CN1090368C - Conducting composition used as end electrode of sheet resistance - Google Patents
Conducting composition used as end electrode of sheet resistance Download PDFInfo
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- CN1090368C CN1090368C CN97115541A CN97115541A CN1090368C CN 1090368 C CN1090368 C CN 1090368C CN 97115541 A CN97115541 A CN 97115541A CN 97115541 A CN97115541 A CN 97115541A CN 1090368 C CN1090368 C CN 1090368C
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- powder
- paste composition
- silver
- conductive
- composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 68
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 5
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 5
- 239000010948 rhodium Substances 0.000 claims abstract description 5
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 5
- 239000002002 slurry Substances 0.000 claims description 24
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 claims 1
- -1 rheium oxide Chemical compound 0.000 claims 1
- 229910003450 rhodium oxide Inorganic materials 0.000 claims 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 32
- 239000011521 glass Substances 0.000 abstract description 24
- 239000000843 powder Substances 0.000 abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 239000011256 inorganic filler Substances 0.000 abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052709 silver Inorganic materials 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011230 binding agent Substances 0.000 abstract description 6
- 229910052718 tin Inorganic materials 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000004615 ingredient Substances 0.000 abstract description 4
- 229910000510 noble metal Inorganic materials 0.000 abstract description 4
- 229910052702 rhenium Inorganic materials 0.000 abstract description 4
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 abstract description 4
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 3
- 150000004706 metal oxides Chemical class 0.000 abstract description 3
- 229910001252 Pd alloy Inorganic materials 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001316 Ag alloy Inorganic materials 0.000 abstract 1
- 229910016264 Bi2 O3 Inorganic materials 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 238000002386 leaching Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000011297 pine tar Substances 0.000 description 2
- 229940068124 pine tar Drugs 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910002064 alloy oxide Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RUJPNZNXGCHGID-UHFFFAOYSA-N beta-terpineol Chemical compound CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000320 mechanical mixture Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SVRRMEJIJVIXAM-UHFFFAOYSA-N oxobismuth;ruthenium Chemical compound [Ru].[Bi]=O SVRRMEJIJVIXAM-UHFFFAOYSA-N 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
To provide a conductor paste composition which is an electrically conductive paste composition that uses silver-based conductor ingredients, yet is able to form a chip resistor terminal electrode that has sufficient electrical conductivity and adhesive strength, and in which all the properties, including solder wettability and solder leach resistance, exist in a good balance. A conductor paste composition for chip resistor terminal electrodes whereby, in an electrically conductive paste composition for chip resistor terminal electrodes that includes a metal powder as the electrically conductive ingredient, inorganic binders, conductive inorganic filler, and a vehicle: said metal powder serving as the electrically conductive ingredient includes silver powder, palladium powder, a silver-palladium alloy powder, or a powder mixture of at least two of these, said inorganic binders include a glass binder, and the conductive inorganic filler includes binary oxides and/or pyrochlores and/or borides of metals selected from the group consisting of tin, iridium, rhodium, ruthenium and rhenium. To provide conductivity, adhesion, wettability, and solder waste resistance with a good balance by using, in a conductive paste composition, Ag having an effective characteristic, or an Ag conductive component such as a mixture or alloy of Ag with other noble metal. A conductive paste composition for terminal electrode of chip resistor formed by dispersing a conductive component consisting of metal powder and an inorganic binder in a vehicle contains 50-87wt.% of at least one kind selected from the group consisting of silver single body and mixtures and alloys of silver with other noble metal powders. It also contains 3-10wt.% of a glass binder containing no Bi2 O3 and 0.1-15wt.% of a metal oxide, bichloride or boride selected from tin, iridium, rhodium, ruthenium and rhenium alone or in combination of two or more thereof.
Description
The present invention relates to electrocondution slurry, be made up of the multiple conductive compositions and the inorganic bond that are scattered in the organic bond, this slurry can be used for the termination electrode material of chip component.The invention particularly relates to electrocondution slurry, even when noble metal is used as the conductor composition, this slurry still has good anti-scolder leaching in the process that chip component is assembled to circuitry substrate, and highly is applicable to the chip resistor electrode.
Along with electronic circuit trends towards more highdensity assembling, the assembling of chip component is widely used in the several years in the past, the method of taking this can be with many miniature circuit elements (claiming " chip component " here), and promptly chip resistor and chip capacitor are assembled on the circuitry substrate simultaneously.
The output terminal electrode that is used to be assemblied on the circuitry substrate must be installed in these chip components.
The Main Ingredients and Appearance that always extensively is used as the thick film conductor paste feed composition of termination electrode material so far comprises conductive component, adhesive and organic carrier.Precious metal palladium (Pd), fine-powder or its mixture or its alloy or palladium oxide and silver oxide or its mixture of platinum (Pt) and silver (Ag) are widely used in the conductor composition.Glass glue is used as adhesive, and inert organic liquid is used as organic carrier.Have the paste component of d spiss and rheological characteristic can be by with the conductor component, glass glue and and the inertia organic carrier mix, utilize the method for mechanical mixture to make its dispersion then and make.
Such as this type of chip component is connected on the circuitry substrate picture on surface is to utilize the method for welding to finish, and promptly the chip component terminal is welded in fusion welding in the circuitous pattern of copper-clad laminated printed circuit boards on the relevant position securely.
Therefore, this electrocondution slurry composition not only should have bonding strength and conductivity after forming termination electrode, and should have solderability.The solderability of this termination electrode refers to be assembled to chip component on the circuitry substrate or in the maintenance process, good solder wettable that the termination electrode soldering is required and anti-scolder leaching.
The inventor has studied above-mentioned prior art, draws the conclusion that it has following problem.
Money base conductor composition has good practicality as the conduction composition, conduction composition in the electrocondution slurry composition is as the termination electrode material of chip component, and money base conductor composition has lower connection resistance and good solder wettable, and can oxidized sintering.But when termination electrode is that the problem of appearance is the anti-scolder leaching that produces difference under the situation about forming with the electrocondution slurry composition that contains money base conductor composition.In addition, when with RuO
2Or pyrochlore is the plate resistor termination electrode on basis when forming, and can produce such as other problemses such as resistance shakinesses after electrode generates.
Above-mentioned first problem is a kind of like this phenomenon, be when directly on electrode, carrying out promptly when electrocondution slurry composition in the prior art is used to chip component termination electrode and welding, silver as the main conductor composition in the termination electrode spreads (being called as the scolder leaching) in scolder, and then spreads in conductor as the tin of a kind of composition of scolder.When the scolder of electrode is leached in when taking place in the element assembling process, this causes because the caused reliability of bad connection weakens.When the scolder of electrode is leached in when taking place in the maintenance, in fact scolder does not soak electrode, and this makes element not assemble.The diffusion of tin in electrode destroyed electrode and the chip adhesion at the contact-making surface place.The method of avoiding this problem is to utilize a silver-colored palldium alloy to do electrode conductor to diffuse in the scolder to prevent silver.Yet even in this case, when solder temperature was higher, the scolder leaching was still and can not be avoided, and this also depends on the scolder kind.So service condition is very limited.
Second problem is, in chip resistor and analog production process thereof, when end electrode of sheet resistance generated by utilizing electrocondution slurry composition sintering, phase counterdiffusion and thermal stress produced between resistor and termination electrode, and this causes fluctuating widely of resistor resistance.
One of the object of the invention is to provide the electrocondution slurry composition, even if this component is under the situation of using money base conductor composition, still have suitable conductance and bond strength, the good equilibrium that keeps whole performance simultaneously, therefore this can form the termination electrode of chip resistor comprising solder wettable and anti-scolder leaching.
Another object of the present invention is to provide the electrocondution slurry composition of end electrode of sheet resistance, this composition comprises the inorganic conductive filler, metal oxide and/or the pyrochlore and/or the boride of diffusion did not take place in scolder in the welding stage, reach the unorganic glass adhesive that electroplate liquid is had good drag, and constitute by a kind of conductor composition of money base.
Above-mentioned and other purpose of the present invention and notable feature thereof are conspicuous from the description of this specification and appended accompanying drawing.
Fig. 1 illustrates and is printing being used for the electrocondution slurry composition, behind drying and the burning electrocondution slurry composition, because the measuring circuit that the conductivity that the scolder leaching is caused is assessed.Among Fig. 1: 1. are alumina substrates; 2. be the printing and the sintering figure of electrocondution slurry composition; 3. be resistance measurement device (4-terminal method).
The object of the invention is to address the above problem. The present invention is a kind of conductive paste composition with end electrode of sheet resistance, comprises the metal dust as the conductor composition in the conductive paste composition of this end electrode of sheet resistance, inorganic bond and carrier; The mixture of powders that comprises silver powder, palladium powder, silver-palladium alloy powder or above-mentioned at least two kinds of metals as the metal dust of conductive compositions; Inorganic bond comprises glass glue, and the conduction inorganic filler comprises binary oxide and/or pyrochlore and/or is selected from metal boride in rhenium, iridium, rhodium, ruthenium, the tin.
In conductive paste composition of the present invention, namely convenient silver base conductive composition by the scolder leaching, has at least a kind of conduction inorganic filler to remain in the thick film conductor to form termination electrode after termination electrode forms in binary metal oxide, pyrochlore and the boride. Sufficient electric conductivity and bond strength have consequently been kept. This has been avoided the stability that caused by the Joint failure due to the scolder leaching to reduce and can't have been assembled by the chip component that the solder wettable variation causes in addition.
Among the present invention, will have less contact resistance, good solder wettable and material such as silver that can oxidation and sinter, pyrochlore and composition thereof and alloy thereof are feasible as conductive powder. The mixture of above-mentioned material and other noble metal powders also can be used. The form that these metal or alloy are used is fine-powder. Although the particle optimum grain-diameter is in about 0.1-5 micrometer range, the metal powder granulates size is unimportant, as long as adapt with painting method.
About the glass glue that uses in the present invention, the composition of glass itself is not vital, does not anyly react mutually with above-mentioned conductor and all can use with any material of firing assistant metal particles sintering in the step, forming the conductor phase having enough viscosity and glass flow under the firing temperature.
Therefore, it is possible utilizing far-ranging oxidation glass, and wherein glass contains traditional forming of glass and glass-modified composition.The example of these oxidation glass comprises lead silicate salt such as lead borosilicate and lead silicate itself etc.Preferred frit is Pbo-SiO
2Base frit or Pbo-SiO
2-B
2O
3-Ji frit.The softening temperature of this frit is about 450～600 ℃, and the drag of pair electroplate liquid is arranged.Because to the bad drag of electroplate liquid, such glass does not contain with Bi
2O
3Constitute the glass ingredient of glass.
The granular size of glass glue there is no the value of particular importance.Yet glass particle should be in 0.1～10 micrometer range (preferred 0.5～5 micron), and average grain diameter should be at 2～3 microns.Tiny glass particle less than 0.1 micron has very high surface area, and this needs a large amount of organic solvents to obtain the adequate liquidity as the printing slurry.On the other hand, then be an impediment to printing during greater than 10 microns when particle diameter.
The content of silver accounts for 50～87% (weight) of slurry usually in the composition, and frit content accounts for 3%～10% (weight) of composition greatly in composition, and the conductor inorganic filler content is about 0.1～15% (weight) of slurry.
In the present invention, above-mentioned conductive powder and glass glue and other inorganic fillers can be scattered in a kind of organic carrier and be prepared to the dispersion that is called as " slurry " that generally has the semifluid softness.
The ratio of inoganic solids depends on the application process of slurry and used organic solvent in organic carrier and the dispersion in thick-film paste composition of the present invention, and can change to some extent.
In order to obtain the high-quality coating, dispersion contains 50%-90% (weight) inoganic solids and 10～50% (weight) carrier usually.
Any inert fluid all can be used as carrier.To its adding or do not add thickener and/or the water of stabilizer and/or other common additives or any multiple organic liquid all can be used as carrier.For example the organic liquid that can be used comprises aliphatic alcohol; The various esters of this class alcohol are as ethyl acetate and ethyl propionate; Terpenes such as loose ester and pine tar ester; And such as the resin solution in the monobutyl ether equal solvent of pine tar and ethylene glycol monoacetate, as the polymethacrylates of low mass molecule alcohol class, or ethyl cellosolve.Volatile liquid can be contained in the carrier, so that improve the speed that applies after-hardening on substrate, or carrier itself can constitute thus.
Preferred vector is that those are the carrier of base with ethyl cellosolve and β-terpinol.
Implement pattern of the present invention and described hereinafter, but the present invention is not limited to these embodiment.If there are not other explanations, shown in numeral be the percentage by weight of component.
The glass that is used as inorganic bond in following embodiments of the invention and Comparative Examples is Pbo-SiO
2-B
2O
3-Ji frit.
Embodiment
Embodiment 1-12
A kind of conductor paste composition is by through grinding silver powder (carefully be ground to particle diameter and be not more than 1 μ m), palladium powder, glass powder, ethyl cellulose and terpinol co-production pulp, stirred with blender, pass through milling processing then, each component ratio is listed in the table below.
Table 1
The embodiment of the invention
Comparative Examples
| Component | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Silver powder | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 56 | 56 | 65 | 63 |
| The palladium powder | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
| Glass powder | 10 | 8 | 6 | 10 | 8 | 6.7 | 8.3 | 8 | 10 | 10 | 10 | 10 |
| Inorganic filler ruthenium-oxide bismuth pyrochlore nickel borides (Ni 3B) lanthanum boride (LaB 6) tin oxide (SnO 2) | 3.5 | 3.5 | 3.5 | 1.5 | 1.5 | 2.18 | 2.82 | 0.75 1.75 | 10 | 10 | 2.0 | 2.0 |
| The resin ethyl cellulose | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| The organic solvent terpinol | 16 | 18 | 20 | 18 | 20 | 20.6 2 | 18.38 | 19 | 21.5 | 21.5 | 20.5 | 20.5 |
Electrocondution slurry composition among the Comparative Examples 1-3 by following component use with embodiment 1 in same procedure form fully.
Table 2
Comparative Examples
| 1 | 2 | 3 | |
| Silver powder | 68 | 71.5 | 68 |
| The palladium powder | 2 | 0.5 | 2 |
| Glass powder | 5 | 3 | 5 |
| Resin (ethyl cellulose) | 2 | 2 | 2 |
| Organic solvent (terpinol) | 23 | 23 | 23 |
In the conductor paste composition of these embodiment and Comparative Examples, to since the assessment (exist/do not exist and be electrically connected inefficacy) of the conductivity that the scolder leaching of when welding causes carry out as follows.
Then, conductor paste composition in Application Example and Comparative Examples uses 96% aluminium substrate printing by pattern shown in Figure 12, way is shown in Fig. 1 measuring circuit, printing in order to assessment conductor paste composition, dry and fire relation between back scolder leaching and the conductivity, after this under 150 ℃ of conditions dry 10 minutes, to form 20～24 microns thick film, temperature with 850 ℃ was fired under oxidation environment 10 minutes in the common electric band oven then, like this, total firing time is about 30 minutes.
When being dipped into temperature after so firing, the conductor paste composition in Application Example and the Comparative Examples remains on low its molten solder (Sn: Pb=63.37) reach 5 seconds of 280 ℃ of fusions, 10 seconds, when 15 seconds and 20 seconds, utilize four terminal measuring resistance methods commonly used to measure the resistance of the thick film conductor that on substrate, forms.Measurement is undertaken by mode shown in Figure 1, promptly uses a kind of resistance apparatus (as an Advantest R6871 digimer), and it is electrically connected with the thick film conductor figure 2 that forms on substrate.It the results are shown in the following table 3.Can find out obviously that from table 3 conductor paste composition of the present invention uses money base conductor component and is to contain conduct electricity the slurry of inorganic filler a kind of containing, this composition has suppressed because the electrical connection inefficacy that the scolder leaching causes.In addition, can further think, promptly require (as conductivity, adhesion etc.) to reach the degree that does not cause any practical problem at least the suchlike every other key property characteristic of conductor paste composition.
Table 3
The scolder soak time
| 5 seconds (Ω) | 10 seconds (Ω) | 15 seconds (Ω) | 20 seconds (Ω) | |
| Embodiment 1 | 1.2 | 1.2 | 1.2 | 1.2 |
| Embodiment 2 | 1.1 | 1.1 | 1.1 | 1.0 |
| Embodiment 3 | 1.0 | 1.0 | 1.0 | 1.0 |
| Embodiment 4 | 1.0 | 1.0 | 1.0 | 1.0 |
| Embodiment 5 | 1.0 | 1.0 | 1.0 | 1.0 |
| Embodiment 6 | 1.0 | 1.0 | 1.0 | 1.0 |
| Embodiment 7 | 1.0 | 1.1 | 1.0 | 1.0 |
| Embodiment 8 | 1.0 | 1.0 | 1.0 | 1.0 |
| Embodiment 9 | 6.8 | 7.0 | 7.1 | 7.6 |
| Embodiment 10 | 1.5 | 1.5 | 1.6 | 1.7 |
| Embodiment 11 | 1.5 | 1.8 | 1.8 | 1.9 |
| Embodiment 12 | 1.8 | 2.0 | 2.1 | 2.3 |
| Comparative Examples 1 | 0.5 | Can't measure | Can't measure | Can't measure |
| Comparative Examples 2 | 0.5 | Can't measure | Can't measure | Can't measure |
| Comparative Examples 3 | 0.5 | Can't measure | Can't measure | Can't measure |
The obtained main advantageous effects of the present invention gathers as follows.
Contain metal dust as the conductor composition as in addition binary oxide and/or pyrochlore and/or the metal boride that is selected from tin, iridium, rhodium, ruthenium and rhenium being included in as inorganic filler, the conductive paste composition that the end electrode of sheet resistance of inert binder and carrier is used is that convenient conductive compositions still can keep certain electrical connection during by the scolder leaching so. In addition, the electrical conductivity of the conductor paste composition that obtains and bond strength also are fully, and its all character comprise solder wettable and anti-scolder leaching, all are in good poised state.
Claims (1)
1, the electrocondution slurry composition used of a kind of end electrode of sheet resistance, it comprises the following fine particle based on slurry: (a) argent of 50-87 weight %, its alloy or its mixture; (b) inorganic bond of being made up of frit of 3-10 weight %, described frit is mainly by not containing Bi
2O
3PbO, SiO
2With optional B
2O
3Form; And (c) 0.1-15 weight % be selected from least a in tin oxide, yttrium oxide, rhodium oxide, ruthenium-oxide, rheium oxide, iridium base, rhodium base and ruthenium base pyrochlore and the boride, all (a) and (b) and (c) being scattered in a kind of organic media (d).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18269996 | 1996-06-25 | ||
| JP182699/96 | 1996-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1182941A CN1182941A (en) | 1998-05-27 |
| CN1090368C true CN1090368C (en) | 2002-09-04 |
Family
ID=16122896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97115541A Expired - Lifetime CN1090368C (en) | 1996-06-25 | 1997-06-25 | Conducting composition used as end electrode of sheet resistance |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100268699B1 (en) |
| CN (1) | CN1090368C (en) |
| SG (1) | SG63719A1 (en) |
| TW (1) | TW533433B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305077C (en) * | 2002-11-25 | 2007-03-14 | Tdk株式会社 | Conductive composition and ceramic electronic element |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100351230B1 (en) * | 2000-06-09 | 2002-09-05 | 대주정밀화학 주식회사 | Conductive paste composition for electrodes |
| CN1328348C (en) * | 2003-05-12 | 2007-07-25 | 贵研铂业股份有限公司 | Antiadhesion agent and method of preventing chip adhesion during sintering high temperature silve paste |
| CN101719395B (en) * | 2008-10-09 | 2013-04-24 | 北京印刷学院 | Macromolecular solution dispersing medium with complete combustion and volatilization for dispensing organic powder |
| CN101620893B (en) * | 2009-05-22 | 2011-03-09 | 广东风华高新科技股份有限公司 | All-silver electronic paste and preparation method thereof |
| CN101692410B (en) * | 2009-08-21 | 2011-11-09 | 广东风华高新科技股份有限公司 | Silver paste of MLCC terminal electrode |
| CN101728002A (en) * | 2010-01-15 | 2010-06-09 | 贵阳晶华电子材料有限公司 | End-blocking slurry for flaky component |
| CN101826564B (en) * | 2010-05-11 | 2011-10-05 | 中国乐凯胶片集团公司 | Solar cell back surface field aluminum paste |
| WO2011153695A1 (en) * | 2010-06-09 | 2011-12-15 | 海洋王照明科技股份有限公司 | Conductive glue mixture, fluorescent screen anode plate and manufacture method thereof |
| CN105139916B (en) * | 2015-06-30 | 2017-01-04 | 苏州洋杰电子有限公司 | Carbon dust doping molybdenio thick-film resistor paste and preparation method thereof |
| CN107032623A (en) * | 2017-02-20 | 2017-08-11 | 江苏瑞德新能源科技有限公司 | A kind of lead-free glass powder used for solar batteries and positive silver paste |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4529960A (en) * | 1983-05-26 | 1985-07-16 | Alps Electric Co., Ltd. | Chip resistor |
| JPS6290905A (en) * | 1985-05-29 | 1987-04-25 | 株式会社明電舎 | Manufacture of voltage nonlinear resistance element |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3015621B2 (en) * | 1993-05-10 | 2000-03-06 | 松下電器産業株式会社 | Conductive paste composition |
-
1997
- 1997-06-24 KR KR1019970026694A patent/KR100268699B1/en not_active IP Right Cessation
- 1997-06-25 CN CN97115541A patent/CN1090368C/en not_active Expired - Lifetime
- 1997-06-25 SG SG1997002149A patent/SG63719A1/en unknown
- 1997-12-03 TW TW086108882A patent/TW533433B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4529960A (en) * | 1983-05-26 | 1985-07-16 | Alps Electric Co., Ltd. | Chip resistor |
| JPS6290905A (en) * | 1985-05-29 | 1987-04-25 | 株式会社明電舎 | Manufacture of voltage nonlinear resistance element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305077C (en) * | 2002-11-25 | 2007-03-14 | Tdk株式会社 | Conductive composition and ceramic electronic element |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100268699B1 (en) | 2000-11-01 |
| KR980007893A (en) | 1998-03-30 |
| CN1182941A (en) | 1998-05-27 |
| TW533433B (en) | 2003-05-21 |
| SG63719A1 (en) | 1999-03-30 |
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