KR970013151A

KR970013151A - Positioning of semiconductor chip packages in-tray handling

Info

Publication number: KR970013151A
Application number: KR1019950025681A
Authority: KR
Inventors: 박광준; 이재일; 최상영
Original assignee: 김광호; 삼성전자 주식회사
Priority date: 1995-08-21
Filing date: 1995-08-21
Publication date: 1997-03-29

Abstract

본 발명은 반도체 칩 패키지가 각각의 포켓에 탑재된 트레이를 콘베이어 벨트로 이송하여 스테이션상에 안착시킨 후 그 트레이의 저부면의 한 꼭지점만이 공정을 위한 설비의 본체의 표면에 접하도록 그 스테이션을 경사지게 하여 그 트레이에 탑재된 반도체 칩 패키지들을 확실하게 정렬시키고 또한, 그 경사진 스테이션을 진동시켜 그 트레이에 탑재된 반도체 칩 패키지들을 확실하게 정렬시킴과 아울러 그 정렬 속도는 가속화시킨다. 따라서, 본 발명은 마킹 또는 외관검사와 같이 트레이 상태로 핸들링되는 반도체 칩 패키지를 정렬시켜 마킹 불량을 감소시키고, 마킹 검사시의 정상적으로 마킹된 반도체 칩 패키지의 불량화 처리를 방지할 수 있다. 그리고, 본 발명은 자동광학검사를 할 때 CCD카메라나 레이저 스캐너의 반도체 칩 패키지의 위치 탐색을 용이하게 하여 자동광학검사를 정확성을 향상시킴으로써 반도체 칩 패키지의 외관검사의 에러발생률을 감소시킨다.The present invention transfers a tray in which a semiconductor chip package is mounted in each pocket to a conveyor belt and seats it on a station so that only one vertex of the bottom surface of the tray contacts the surface of the main body of the equipment for the process. Inclination ensures alignment of the semiconductor chip packages mounted on the tray, and vibration of the inclined station ensures alignment of the semiconductor chip packages mounted on the tray, while accelerating the alignment speed. Therefore, the present invention can align the semiconductor chip package handled in the tray state, such as marking or visual inspection, to reduce marking defects, and to prevent the deterioration process of the normally marked semiconductor chip package during marking inspection. In addition, the present invention facilitates the position search of the semiconductor chip package of the CCD camera or the laser scanner during the automatic optical inspection, thereby improving the accuracy of the automatic optical inspection, thereby reducing the error occurrence rate of the external inspection of the semiconductor chip package.

Description

Positioning of semiconductor chip packages in-tray handling

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명의 실시예에 의한 트레이 상태로 핸들링되는(in-tray handling) 반도체 칩 패키지의 위치 정렬방법을 설명하기 위한 일예로서, 포켓내에 반도체 칩 패키지를 탑재한 트레이가 스테이션상에 안착된 상태를 나타낸 사시도,3 is a view illustrating a method of aligning a semiconductor chip package in-tray handling according to an embodiment of the present invention, wherein a tray having a semiconductor chip package in a pocket is seated on a station. Perspective view showing the state,

제4(A)도 및 제4(B)도는 제3도의 스테이션의 꼭지점(a)을 기준으로 경사진 상태를 각각 나타내는 정면도 및 측면도.4 (A) and 4 (B) are front and side views respectively showing inclined states with respect to the vertex (a) of the station of FIG.

Claims

A method of aligning a semiconductor chip package handled in a tray state, the method comprising: transferring the tray and feeding the tray onto a station of an apparatus of a desired process; and tilting the station to align each semiconductor chip package mounted on the tray. A method of aligning a semiconductor chip package handled in a tray state comprising the step.

The method of claim 1 wherein the station is inclined such that only one point of the station contacts the surface of the body of the device.

3. The method of claim 2, comprising vibrating the inclined station to align each of the semiconductor chip packages.

A method of aligning a semiconductor chip package handled in a tray state according to claim 1, wherein the tray put on the station is fixed by a fixing pin of the upper surface of the station.