KR970048627U - 전력용 반도체소자의 조립구조 - Google Patents

전력용 반도체소자의 조립구조

Info

Publication number
KR970048627U
KR970048627U KR2019950040704U KR19950040704U KR970048627U KR 970048627 U KR970048627 U KR 970048627U KR 2019950040704 U KR2019950040704 U KR 2019950040704U KR 19950040704 U KR19950040704 U KR 19950040704U KR 970048627 U KR970048627 U KR 970048627U
Authority
KR
South Korea
Prior art keywords
semiconductor device
power semiconductor
assembly structure
assembly
power
Prior art date
Application number
KR2019950040704U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019950040704U priority Critical patent/KR970048627U/ko
Publication of KR970048627U publication Critical patent/KR970048627U/ko

Links

KR2019950040704U 1995-12-13 1995-12-13 전력용 반도체소자의 조립구조 KR970048627U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950040704U KR970048627U (ko) 1995-12-13 1995-12-13 전력용 반도체소자의 조립구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950040704U KR970048627U (ko) 1995-12-13 1995-12-13 전력용 반도체소자의 조립구조

Publications (1)

Publication Number Publication Date
KR970048627U true KR970048627U (ko) 1997-07-31

Family

ID=60874518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950040704U KR970048627U (ko) 1995-12-13 1995-12-13 전력용 반도체소자의 조립구조

Country Status (1)

Country Link
KR (1) KR970048627U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100560698B1 (ko) * 2004-06-18 2006-03-17 주식회사 대우일렉트로닉스 기판용 방열부재 구조

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100560698B1 (ko) * 2004-06-18 2006-03-17 주식회사 대우일렉트로닉스 기판용 방열부재 구조

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Legal Events

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