KR970011204U - 반도체 제조시의 와이어본딩 공정용 히터블록 자동소제 장치 - Google Patents

반도체 제조시의 와이어본딩 공정용 히터블록 자동소제 장치

Info

Publication number
KR970011204U
KR970011204U KR2019950020078U KR19950020078U KR970011204U KR 970011204 U KR970011204 U KR 970011204U KR 2019950020078 U KR2019950020078 U KR 2019950020078U KR 19950020078 U KR19950020078 U KR 19950020078U KR 970011204 U KR970011204 U KR 970011204U
Authority
KR
South Korea
Prior art keywords
cleaning device
wire bonding
semiconductor manufacturing
bonding process
heater block
Prior art date
Application number
KR2019950020078U
Other languages
English (en)
Other versions
KR0127354Y1 (ko
Inventor
이재용
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950020078U priority Critical patent/KR0127354Y1/ko
Publication of KR970011204U publication Critical patent/KR970011204U/ko
Application granted granted Critical
Publication of KR0127354Y1 publication Critical patent/KR0127354Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019950020078U 1995-08-03 1995-08-03 반도체 제조시의 와이어본딩 공정용 히터블록 자동소제 장치 KR0127354Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950020078U KR0127354Y1 (ko) 1995-08-03 1995-08-03 반도체 제조시의 와이어본딩 공정용 히터블록 자동소제 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950020078U KR0127354Y1 (ko) 1995-08-03 1995-08-03 반도체 제조시의 와이어본딩 공정용 히터블록 자동소제 장치

Publications (2)

Publication Number Publication Date
KR970011204U true KR970011204U (ko) 1997-03-29
KR0127354Y1 KR0127354Y1 (ko) 1998-12-01

Family

ID=19420133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950020078U KR0127354Y1 (ko) 1995-08-03 1995-08-03 반도체 제조시의 와이어본딩 공정용 히터블록 자동소제 장치

Country Status (1)

Country Link
KR (1) KR0127354Y1 (ko)

Also Published As

Publication number Publication date
KR0127354Y1 (ko) 1998-12-01

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