KR970077562A - Structure of inner lead plating layer for wire bonding - Google Patents
Structure of inner lead plating layer for wire bonding Download PDFInfo
- Publication number
- KR970077562A KR970077562A KR1019960017952A KR19960017952A KR970077562A KR 970077562 A KR970077562 A KR 970077562A KR 1019960017952 A KR1019960017952 A KR 1019960017952A KR 19960017952 A KR19960017952 A KR 19960017952A KR 970077562 A KR970077562 A KR 970077562A
- Authority
- KR
- South Korea
- Prior art keywords
- plating layer
- inner lead
- wire bonding
- lead plating
- inner leads
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 내부 리드의 말단부를 제외한 내부 리드의 상부면의 영역에 와이어 본딩을 위한 최소한의 크기로 Ag도금층을 형성하여 와이어 본딩을 위한 내부 리드의 Ag 도금층과 성형 수지 사이의 계면 박리를 줄여 반도체 칩 패키지의 신뢰성을 향상시킨다.The present invention forms an Ag plating layer with a minimum size for wire bonding in the area of the upper surface of the inner lead except for the terminal end of the inner lead to reduce the interface separation between the Ag plating layer of the inner lead and the molding resin for wire bonding, Thereby improving the reliability of the package.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도는 본 발명에 의한 와이어 본딩용 리드 도금층을 이용한 반도체 칩 패키지의 구조를 나타낸 단면도.FIG. 2 is a sectional view showing a structure of a semiconductor chip package using a lead plating layer for wire bonding according to the present invention. FIG.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960017952A KR970077562A (en) | 1996-05-27 | 1996-05-27 | Structure of inner lead plating layer for wire bonding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960017952A KR970077562A (en) | 1996-05-27 | 1996-05-27 | Structure of inner lead plating layer for wire bonding |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970077562A true KR970077562A (en) | 1997-12-12 |
Family
ID=66220374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960017952A KR970077562A (en) | 1996-05-27 | 1996-05-27 | Structure of inner lead plating layer for wire bonding |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970077562A (en) |
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1996
- 1996-05-27 KR KR1019960017952A patent/KR970077562A/en not_active Application Discontinuation
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Legal Events
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WITN | Withdrawal due to no request for examination |