KR970006270B1 - Impurity doping of semiconductor device - Google Patents
Impurity doping of semiconductor device Download PDFInfo
- Publication number
- KR970006270B1 KR970006270B1 KR94009712A KR19940009712A KR970006270B1 KR 970006270 B1 KR970006270 B1 KR 970006270B1 KR 94009712 A KR94009712 A KR 94009712A KR 19940009712 A KR19940009712 A KR 19940009712A KR 970006270 B1 KR970006270 B1 KR 970006270B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat treatment
- temperature
- doping
- gas
- impurity gas
- Prior art date
Links
- 239000012535 impurity Substances 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 7
- 238000000034 method Methods 0.000 abstract 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 3
- 229920005591 polysilicon Polymers 0.000 abstract 3
- 230000003247 decreasing effect Effects 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
A method of doping impurities for the purpose of uniformly distributing impurities in a polysilicon layer used as a conductive line in a semiconductor device includes the steps of loading a wafer on which a polysilicon layer 13 will be formed into a reaction chamber in which a predetermined temperature is maintained, and increasing the temperature up to a temperature for the first doping and heat treatment, injecting an impurity gas into the reaction chamber under the temperature for the first doping and heat treatment to carry out the first doping process, removing the impurity gas and performing the first heat treatment for a predetermined period of time under the ambient of N2 gas, decreasing the temperature below the temperature for the first doping and heat treatment, injecting an impurity gas into the reaction chamber to carry out the second doping process, removing the impurity gas and performing the second heat treatment for a predetermined period of time in the ambient of N2 gas, and doping and heat treatment are performed by a plurality number of times while gradually decreasing the temperature by a predetermined level and performing heat treatment for a predetermined period of time, to allow uniform concentration distribution to be made in the polysilicon layer 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94009712A KR970006270B1 (en) | 1994-05-03 | 1994-05-03 | Impurity doping of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94009712A KR970006270B1 (en) | 1994-05-03 | 1994-05-03 | Impurity doping of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950034628A KR950034628A (en) | 1995-12-28 |
KR970006270B1 true KR970006270B1 (en) | 1997-04-25 |
Family
ID=19382421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR94009712A KR970006270B1 (en) | 1994-05-03 | 1994-05-03 | Impurity doping of semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970006270B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101293102B1 (en) | 2006-11-09 | 2013-08-12 | 삼성전자주식회사 | Apparatus for splitting signal and video apparatus thereof |
-
1994
- 1994-05-03 KR KR94009712A patent/KR970006270B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950034628A (en) | 1995-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57126127A (en) | Diffusion treating method for semiconductor wafer | |
US4661177A (en) | Method for doping semiconductor wafers by rapid thermal processing of solid planar diffusion sources | |
TW350102B (en) | Semiconductor device manufacturing method | |
KR0166587B1 (en) | Impurity doping apparatus | |
JPS5514839A (en) | Treating method for ion nitriding | |
JPS5588323A (en) | Manufacture of semiconductor device | |
KR970006270B1 (en) | Impurity doping of semiconductor device | |
US3476619A (en) | Semiconductor device stabilization | |
KR950004387A (en) | Deposition and Oxidation Methods of High Capacity Semiconductor Dopants | |
JPS571252A (en) | Semiconductor device | |
JPS6437028A (en) | Manufacture of semiconductor element | |
JPS5721825A (en) | Increasing method for gettering effect due to internal defect in semiconductor substrate | |
JPS57194525A (en) | Manufacture of semiconductor device | |
CA2031417A1 (en) | Method of producing mis transistor having gate electrode of matched conductivity type | |
JPS6489371A (en) | Manufacture of semiconductor storage device | |
JPS6362326A (en) | Manufacture of semiconductor device | |
JPS5544701A (en) | Manufacturing transistor | |
JP4370696B2 (en) | Semiconductor wafer processing method | |
JPS5555524A (en) | Method of manufacturing semiconductor device | |
JPS6453553A (en) | Hydrogen treatment of thin film transistor | |
JPS5745227A (en) | Manufacture of semiconductor device | |
KR19980029056A (en) | Semiconductor device manufacturing method | |
JPS5772340A (en) | Quality evaluating method for single crystal silicon wafer | |
JPS57181128A (en) | Manufacture of semiconductor device | |
JPS5754366A (en) | Manufacture of semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20100726 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |