KR970012999A - Wafer & Bonding Equipment - Google Patents

Wafer & Bonding Equipment Download PDF

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Publication number
KR970012999A
KR970012999A KR1019950028481A KR19950028481A KR970012999A KR 970012999 A KR970012999 A KR 970012999A KR 1019950028481 A KR1019950028481 A KR 1019950028481A KR 19950028481 A KR19950028481 A KR 19950028481A KR 970012999 A KR970012999 A KR 970012999A
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KR
South Korea
Prior art keywords
wafer
vacuum chamber
wafers
material plate
bonding apparatus
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Application number
KR1019950028481A
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Korean (ko)
Other versions
KR0155873B1 (en
Inventor
차기호
이병훈
강치중
이경욱
Original Assignee
김광호
삼성전자 주식회사
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Priority to KR1019950028481A priority Critical patent/KR0155873B1/en
Publication of KR970012999A publication Critical patent/KR970012999A/en
Application granted granted Critical
Publication of KR0155873B1 publication Critical patent/KR0155873B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼 접합장치에 관한 것으로, 웨이퍼 접합시에 요구되는 분위기를 조절하는 콘트롤러 박스와, 상기 콘트롤러 박스로부터 조절된 분위기하에서 웨이퍼 접합을 실질적으로 진행시키는 진공챔버와, 상기 콘트롤러 박스와 진공 챔버 사이에 위치하여 웨이퍼를 진공 챔버내로 장착 혹은 탈착시키는 웨이퍼 캐리어와, 상기 웨이퍼 캐리어를 구동시키는 모터부와, 접합하기 위한 두 웨이퍼의 얼라인먼트 정밀도를 높이기 위하여 상기 진공 챔버에 장착된 사이드 얼라이너 내부에 장착된 웨이퍼 홀더를 구비하는 것을 특징으로 한다. 따라서 본 발명은, 기가급 메모리공정에서 절대적으로 필요한 얼라인먼트 정밀도를 높일 수 있을 뿐만 아니라, 웨이퍼 접합시에 필요한 분위기를 조성할 수 있는 진공 챔버를 구비함으로써 평탄화시 잔류하는 단차를 포함하는 패터닝된 웨이퍼를 쉽게 접합시킬 수 있다.The present invention relates to a wafer bonding apparatus, comprising: a controller box for adjusting an atmosphere required for wafer bonding, a vacuum chamber for substantially advancing wafer bonding under an atmosphere controlled from the controller box, and between the controller box and the vacuum chamber. A wafer carrier mounted on or in the vacuum chamber, a motor unit driving the wafer carrier, and a side aligner mounted in the vacuum chamber to increase alignment accuracy of two wafers for bonding. And a wafer holder. Accordingly, the present invention provides a patterned wafer including a step remaining during planarization by providing a vacuum chamber that can not only increase the alignment accuracy absolutely required in a giga-class memory process but also create an atmosphere required for wafer bonding. It can be easily bonded.

Description

웨이퍼 접합장치Wafer Bonding Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의한 웨이퍼 접합장치를 나타낸 개략적인 단면도이다.1 is a schematic cross-sectional view showing a wafer bonding apparatus according to the present invention.

제2A도는 본 발명에 의한 웨이퍼 홀더를 나타낸 정면도이다.2A is a front view showing a wafer holder according to the present invention.

제2B도는 본 발명에 의한 웨이퍼 홀더를 나타낸 측면도이다.2B is a side view showing the wafer holder according to the present invention.

제3도는 본 발명에 의한 사이드 얼라이너를 나타낸 평면도이다.3 is a plan view showing a side aligner according to the present invention.

Claims (9)

웨이퍼 접합시에 요구되는 분위기를 조절하는 콘트롤러 박스; 상기 콘트롤러 박스로 부터 조절된 분위기하에서 웨이퍼 접합을 실질적으로 진행시키는 진공 챔버; 상기 콘트롤러 박스와 진공 챔버 사이에 위치하여 웨이퍼를 진공 챔버내로 장착 혹은 탈착시키는 웨이퍼 캐리어; 상기 웨이퍼 캐리어를 구동시키는 모터부; 및 접합하기 위한 두 웨이퍼의 얼라인먼트 정밀도를 높이기 위하여 상기 진공 챔버에 장착된 사이드 얼라이너와 내부에 장착된 웨이퍼 홀더를 구비하는 것을 특징으로 하는 웨이퍼 접합장치.A controller box for adjusting an atmosphere required for wafer bonding; A vacuum chamber to substantially advance wafer bonding under a controlled atmosphere from the controller box; A wafer carrier positioned between the controller box and the vacuum chamber to mount or detach the wafer into the vacuum chamber; A motor unit driving the wafer carrier; And a side aligner mounted in the vacuum chamber and a wafer holder mounted therein to increase the alignment accuracy of the two wafers for bonding. 제1항에 있어서, 상기 사이드 얼라이너는 상기 진공 챔버 바닥에 고정되어 있는 LN 가이드와 연결된 얼라이너 월과, 상기 얼라이너 월에 연결되어 이 얼라이너 월을 양쪽에서 밀어주는 역할을 하는 에어실린더와, 상기 얼라이너 월의 중심에 위치하여 접합이 될 두 웨이퍼가 로딩시 혹은 진공 작동시 순간적으로 접합이 되는 경우를 방지하기 위한 분리 핀을 구비하는 것을 특징으로 하는 웨이퍼 접합장치.According to claim 1, wherein the side aligner is an aligner wall connected to the LN guide which is fixed to the bottom of the vacuum chamber, an air cylinder connected to the aligner wall and serves to push the aligner wall from both sides, And a separating pin positioned at the center of the aligner wall to prevent the two wafers to be bonded from being instantaneously bonded during loading or vacuum operation. 제2항에 있어서, 상기 분리 핀은 웨이퍼의 에지쪽만 닿도록 제작됨으로써 접합이 이루어질 때까지 두 웨이퍼를 일정간격으로 유지할 수 있는 것을 특징으로 하는 웨이퍼 접합장치.The wafer bonding apparatus of claim 2, wherein the separation pins are formed to only touch the edges of the wafers, thereby maintaining the two wafers at a predetermined interval until the bonding is performed. 제3항에 있어서, 상기 분리 핀이 닿는 웨이퍼의 에지쪽은 에지그라인딩을 이용하여 약 5mm 정도 그라인딩 된 것을 특징으로 하는 웨이퍼 접합장치.4. The wafer bonding apparatus according to claim 3, wherein the edge side of the wafer where the separation pin touches is ground about 5 mm using edge grinding. 제2항 또는 제3항에 또는 제4항에 있어서, 상기 분리 핀의 재료는 SUS304인 것을 특징으로 하는 웨이퍼 접합장치.The wafer bonding apparatus according to claim 2, 3, or 4, wherein the separation pin is made of SUS304. 제1항에 있어서, 상기 웨이퍼 홀더는 글래스 종류의 표면 거칠기가 좋은 제1물질 플레이트와, 상기 제1물질 플레이트 밑에 웨이퍼 홀더 바닥면과의 미끄러짐을 방지하기 위한 제2물질 플레이트가 상기 웨이퍼 홀더에 끼워져 있고, 상기 제1물질 플레이트 및 제2물질 플레이트의 변형을 방지하기 위하여 상기 플레이트의 양쪽에 나사를 고정하여 이루어진 것을 특징으로 하는 웨이퍼 접합장치.The wafer holder of claim 1, wherein the wafer holder includes a first material plate having a good surface roughness of a glass type, and a second material plate inserted into the wafer holder to prevent sliding of the wafer holder bottom surface under the first material plate. And fixing screws to both sides of the plate to prevent deformation of the first material plate and the second material plate. 제6항에 있어서, 상기 제1물질 플레이트는 코닝 글래스 또는 석영이고, 상기 제2물질 플레이트는 알루미늄 플레이트인 것을 특징으로 하는 웨이퍼 접합장치.7. The wafer bonding apparatus according to claim 6, wherein the first material plate is corning glass or quartz, and the second material plate is aluminum plate. 제6항에 있어서, 상기 웨이퍼 홀더내에 장착되는 웨이퍼 표면과 수직방향으로의 웨이퍼 홀더 내부의 폭은, 접합하고자 하는 두 웨이퍼 두께의 합에 근사치 값인 것을 특징으로 하는 웨이퍼 접합장치.The wafer bonding apparatus according to claim 6, wherein the width of the inside of the wafer holder perpendicular to the wafer surface mounted in the wafer holder is an approximation to the sum of the thicknesses of the two wafers to be bonded. 제8항에 있어서, 상기 접합하고자 하는 두 웨이퍼의 벌어지는 각도는, 중심에서 각 웨이퍼의 방향으로 4씩인 것을 특징으로 하는 웨이퍼 접합장치.The wafer bonding apparatus according to claim 8, wherein a spreading angle of the two wafers to be bonded is four in the direction of each wafer from the center.
KR1019950028481A 1995-08-31 1995-08-31 Wafer boding machine KR0155873B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950028481A KR0155873B1 (en) 1995-08-31 1995-08-31 Wafer boding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950028481A KR0155873B1 (en) 1995-08-31 1995-08-31 Wafer boding machine

Publications (2)

Publication Number Publication Date
KR970012999A true KR970012999A (en) 1997-03-29
KR0155873B1 KR0155873B1 (en) 1998-12-01

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359029B1 (en) * 2000-10-25 2002-10-31 주식회사 서울베큠테크 Sliding type wafer bonding device with automatic spacer push and pull
KR20020032042A (en) * 2000-10-25 2002-05-03 최우범 Adjustable cone-type probe of wafer bonding chuck

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KR0155873B1 (en) 1998-12-01

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