KR970077562A - Structure of inner lead plating layer for wire bonding - Google Patents

Structure of inner lead plating layer for wire bonding Download PDF

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Publication number
KR970077562A
KR970077562A KR1019960017952A KR19960017952A KR970077562A KR 970077562 A KR970077562 A KR 970077562A KR 1019960017952 A KR1019960017952 A KR 1019960017952A KR 19960017952 A KR19960017952 A KR 19960017952A KR 970077562 A KR970077562 A KR 970077562A
Authority
KR
South Korea
Prior art keywords
plating layer
inner lead
wire bonding
lead plating
inner leads
Prior art date
Application number
KR1019960017952A
Other languages
Korean (ko)
Inventor
홍성호
이상혁
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960017952A priority Critical patent/KR970077562A/en
Publication of KR970077562A publication Critical patent/KR970077562A/en

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Abstract

본 발명은 내부 리드의 말단부를 제외한 내부 리드의 상부면의 영역에 와이어 본딩을 위한 최소한의 크기로 Ag도금층을 형성하여 와이어 본딩을 위한 내부 리드의 Ag 도금층과 성형 수지 사이의 계면 박리를 줄여 반도체 칩 패키지의 신뢰성을 향상시킨다.The present invention forms an Ag plating layer with a minimum size for wire bonding in the area of the upper surface of the inner lead except for the terminal end of the inner lead to reduce the interface separation between the Ag plating layer of the inner lead and the molding resin for wire bonding, Thereby improving the reliability of the package.

Description

와이어 본딩용 내부 리드(inner lead)도금층의 구조Structure of inner lead plating layer for wire bonding

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명에 의한 와이어 본딩용 리드 도금층을 이용한 반도체 칩 패키지의 구조를 나타낸 단면도.FIG. 2 is a sectional view showing a structure of a semiconductor chip package using a lead plating layer for wire bonding according to the present invention. FIG.

Claims (1)

리드 프레임의 내부 리드들위에 각각 형성된 와이어 본딩용 도금층에 있어서, 상기 도금층이 상기 내부 리드들의 내측 말단부로부터 소정의 거리를 두고 상기 내부 리드들의 상부면위에 형성되는 것을 특징으로 하는 와이어 본딩용 내부 리드 도금층의 구조.`Wherein the plating layer is formed on an upper surface of the inner leads at a predetermined distance from an inner end portion of the inner leads, the plating layer being formed on the inner leads of the lead frame, Structure. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960017952A 1996-05-27 1996-05-27 Structure of inner lead plating layer for wire bonding KR970077562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960017952A KR970077562A (en) 1996-05-27 1996-05-27 Structure of inner lead plating layer for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960017952A KR970077562A (en) 1996-05-27 1996-05-27 Structure of inner lead plating layer for wire bonding

Publications (1)

Publication Number Publication Date
KR970077562A true KR970077562A (en) 1997-12-12

Family

ID=66220374

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017952A KR970077562A (en) 1996-05-27 1996-05-27 Structure of inner lead plating layer for wire bonding

Country Status (1)

Country Link
KR (1) KR970077562A (en)

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