)
SG (1) SG63719A1 (en)
TW (1) TW533433B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100351230B1 (en) * 2000-06-09 2002-09-05 대주정밀화학 주식회사 Conductive paste composition for electrodes
JP3736802B2 (en) * 2002-11-25 2006-01-18 Ｔｄｋ株式会社 Conductive composition and ceramic electronic component
CN1328348C (en) * 2003-05-12 2007-07-25 贵研铂业股份有限公司 Antiadhesion agent and method of preventing chip adhesion during sintering high temperature silve paste
CN101719395B (en) * 2008-10-09 2013-04-24 北京印刷学院 Macromolecular solution dispersing medium with complete combustion and volatilization for dispensing organic powder
CN101620893B (en) * 2009-05-22 2011-03-09 广东风华高新科技股份有限公司 All-silver electronic paste and preparation method thereof
CN101692410B (en) * 2009-08-21 2011-11-09 广东风华高新科技股份有限公司 Silver paste of MLCC terminal electrode
CN101728002A (en) * 2010-01-15 2010-06-09 贵阳晶华电子材料有限公司 End-blocking slurry for flaky component
CN101826564B (en) * 2010-05-11 2011-10-05 中国乐凯胶片集团公司 Solar cell back surface field aluminum paste
US20130078459A1 (en) * 2010-06-09 2013-03-28 Ocean's King Lighting Science & Technology Co., Ltd. Conductive adhesive mixture, fluorescent screen anode plate and the manufacturing methods thereof
CN105139916B (en) * 2015-06-30 2017-01-04 苏州洋杰电子有限公司 Carbon dust doping molybdenio thick-film resistor paste and preparation method thereof
CN107032623A (en) * 2017-02-20 2017-08-11 江苏瑞德新能源科技有限公司 A kind of lead-free glass powder used for solar batteries and positive silver paste

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59185801U (en) * 1983-05-26 1984-12-10 アルプス電気株式会社 chip resistance
JPS6290905A (en) * 1985-05-29 1987-04-25 株式会社明電舎 Manufacture of voltage nonlinear resistance element
JP3015621B2 (en) * 1993-05-10 2000-03-06 松下電器産業株式会社 Conductive paste composition

Also Published As

Publication number Publication date
CN1182941A (en) 1998-05-27
KR100268699B1 (en) 2000-11-01
SG63719A1 (en) 1999-03-30
CN1090368C (en) 2002-09-04
TW533433B (en) 2003-05-21

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