KR970023797A - Semiconductor device manufacturing method - Google Patents
Semiconductor device manufacturing method Download PDFInfo
- Publication number
- KR970023797A KR970023797A KR1019950037800A KR19950037800A KR970023797A KR 970023797 A KR970023797 A KR 970023797A KR 1019950037800 A KR1019950037800 A KR 1019950037800A KR 19950037800 A KR19950037800 A KR 19950037800A KR 970023797 A KR970023797 A KR 970023797A
- Authority
- KR
- South Korea
- Prior art keywords
- etching
- wafer
- semiconductor device
- entire surface
- protection film
- Prior art date
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- Drying Of Semiconductors (AREA)
- Weting (AREA)
Abstract
반도체장치의 제조에서 문제가 되는 이물질의 발생을 방지하는 방법이 개시되어 있다.A method of preventing the generation of foreign matters that is problematic in the manufacture of semiconductor devices is disclosed.
본 발명은 반도체장치의 제조방법에 있어서 에지부를 제외한 웨이퍼 전면에 에칭보호막을 형성시키는 단계, 에지부를 제외한 전면에 에칭보호막이 형성된 웨이퍼를 전면에 걸쳐 에칭하는 단계 및 상기 에칭 후 남아있는 에칭보호막을 제거하는 단계를 구비하여 이루어진 웨이퍼 에지 에칭공정을 구비함을 특징으로 한다. 따라서, 반도체장치의 제조과정에서 이물질의 발생을 방지하는 효과가 있다.The present invention provides a method of manufacturing a semiconductor device, comprising: forming an etching protective film on the entire surface of the wafer except for the edge portion, etching the wafer having the etching protective film on the entire surface except the edge portion, and removing the etching protection film remaining after the etching. It characterized in that it comprises a wafer edge etching process comprising a step. Therefore, there is an effect of preventing the generation of foreign substances in the manufacturing process of the semiconductor device.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도 내지 제4도는 본 발명의 특징을 이루는 웨이퍼 에지 에칭(wafer etching)공정을 나타낸 공정도이다.1 through 4 are process diagrams showing a wafer edge etching process which is a feature of the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950037800A KR970023797A (en) | 1995-10-28 | 1995-10-28 | Semiconductor device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950037800A KR970023797A (en) | 1995-10-28 | 1995-10-28 | Semiconductor device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970023797A true KR970023797A (en) | 1997-05-30 |
Family
ID=66584663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950037800A KR970023797A (en) | 1995-10-28 | 1995-10-28 | Semiconductor device manufacturing method |
Country Status (1)
Country | Link |
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KR (1) | KR970023797A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100420559B1 (en) * | 2001-01-15 | 2004-03-02 | 삼성전자주식회사 | Semiconductor manufacturing method for reducing particle |
-
1995
- 1995-10-28 KR KR1019950037800A patent/KR970023797A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100420559B1 (en) * | 2001-01-15 | 2004-03-02 | 삼성전자주식회사 | Semiconductor manufacturing method for reducing particle |
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