KR970077136A - Wafer edge grinding device with wafer chuck - Google Patents
Wafer edge grinding device with wafer chuck Download PDFInfo
- Publication number
- KR970077136A KR970077136A KR1019960015556A KR19960015556A KR970077136A KR 970077136 A KR970077136 A KR 970077136A KR 1019960015556 A KR1019960015556 A KR 1019960015556A KR 19960015556 A KR19960015556 A KR 19960015556A KR 970077136 A KR970077136 A KR 970077136A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- upper portion
- chuck
- edge grinding
- wafer chuck
- Prior art date
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
본 발명은 웨이퍼 척을 갖춘 웨이퍼 에지 그라인딩 장치에 관한 것으로, 본 발명에 따른 웨이퍼 에지 그라인딩 장치는 웨이퍼를 직접 홀딩하기 위하여 복수의 진공홀이 형성되어 있고, 웨이퍼와 동일하거나 큰 지름과, 웨이퍼와 동일한 형상을 가지는 상부와, 상기 상부보다 작은 지름을 가지고, 상기 상부의 저면에서 상기 상부를 지지하는 하부를 포함하는 웨이퍼 척을 포함한다. 본 발명에 의하면, 그라인드되는 웨이퍼에지에서의 두께를 균일하게 하고, 또한 웨이퍼 에지 두께가 얇아지는 것을 방지하여 웨이퍼 파손을 방지하고, 후속 공정을 용이하게 할 수 있다.The present invention relates to a wafer edge grinding apparatus having a wafer chuck, and a wafer edge grinding apparatus according to the present invention includes a plurality of vacuum holes for directly holding a wafer, and has a diameter equal to or larger than that of the wafer, And a wafer chuck having a smaller diameter than the upper portion and a lower portion supporting the upper portion at the bottom surface of the upper portion. According to the present invention, it is possible to uniformize the thickness of the wafer edge to be ground, prevent wafer edge thickness from being thinned, prevent wafer breakage, and facilitate the subsequent process.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제4도는 본 발명에 따른 웨이퍼 에지 그라인딩 장치의 요부를 개략적으로 도시한 것이다.FIG. 4 schematically shows a main part of a wafer edge grinding apparatus according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960015556A KR970077136A (en) | 1996-05-11 | 1996-05-11 | Wafer edge grinding device with wafer chuck |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960015556A KR970077136A (en) | 1996-05-11 | 1996-05-11 | Wafer edge grinding device with wafer chuck |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970077136A true KR970077136A (en) | 1997-12-12 |
Family
ID=66219495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960015556A KR970077136A (en) | 1996-05-11 | 1996-05-11 | Wafer edge grinding device with wafer chuck |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970077136A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101247065B1 (en) * | 2006-01-30 | 2013-03-25 | 엠이엠씨 일렉트로닉 머티리얼즈, 인크. | Double side wafer grinder and methods for assessing workpiece nanotopology |
-
1996
- 1996-05-11 KR KR1019960015556A patent/KR970077136A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101247065B1 (en) * | 2006-01-30 | 2013-03-25 | 엠이엠씨 일렉트로닉 머티리얼즈, 인크. | Double side wafer grinder and methods for assessing workpiece nanotopology |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |