KR970024061A - Semiconductor chip package in which semiconductor chips are fixed by tie bars - Google Patents
Semiconductor chip package in which semiconductor chips are fixed by tie bars Download PDFInfo
- Publication number
- KR970024061A KR970024061A KR1019950038160A KR19950038160A KR970024061A KR 970024061 A KR970024061 A KR 970024061A KR 1019950038160 A KR1019950038160 A KR 1019950038160A KR 19950038160 A KR19950038160 A KR 19950038160A KR 970024061 A KR970024061 A KR 970024061A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor chip
- chip package
- tie bar
- fixed
- semiconductor
- Prior art date
Links
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- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 반도체 칩 패키지에 관한 것으로, 더욱 상세하게는 타이바에 반도체 칩을 고정하므로써 반도체 칩 패키지의 박형화 및 소형화를 시키기 위한 반도체 칩이 타이바에 고정되어 있는 반도체 칩 패키지에 관한 것이다.The present invention relates to a semiconductor chip package, and more particularly, to a semiconductor chip package in which a semiconductor chip for thinning and miniaturizing a semiconductor chip package by fixing the semiconductor chip to a tie bar is fixed to the tie bar.
본 발명은, 일측에 타이 바를 구비하고 중앙부에 다이패드를 구비하는 리드 프레임 및 상기 다이패드의 상부에 반도체 칩이 실장되는 반도체 칩 패키지에 있어서, 상기 반도체 칩이 상기 타이바의 하부에 부착 고정되도록 형성함을 특징으로 하는 반도체 칩이 타이바에 의해 고정되어 있는 반도체 칩 패키지를 제공한다.The present invention provides a lead frame having a tie bar at one side and a die pad at a center thereof, and a semiconductor chip package in which a semiconductor chip is mounted on an upper portion of the die pad, such that the semiconductor chip is attached and fixed to a lower portion of the tie bar. It provides a semiconductor chip package characterized in that the semiconductor chip is fixed by a tie bar.
따라서, 본 발명에 따른 구조에 따르면, 타이바에 반도체 칩을 고정시킴으로써 반도체 칩 패키지의 박형화, 소형화할 수 있는 효과가 있으며, 반도체 칩에서 발생하는 열의 방출이 원할하게 함으로써 반도체 칩 패키지의 생산성을 향상시킬 수 있는 이점(利點)이 있다.Therefore, according to the structure according to the present invention, by fixing the semiconductor chip to the tie bar, there is an effect that the semiconductor chip package can be thinned and downsized, and the emission of heat generated from the semiconductor chip can be smoothed to improve the productivity of the semiconductor chip package. There is an advantage to this.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 2A 도는 본 발명의 반도체 칩이 타이바에 의해 고정된 반도체 칩 패키지의 구조를 보여주는 단면도.2A is a cross-sectional view showing a structure of a semiconductor chip package in which a semiconductor chip of the present invention is fixed by tie bars.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950038160A KR970024061A (en) | 1995-10-30 | 1995-10-30 | Semiconductor chip package in which semiconductor chips are fixed by tie bars |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950038160A KR970024061A (en) | 1995-10-30 | 1995-10-30 | Semiconductor chip package in which semiconductor chips are fixed by tie bars |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970024061A true KR970024061A (en) | 1997-05-30 |
Family
ID=66584373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950038160A KR970024061A (en) | 1995-10-30 | 1995-10-30 | Semiconductor chip package in which semiconductor chips are fixed by tie bars |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970024061A (en) |
-
1995
- 1995-10-30 KR KR1019950038160A patent/KR970024061A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |