KR980005911A - How to make scribe line - Google Patents

How to make scribe line Download PDF

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Publication number
KR980005911A
KR980005911A KR1019960022865A KR19960022865A KR980005911A KR 980005911 A KR980005911 A KR 980005911A KR 1019960022865 A KR1019960022865 A KR 1019960022865A KR 19960022865 A KR19960022865 A KR 19960022865A KR 980005911 A KR980005911 A KR 980005911A
Authority
KR
South Korea
Prior art keywords
scribe line
layer
manufacturing
interface
stacked
Prior art date
Application number
KR1019960022865A
Other languages
Korean (ko)
Inventor
권병인
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019960022865A priority Critical patent/KR980005911A/en
Publication of KR980005911A publication Critical patent/KR980005911A/en

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

본 발명은 반도체 소자의 재조공정에서 웨이퍼의 패턴 정렬을 검사하는 정렬 마크가 형성되는 스크라이브 라인의 제작방법을 개시한다. 이방법은 스크라이브 라인과 다이의 계면에 임의 반도체 소자의 제조순서에 따라서 순차적으로 적층되는 층을 스크라이브 라인과 생산품 다이와의 경게층으로 사용하는 스크라이브 라인의 제작방법에 있어서, 적층되는 각 층의 프레임 사이즈를 상부층으로 갈수록 소정크기만큼 크게 형성하여, 마지막으로 적층된층이 스크라이브 라인과의 계면이 되는 것을 특징으로 한다.The present invention discloses a method for manufacturing a scribe line in which alignment marks for inspecting pattern alignment of a wafer are formed in a manufacturing process of a semiconductor device. This method is a method for manufacturing a scribe line using a layer sequentially stacked on the interface between a scribe line and a die according to the manufacturing order of an arbitrary semiconductor element as a hardening layer between the scribe line and the product die. Is formed as large as a predetermined size toward the upper layer, the last stacked layer is characterized in that the interface with the scribe line.

Description

스크라이브 라인 제작방법How to make scribe line

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 2 도는 본 발명의 실시예에 따른 스크라이브 라인 제작방법을 보여주는 공정 단면도.2 is a cross-sectional view showing a method for manufacturing a scribe line according to an embodiment of the present invention.

Claims (1)

스크라이브 라인과 다이의 계면에 임의 반도체 소자의 제조순서에 따라서 순차적으로 적층되는 층을 스크라이브 라인과 생산품 다이와의 경게층으로 사용하는 스크라이브 라인의 제작방법에 있어서, 적층되는 각 층의 프레임 사이즈를 상부층으로 갈수록 소정크기만큼 크게 형성하여, 마지막으로 적층된 층이 스크라이브 라인과의 계면이 되는 것을 특징으로 하는 스크라이브 라인의 제작방법.In the manufacturing method of the scribe line, in which a layer sequentially stacked on the interface between the scribe line and the die according to the fabrication order of the semiconductor element is used as a hardening layer between the scribe line and the product die, the frame size of each layer to be stacked is the upper layer. A method of manufacturing a scribe line, wherein the layer is formed as large as a predetermined size and the last stacked layer is an interface with the scribe line. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960022865A 1996-06-21 1996-06-21 How to make scribe line KR980005911A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960022865A KR980005911A (en) 1996-06-21 1996-06-21 How to make scribe line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960022865A KR980005911A (en) 1996-06-21 1996-06-21 How to make scribe line

Publications (1)

Publication Number Publication Date
KR980005911A true KR980005911A (en) 1998-03-30

Family

ID=66287480

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960022865A KR980005911A (en) 1996-06-21 1996-06-21 How to make scribe line

Country Status (1)

Country Link
KR (1) KR980005911A (en)

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