KR970015321U - 패키지 제조용 히터블럭 - Google Patents

패키지 제조용 히터블럭

Info

Publication number
KR970015321U
KR970015321U KR2019950024637U KR19950024637U KR970015321U KR 970015321 U KR970015321 U KR 970015321U KR 2019950024637 U KR2019950024637 U KR 2019950024637U KR 19950024637 U KR19950024637 U KR 19950024637U KR 970015321 U KR970015321 U KR 970015321U
Authority
KR
South Korea
Prior art keywords
heater block
package manufacturing
package
manufacturing
heater
Prior art date
Application number
KR2019950024637U
Other languages
English (en)
Other versions
KR0128208Y1 (ko
Inventor
이현일
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950024637U priority Critical patent/KR0128208Y1/ko
Publication of KR970015321U publication Critical patent/KR970015321U/ko
Application granted granted Critical
Publication of KR0128208Y1 publication Critical patent/KR0128208Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019950024637U 1995-09-13 1995-09-13 패키지 제조용 히터블럭 KR0128208Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950024637U KR0128208Y1 (ko) 1995-09-13 1995-09-13 패키지 제조용 히터블럭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950024637U KR0128208Y1 (ko) 1995-09-13 1995-09-13 패키지 제조용 히터블럭

Publications (2)

Publication Number Publication Date
KR970015321U true KR970015321U (ko) 1997-04-28
KR0128208Y1 KR0128208Y1 (ko) 1998-10-15

Family

ID=19423222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950024637U KR0128208Y1 (ko) 1995-09-13 1995-09-13 패키지 제조용 히터블럭

Country Status (1)

Country Link
KR (1) KR0128208Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100690244B1 (ko) * 2000-06-23 2007-03-12 삼성전자주식회사 추가의 가열수단이 구비된 본딩부를 포함하는 와이어 본딩장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100690244B1 (ko) * 2000-06-23 2007-03-12 삼성전자주식회사 추가의 가열수단이 구비된 본딩부를 포함하는 와이어 본딩장치

Also Published As

Publication number Publication date
KR0128208Y1 (ko) 1998-10-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050718

Year of fee payment: 8

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