KR970028814A - Reticles for Semiconductor Device Manufacturing - Google Patents

Reticles for Semiconductor Device Manufacturing Download PDF

Info

Publication number
KR970028814A
KR970028814A KR1019950044265A KR19950044265A KR970028814A KR 970028814 A KR970028814 A KR 970028814A KR 1019950044265 A KR1019950044265 A KR 1019950044265A KR 19950044265 A KR19950044265 A KR 19950044265A KR 970028814 A KR970028814 A KR 970028814A
Authority
KR
South Korea
Prior art keywords
alignment mark
reticle
step alignment
semiconductor device
mark
Prior art date
Application number
KR1019950044265A
Other languages
Korean (ko)
Inventor
이경철
하헌환
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950044265A priority Critical patent/KR970028814A/en
Publication of KR970028814A publication Critical patent/KR970028814A/en

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

반도체 장치 제조에 사용되는 레티클(reticle)에 대하여 기재하고 있다. 본 발명은 소자 형성을 위한 메인 칩(main chip) 영역; 상기 칩 영역을 분리하는 스크라이브 라인(scribe line)영역; 및 상기 스크라이브 라인의 외각에 위치하여 레티클과 노광장비간의 기준점을 설정해 주는 레티클 정렬마크(reticle alignment mark), 상기 레티클을 회전정렬시켜주는 스텝 정렬마크(step alignment mark) 및 상기 노광장비에 대해 이미 정렬되어 있는 레티클과 공정 웨이퍼를 정렬시키기 위한 웨이퍼 정렬마크(wafer alignment mark)로 구성된 레티클 마크를 구비하여 반도체 장치의 사진공정에 사용되는 레티클에 있어서, 상기 스텝 정렬마크는 형성 가능한 위치중의 최외각에 형성되는 것을 특징으로 하는 레티클을 제공한다. 본 발명에 의하면 스텝 정렬마크가 형성 가능한 위치 중의 최외각에 형성되므로 현미경으로 상기 스텝 정렬마크를 찾는 경우에 외곽부부터 검색하면 되므로 검색시간이 단축된다. 또한, 상기 스텝 정렬마크의 양변부에는 소자 명칭 및 스텝 정렬마크의 좌표, 또는 공정 명칭 및 스텝 정렬마크의 좌표가 형성되어 있으므로 일단 찾아낸 스텝 정렬마크를 신뢰하고 작업을 진행할 수 있다. 따라서, 사진공정의 작업성 및 생산성이 향상된다.A reticle used for manufacturing a semiconductor device is described. The present invention provides a main chip region for forming a device; A scribe line region separating the chip region; And a reticle alignment mark positioned at an outer surface of the scribe line to set a reference point between the reticle and the exposure apparatus, a step alignment mark for rotating the reticle, and an alignment with respect to the exposure apparatus. A reticle for use in the photographic process of a semiconductor device having a reticle mark composed of a reticle and a wafer alignment mark for aligning the process wafer, wherein the step alignment mark is located at the outermost position of the position where the reticle can be formed. It provides a reticle characterized in that it is formed. According to the present invention, since the step alignment mark is formed at the outermost position among the positions where the step alignment mark can be formed, the search time can be shortened since the step alignment mark can be searched from the outer part when searching for the step alignment mark with a microscope. In addition, since both sides of the step alignment mark are formed with the coordinates of the device name and the step alignment mark, or the coordinates of the process name and the step alignment mark, the step alignment mark once found can be reliably processed. Therefore, workability and productivity of the photographic process are improved.

Description

반도체 장치 제조용 레티클(reticle)Reticles for Semiconductor Device Manufacturing

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 레티클의 일 실시예를 도시한 레이아웃도.2 is a layout showing one embodiment of a reticle according to the present invention.

Claims (2)

소자 형성을 위한 메인 칩(main chip) 영역; 상기 칩 영역을 분리하는 스크라이브 라인(scribe line)영역; 및 상기 스트라이브 라인의 외각에 위치하여 레티클과 노광장비간의 기준점을 설정해주는 레티클 정렬마크(reticle alignment mark), 상기 레티클을 회전정렬시켜주는 스텝 정렬마크(step alignment mark) 및 상기 노광장비에 대해 이미 정렬되어 있는 레티클과 공정 웨이퍼를 정렬시키기 위한 웨이퍼 정렬마크(wafer alignment mark)로 구성된 레티클 마크를 구비하여 반도체 장치의 사진공정에 사용되는 레티클에 있어서, 상기 스텝 정렬마크는 형성 가능한 위치 중의 최외각에 형성되는 것을 특징으로 하는 레티클.A main chip region for device formation; A scribe line region separating the chip region; And a reticle alignment mark positioned at an outer side of the scribe line to set a reference point between the reticle and the exposure apparatus, a step alignment mark for rotating the reticle, and the exposure apparatus. A reticle for use in the photographic process of a semiconductor device having a reticle mark comprising an aligned reticle and a wafer alignment mark for aligning the process wafer, wherein the step alignment mark is located at the outermost position of the formable position. A reticle, characterized in that formed. 제1항에 있어서, 상기 스텝 정렬마크의 양변부에는 소자 명칭 및 스텝 정렬마크의 좌표, 또는 공정 명칭 및 스텝 정렬마크의 좌표가 형성되어 있는 것을 특징으로 하는 레티클.The reticle according to claim 1, wherein both sides of the step alignment mark are provided with coordinates of an element name and a step alignment mark, or coordinates of a process name and a step alignment mark. ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950044265A 1995-11-28 1995-11-28 Reticles for Semiconductor Device Manufacturing KR970028814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950044265A KR970028814A (en) 1995-11-28 1995-11-28 Reticles for Semiconductor Device Manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950044265A KR970028814A (en) 1995-11-28 1995-11-28 Reticles for Semiconductor Device Manufacturing

Publications (1)

Publication Number Publication Date
KR970028814A true KR970028814A (en) 1997-06-24

Family

ID=66588898

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950044265A KR970028814A (en) 1995-11-28 1995-11-28 Reticles for Semiconductor Device Manufacturing

Country Status (1)

Country Link
KR (1) KR970028814A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100699109B1 (en) * 2005-12-29 2007-03-21 동부일렉트로닉스 주식회사 Alignment mark of exposing equipment and measuring method for semiconductor manufacturing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100699109B1 (en) * 2005-12-29 2007-03-21 동부일렉트로닉스 주식회사 Alignment mark of exposing equipment and measuring method for semiconductor manufacturing

Similar Documents

Publication Publication Date Title
KR970022513A (en) Reticle for Semiconductor Device Manufacturing
KR970028814A (en) Reticles for Semiconductor Device Manufacturing
JPH07221166A (en) Alignment mark and electronic device having the same as well as manufacturing method thereof
KR960005756A (en) Photomask Manufacturing Method for Semiconductor Device Manufacturing
JPH0276214A (en) Alignment mark of glass mask in photolithography process
KR970076093A (en) Positioning of registration mark of photomask and exposure method using it
KR960039113A (en) How to form an alignment mark
KR920010808A (en) Semiconductor manufacturing process
KR950025861A (en) Photomask Manufacturing Method
KR960032580A (en) Reticle and manufacturing method of semiconductor device using same
KR970028813A (en) Reticle for Semiconductor Device Manufacturing
KR970051937A (en) Method for forming focusing pattern in semiconductor device having multilayer wiring structure
KR970023615A (en) Semiconductor chip
KR960008983A (en) Automatic alignment of wafers and masks
KR970048936A (en) Semiconductor manufacturing method
KR980005307A (en) Pattern alignment method of semiconductor device
JPH088309A (en) Semiconductor chip
KR950027967A (en) How to make photomask
KR950027935A (en) Photomask Manufacturing Method to Improve Overlay Margin
KR960026539A (en) Semiconductor device manufacturing method
KR970022506A (en) Photomask
KR970030390A (en) A wafer structure for a semiconductor device
KR970053172A (en) Method of forming pad part of semiconductor device
KR960026088A (en) Wafer Edge Treatment
KR970023797A (en) Semiconductor device manufacturing method

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination