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Application filed by 김광호, 삼성전자 주식회사filedCritical김광호
Priority to KR1019900020180ApriorityCriticalpatent/KR920013676A/en
Publication of KR920013676ApublicationCriticalpatent/KR920013676A/en
광학창을 갖는 반도체장치의 조립방법Assembly method of semiconductor device with optical window
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명의 광학창을 갖는 반도체장치의 측면도.1 is a side view of a semiconductor device having an optical window of the present invention.
Claims (2)
광학창을 갖는 반도체장치에 있어서, 웨이퍼에서 개별칩을 분리하는 단계, 개별칩을 리드프레임패드에 본딩하는 단계, 칩상의 본딩패드를 리드에 와이어로 본딩하는 단계, 레진벽이 형성된 광학창을 웨이퍼상의 본딩패드와 컬러필터 사이의 공간에 탑재하는 단계 및 몰딩하는 단계로 이루어진 것을 특징으로 하는 광학창을 갖는 반도체장치의 조립방법.A semiconductor device having an optical window, comprising: separating individual chips from a wafer, bonding the individual chips to a leadframe pad, bonding the bonding pads on the chip with wires to the leads, and forming an optical window having a resin wall on the wafer A method of assembling a semiconductor device having an optical window, comprising: mounting in a space between the bonding pad and the color filter on the upper surface and molding.제1항에 있어서, 레진벽은 저융점의 접착제로 이루어진 것을 특징으로 하는 광학창을 갖는 반도체장치의 조립방법.The method of assembling a semiconductor device with an optical window according to claim 1, wherein the resin wall is made of a low melting point adhesive.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019900020180A1990-12-081990-12-08
Assembly method of semiconductor device with optical window
KR920013676A
(en)