KR970077258A - Semiconductor wafer cleaning apparatus - Google Patents

Semiconductor wafer cleaning apparatus Download PDF

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Publication number
KR970077258A
KR970077258A KR1019960014234A KR19960014234A KR970077258A KR 970077258 A KR970077258 A KR 970077258A KR 1019960014234 A KR1019960014234 A KR 1019960014234A KR 19960014234 A KR19960014234 A KR 19960014234A KR 970077258 A KR970077258 A KR 970077258A
Authority
KR
South Korea
Prior art keywords
hand
wafer
driving
cleaning apparatus
supporting arm
Prior art date
Application number
KR1019960014234A
Other languages
Korean (ko)
Other versions
KR100205238B1 (en
Inventor
남창현
고용선
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960014234A priority Critical patent/KR100205238B1/en
Publication of KR970077258A publication Critical patent/KR970077258A/en
Application granted granted Critical
Publication of KR100205238B1 publication Critical patent/KR100205238B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Abstract

본 발명은 반도체소자의 제조장비중에서 공정의 진행중 발생한 웨이퍼 표면의 오염을 제거하기 위한 세정장치에 있어서 웨이퍼를 원하는 위치로 정확히 이송시켜줄 수 있도록 한 것으로, 본 발명에 따른 웨이퍼 세정장치는 웨이퍼를 홀딩하는 핸드가 상기 핸드 지지아암의 길이 방향으로 이동되도록 동작시키는 구동수단과; 세정조내에 투입되는 웨이퍼의 위치와 상기 핸드의 위치를 검출하는 검출수단과; 상기 검출수단에서 출력된 신호를 통하여 웨이퍼가 정확히 이송되어 공정을 안정적으로 진행시켜 줌으로써 웨이퍼의 정렬 미스로 인한 장비의 가동중지를 방지하고 방지의 가동효율을 높여 제품의 수율을 향상시킬 수 있도록 한 것이다.The present invention relates to a cleaning apparatus for removing contamination of a surface of a wafer during a process of manufacturing a semiconductor device so as to accurately transfer the wafer to a desired position. The wafer cleaning apparatus according to the present invention comprises: A driving means for operating the hand to move in the longitudinal direction of the hand supporting arm; Detecting means for detecting the position of the wafer inserted into the cleaning tank and the position of the hand; The wafer is accurately conveyed through the signal output from the detection means to stably advance the process, thereby preventing the device from being shut down due to misalignment of the wafer, improving the operation efficiency of the prevention, and improving the yield of the product .

Description

반도체 웨이퍼 세정장치Semiconductor wafer cleaning apparatus

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2A도 및 제2B도는 각각 본 발명에 따른 세정장치에 사용되는 웨이퍼 이송시스템의 구성을 나타낸 정면도 및 측면도.2A and 2B are a front view and a side view, respectively, showing a configuration of a wafer transfer system used in a cleaning apparatus according to the present invention.

Claims (5)

복수의 웨이퍼(100)를 홀딩하여 약액이 채워진 공정처리조에 투입되는 한쌍의 핸드(10)와, 상기 핸드를 지지하는 핸드 지지아암(20)와, 상기 핸드 지지아암이 고정되어 웨이퍼를 일정위치로 이송시켜 주는 몸체(30)를 구비한 웨이퍼 이송시스템을 포함하는 반도체 웨이퍼 세정장치에 있어서, 상기 핸드(10)가 사기 핸드 지지아암(20)의 길이 방향으로 이동되도록 동작시키는 구동수단과; 공정처리조내에 투입되는 웨이퍼(100)의 위치와 상기 핸드(10)의 위치를 검출하는 검출수단(50)과; 상기 검출수단에서 출력된 신호를 통하여 웨이퍼(100)가 상기 구동수단에 의해 정확한 위치에 정렬되도록 제어하는 제어수단(60)을 포함하는 것을 특징으로 하는 반도체 웨이퍼 세정장치.A pair of hands 10 which hold a plurality of wafers 100 and are charged into a chemical processing tank filled with a chemical solution; a hand supporting arm 20 for supporting the hand; (10) is moved in the longitudinal direction of the fragile hand supporting arm (20); and a driving mechanism for driving the semiconductor wafer cleaner A detecting means (50) for detecting the position of the wafer (100) and the position of the hand (10) inserted into the processing tank; And control means (60) for controlling the wafer (100) to be aligned at the correct position by the driving means through the signal outputted from the detection means. 제1항에 있어서, 상기 구동수단은 구동모터(41)와, 상기 핸드 지지아암(20)에 길이방향으로 설치되어 상기 구동모터(41)의 회전축에 연결되어 회전하는 스크류 샤프트(42)와, 상기 스크류 샤프트에 상기 핸드(10)의 일단을 연결되어 스크류 샤프트(42)의 회전시 상기 핸드(10)가 핸드 지지아암(20)의 길이방향으로 슬라이드 이동되도록 하는 것을 특징으로 하는 반도체 웨이퍼 세정장치.The driving device according to claim 1, wherein the driving means comprises a driving motor, a screw shaft installed longitudinally on the hand supporting arm and connected to the rotating shaft of the driving motor, One end of the hand 10 is connected to the screw shaft so that the hand 10 is slid in the longitudinal direction of the hand supporting arm 20 when the screw shaft 42 rotates. . 제2항에 있어서, 상기 구동모터(41)는 스테핑 모터와 서보모터 중 어느 하나를 사용한 것을 특징으로 하는 반도체 웨이퍼 세정장치.The semiconductor wafer cleaning apparatus according to claim 2, wherein the drive motor (41) uses either a stepping motor or a servo motor. 제1항에 있어서, 상기 검출수단(50)은 상기 핸드 지지아암(20)에 카메라를 설치하여 웨이퍼의 위치 및 수량을 감지하고, 감지된 신호가 상기 제어수단(60)으로 출력되도록 하는 것을 특징으로 하는 반도체 웨이퍼 세정장치.2. The apparatus according to claim 1, wherein the detection means (50) is provided with a camera on the hand support arm (20) to detect the position and quantity of the wafer, and to output the sensed signal to the control means To the semiconductor wafer cleaning apparatus. 제1항에 있어서, 상기 제어수단(60)은 초기 정렬시 웨이퍼(100) 및 핸드(10)의 위치 데이터를 상기 카메라를 통하여 설정하고, 이후 웨이퍼의 각 단계별 공정 처리조로 이송시 설정된 데이터와 상기 카메라에 의해 감지된 실제 웨이퍼 및 핸드의 위치 데이터가 서로 일치하도록 상기 구동모터(41)를 동작시켜 웨이퍼가 일정한 위치에 정렬되도록 하는 것을 특징으로 하는 반도체 웨이퍼 세정장치.2. The method according to claim 1, wherein the control means (60) sets the position data of the wafer (100) and the hand (10) during the initial alignment through the camera, And the drive motor (41) is operated so that the wafer is aligned at a predetermined position so that the actual wafer and the hand position data sensed by the camera coincide with each other. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960014234A 1996-05-02 1996-05-02 A wafer cleaning apparatus KR100205238B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960014234A KR100205238B1 (en) 1996-05-02 1996-05-02 A wafer cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960014234A KR100205238B1 (en) 1996-05-02 1996-05-02 A wafer cleaning apparatus

Publications (2)

Publication Number Publication Date
KR970077258A true KR970077258A (en) 1997-12-12
KR100205238B1 KR100205238B1 (en) 1999-07-01

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Application Number Title Priority Date Filing Date
KR1019960014234A KR100205238B1 (en) 1996-05-02 1996-05-02 A wafer cleaning apparatus

Country Status (1)

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Publication number Publication date
KR100205238B1 (en) 1999-07-01

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