KR970024117A - Semiconductor package and manufacturing method - Google Patents

Semiconductor package and manufacturing method Download PDF

Info

Publication number
KR970024117A
KR970024117A KR1019950037210A KR19950037210A KR970024117A KR 970024117 A KR970024117 A KR 970024117A KR 1019950037210 A KR1019950037210 A KR 1019950037210A KR 19950037210 A KR19950037210 A KR 19950037210A KR 970024117 A KR970024117 A KR 970024117A
Authority
KR
South Korea
Prior art keywords
lead
mold
semiconductor chip
semiconductor package
parallel
Prior art date
Application number
KR1019950037210A
Other languages
Korean (ko)
Inventor
정하천
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950037210A priority Critical patent/KR970024117A/en
Publication of KR970024117A publication Critical patent/KR970024117A/en

Links

Abstract

외부리드가 몰드의 바닥면에 평행하게 부착된 반도체 패키지 및 그 제조방법이 개시되어 있다.Disclosed are a semiconductor package in which an external lead is attached in parallel to a bottom surface of a mold, and a method of manufacturing the same.

본 발명의 반도체 패키지는, 다이 패드상에 탑재된 반도체 칩과, 일단부가 상기 반도체 칩과 전기적으로 접속되어 있는 갈매기 날개 형상의 리드와, 상기 리드의 타단부가 외부로 도출되는 형태로 상기 반도체 칩 및 리드의 일부를 봉합하는 몰드를 구비하여 이루어지는 반도체 패키지에 있어서, 상기 몰드의 바닥면은 평탄면으로 되어 있으며, 상기 리드의 타단부는 상기 몰드의 바닥면상에 바닥면에 대하여 평행하게 부착되어 있는 것을 특징으로 한다.The semiconductor package of the present invention includes a semiconductor chip mounted on a die pad, a gull-shaped lead whose one end is electrically connected to the semiconductor chip, and the other end of the lead being drawn outward. And a mold for sealing a part of the lid, wherein the bottom surface of the mold is a flat surface, and the other end of the lead is attached to the bottom surface of the mold in parallel with the bottom surface. It is characterized by.

따라서, 트리밍공정과 포밍고정이 삭제되어 불량 발생이 줄어 원가절감의 효과가 있다.Therefore, the trimming process and the forming fixing is eliminated, thereby reducing the occurrence of defects, thereby reducing the cost.

Description

반도체 패키지 및 그 제조방법Semiconductor package and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명의 일 실시예를 구현하기 위하여 미리 형성된 리드프레임 구조를 나타낸 개략도이다.2 is a schematic view showing a leadframe structure formed in advance to implement an embodiment of the present invention.

제3도는 본 발명의 일 실시예에 의한 반도체 패키지를 나타내는 개략도이다.3 is a schematic view showing a semiconductor package according to an embodiment of the present invention.

Claims (2)

다이 패드상에 탑재된 반도체 칩과, 일단부가 상기 반도체 칩과 전기적으로 접속되어 있는 갈매기 날개 형상의 리드와, 상기 리드의 타단부가 외부로 도출되는 형태로 상기 반도체 칩 및 리드의 일부를 봉합하는 몰드를 구비하여 이루어지는 반도체 패키지에 있어서, 상기 몰드의 바닥면은 평탄면으로 되어 있으며, 상기 리드의 타단부는 상기 몰드의 바닥면상에 바닥면에 대하여 평행하게 부착되어 있는 것을 특징으로 하는 반도체 패키지.A semiconductor chip mounted on a die pad, one end portion of which is electrically connected to the semiconductor chip, and a seagull-shaped lead, and the other end portion of the lead is sealed to the outside in such a manner that the semiconductor chip and a part of the lead are sealed. A semiconductor package comprising a mold, wherein the bottom surface of the mold is a flat surface, and the other end of the lead is attached to the bottom surface of the mold in parallel with the bottom surface. 리드프레임으로 다시 패드 및 갈매기 날개 형상의 리드를 미리 제작하는 단계; 상기 다이 패드상에 반도체 칩을 다이 어태치한 후 상기 반도체 칩과 상기 리드의 내부리드를 전기적으로 접속하는 와이어 본딩 단계; 상기 리드의 외부리드가 몰드의 바닥면상에 바닥면에 대하여 평행하게 부착될 수 있도록 몰딩하는 단계; 및 상기 리드프레임을 컷팅하는 단계; 를 포함하여 이루어지는 것을 특징으로 하는 반도체 패키지 제조방법.Preparing a lead of pad and gull wing shapes in advance with a lead frame; A wire bonding step of electrically attaching the semiconductor chip to an internal lead of the lead after die attaching the semiconductor chip on the die pad; Molding the outer lead of the lid to be attached on the bottom surface of the mold in parallel with the bottom surface; And cutting the lead frame; A semiconductor package manufacturing method comprising a. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950037210A 1995-10-25 1995-10-25 Semiconductor package and manufacturing method KR970024117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950037210A KR970024117A (en) 1995-10-25 1995-10-25 Semiconductor package and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950037210A KR970024117A (en) 1995-10-25 1995-10-25 Semiconductor package and manufacturing method

Publications (1)

Publication Number Publication Date
KR970024117A true KR970024117A (en) 1997-05-30

Family

ID=66584525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950037210A KR970024117A (en) 1995-10-25 1995-10-25 Semiconductor package and manufacturing method

Country Status (1)

Country Link
KR (1) KR970024117A (en)

Similar Documents

Publication Publication Date Title
KR960009136A (en) Semiconductor package and manufacturing method
KR950009988A (en) Resin-sealed semiconductor device
KR960015827A (en) Semiconductor device and manufacturing method thereof
KR970053703A (en) Clip-type leadframe and manufacturing method of the package using the same
KR960019676A (en) Resin-sealed semiconductor device and manufacturing method thereof
KR960036007A (en) Resin-sealed semiconductor device and manufacturing method thereof
KR970700369A (en) Integrated circuit package and manufacturing method
KR970024110A (en) Semiconductor device and method of manufacturing same (SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME)
KR970024117A (en) Semiconductor package and manufacturing method
KR920007155A (en) Semiconductor device and manufacturing method thereof
KR910001949A (en) Flagless Leadframes, Packages and Methods
JPH04340751A (en) Plastic molded type semiconductor device
JPH03105950A (en) Package of semiconductor integrated circuit
KR0127237B1 (en) Plastic semiconductor package and the manufacture method
KR970008530A (en) Surface-mount leadframes, semiconductor packages using the same, and manufacturing methods thereof
KR970053630A (en) BLP package and its manufacturing method
KR0152953B1 (en) Semiconductor package leadframe
KR200177346Y1 (en) Semiconductor package
KR970053646A (en) Semiconductor package and manufacturing method
JPH05243464A (en) Lead frame and plastic molded type semiconductor device using the same
KR970053658A (en) Multilayer semiconductor package and manufacturing method thereof
KR950034719A (en) Lead frame and package device manufacturing method including the lead frame
KR950015731A (en) Package for semiconductor device and manufacturing method thereof
JPH09129803A (en) Hall element and its manufacture
JPS6123347A (en) Semiconductor device

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination