KR970053165A - Known good die manufacturing device in which the bonding pad and the inner lead are electrically connected directly - Google Patents

Known good die manufacturing device in which the bonding pad and the inner lead are electrically connected directly Download PDF

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Publication number
KR970053165A
KR970053165A KR1019950049661A KR19950049661A KR970053165A KR 970053165 A KR970053165 A KR 970053165A KR 1019950049661 A KR1019950049661 A KR 1019950049661A KR 19950049661 A KR19950049661 A KR 19950049661A KR 970053165 A KR970053165 A KR 970053165A
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KR
South Korea
Prior art keywords
chip holder
electrically connected
chip
lead frame
bonding pad
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Application number
KR1019950049661A
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Korean (ko)
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KR0169819B1 (en
Inventor
정도수
정현조
손해정
장형찬
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김광호
삼성전자 주식회사
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Priority to KR1019950049661A priority Critical patent/KR0169819B1/en
Publication of KR970053165A publication Critical patent/KR970053165A/en
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Publication of KR0169819B1 publication Critical patent/KR0169819B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 노운 굿 다이 제조 장치에 관한 것으로, 노운 굿 다이 제조에 있어서 와이어 본딩법을 사용하지 않고, 베어 칩의 본딩 패드들과 그들에 대응된 리드 프레임의 내부리드들을 각기 기계적 접촉에 의해 전기적 연결함으로써, 상기 와이어 본딩법에 의한 불량을 근본적으로 제거하는 동시에 고 단가의 리드프레임을 반 영구적으로 재사용할 수 있기 때문에 저 단가 및 고 수율의 노운 굿 다이를 제조 할 수 있는 특징을 갖는다.The present invention relates to a known good die manufacturing apparatus, and does not use a wire bonding method in manufacturing a good good die, and electrically connects bonding pads of a bare chip and internal leads of a lead frame corresponding thereto by mechanical contact, respectively. By doing so, it is possible to fundamentally eliminate the defects by the wire bonding method, and at the same time, it is possible to reuse the lead frame of a high unit cost semi-permanently, so that it is possible to manufacture a low cost and a high yield of a known good die.

Description

본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이(Known good die) 제조 장치Known good die manufacturing device in which the bonding pad and the inner lead are electrically connected directly

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2a도는 본 발명의 일 실시예에 의한 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치로써, 상부의 칩 홀더 캡이 제거된 상태를 나타내는 평면도.Figure 2a is a top good die manufacturing apparatus in which the bonding pad and the inner lead is directly electrically connected according to an embodiment of the present invention, a plan view showing a state in which the upper chip holder cap is removed.

제2b도는 제 2a도의 B-B' 선 단면도.FIG. 2B is a cross-sectional view taken along the line B-B 'of FIG. 2A.

Claims (9)

칩 홀더 베이스와; 그 칩 홀더 베이스의 일면 상에 안착되어 있으며, 복수개의 본딩 패드들을 갖는 칩과; 상기 칩 홀더 베이스의 일면 상에 적층되어 있으며, 회로 패턴들과, 그 회로 패턴들과 각기 전기적 연결되어 있으며 외부 전자 장치에 접속되는 전기적 연결부를 갖는 인쇄회로기판과; 그 회로 패턴들에 대응된 일단들이 전기적 연결된 내부리드들을 갖으며, 상기 인쇄회로기판의 일면에 접착된 리드프레임과; 그 리드프레임의 다른 면과 접착되어 있으며, 상기 칩 홀더 베이스와 한 쌍을 이루는 칩 홀더 캡과; 상기 한 쌍을 이루는 칩 홀더 베이스와 상기 칩 홀더 캡을 고정하는 클램프를 포함하고, 상기 리드프레임의 내부리드들의 다른 선단과 그들에 각기 대응된 칩의 본딩 패드들이 직접 기계적 접촉되어 전기적 연결되는 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이(known good die) 제조 장치.A chip holder base; A chip seated on one surface of the chip holder base and having a plurality of bonding pads; A printed circuit board stacked on one surface of the chip holder base and having circuit patterns and electrical connections respectively connected to the circuit patterns and connected to an external electronic device; A lead frame having one end corresponding to the circuit patterns having internal leads electrically connected to one surface of the printed circuit board; A chip holder cap bonded to the other side of the lead frame and paired with the chip holder base; And a clamp for fixing the pair of chip holder base and the chip holder cap, wherein the other ends of the inner leads of the lead frame and the bonding pads of the chips respectively corresponding thereto are directly connected in electrical contact with each other. Known good die manufacturing apparatus in which a bonding pad and an inner lead are directly electrically connected to each other. 제1항에 있어서, 상기 칩 홀더 베이스의 상면 상에 적층되는 인쇄회로기판과 상기 칩 홀더 캡의 정렬을 위하여 각기 정렬 홈들이 형성되어 그 정렬 구멍들에 각기 대응된 정렬 핀들이 삽입된 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.The method of claim 1, wherein the alignment grooves are formed to align the printed circuit board and the chip holder cap stacked on the upper surface of the chip holder base, and the corresponding alignment pins are inserted into the alignment holes. Noun good die manufacturing apparatus in which the bonding pad and the inner lead is electrically connected directly. 제1항에 있어서, 상기 칩 홀더 캡의 일면과 상기 리드프레임의 다른 면 사이에 완충제가 개재된 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.The apparatus of claim 1, wherein a buffer is interposed between one surface of the chip holder cap and the other surface of the lead frame. 제3항에 있어서, 상기 완충제의 재질이 엘라스토머인 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.The apparatus of claim 3, wherein the bonding pad and the inner lead are directly electrically connected to each other, wherein the buffer material is an elastomer. 제1항에 있어서, 상기 리드프레임의 내부리드들 상면에 범프가 형성된 것을 특징으로 하는 본딩패드와 내부리드가 직접 전기적 연결된 노운 굿 다이 제조 장치.2. The apparatus of claim 1, wherein bumps are formed on upper surfaces of the inner leads of the lead frame. 제1항에 있어서, 상기 칩의 본딩 패드들의 상면에 범프가 형성된 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.2. The apparatus of claim 1, wherein bumps are formed on upper surfaces of the bonding pads of the chip. 제1항에 있어서, 상기 내부리드들의 일 선단과 상기 회로 패턴들을 전기적 연결하는 수단이 전도성이 양호한 범프인 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.The apparatus of claim 1, wherein the bonding pad and the inner lead are directly electrically connected to each other, wherein one end of the inner leads and the means for electrically connecting the circuit patterns are bumps having good conductivity. 제1항에 있어서, 상기 내부리드들의 일 선단과 상기 회로 패턴들을 전기적 연결하는 수단이 솔더인 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.The apparatus of claim 1, wherein the bonding pad and the inner lead are directly electrically connected to each other by means of solder. 제1항에 있어서, 상기 리드프레임의 내부리드들이 상기 칩의 본딩 패드들에 각기 직접 기계적 접촉되도록 그 칩의 상부면 상까지 연장·형성된 것을 특징으로 하는 본딩 패드와 내부리드가 직접 전기적 연결되는 노운 굿 다이 제조 장치.The furnace of claim 1, wherein the inner lead of the lead frame extends and is formed on the upper surface of the chip so as to be in direct mechanical contact with the bonding pads of the chip. Good die manufacturing device. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950049661A 1995-12-14 1995-12-14 Apparatus for fabricating known good die KR0169819B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950049661A KR0169819B1 (en) 1995-12-14 1995-12-14 Apparatus for fabricating known good die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950049661A KR0169819B1 (en) 1995-12-14 1995-12-14 Apparatus for fabricating known good die

Publications (2)

Publication Number Publication Date
KR970053165A true KR970053165A (en) 1997-07-29
KR0169819B1 KR0169819B1 (en) 1999-02-18

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