KR970003198Y1 - Passive lighy and emitted light device lead frame connect structure of phtocoupler - Google Patents
Passive lighy and emitted light device lead frame connect structure of phtocoupler Download PDFInfo
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- KR970003198Y1 KR970003198Y1 KR2019910019404U KR910019404U KR970003198Y1 KR 970003198 Y1 KR970003198 Y1 KR 970003198Y1 KR 2019910019404 U KR2019910019404 U KR 2019910019404U KR 910019404 U KR910019404 U KR 910019404U KR 970003198 Y1 KR970003198 Y1 KR 970003198Y1
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- lead frame
- light emitting
- light receiving
- chip
- phtocoupler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
내용없음.None.
Description
제1a, b, c도는 종래 리드프레임의 수광 및 발광칩 연결 예시도.Figure 1a, b, c is a view showing the light receiving and light emitting chip connection of the conventional lead frame.
제2a, b, c, d도는 수광부만 갖는 종래 리드프레임의 구성도.2a, b, c, and d are structural views of a conventional lead frame having only a light receiving unit.
제3a, b, c, d도는 발광부만 갖는 종래 리드프레임의 구성도.3a, b, c, and d are structural views of a conventional lead frame having only a light emitting portion.
제4도는 종래 발광 및 수광부만 갖는 리드프레임을 상호 연결시킨 상태도.4 is a state in which a lead frame having only a light emitting and a light receiving unit is connected to each other.
제5도는 본 고안의 리드프레임 평면도.5 is a plan view of the lead frame of the present invention.
제6도는 본 고안 리드프레임에서 발광측과 수광측을 상호 연결시킨 상태도.6 is a state in which the light emitting side and the light receiving side are interconnected in the lead frame of the present invention.
제7도는 본 고안의 수광리드프레임(10)를 90도 회전시킨 상태도.7 is a state in which the light receiving lead frame 10 of the present invention is rotated 90 degrees.
제8도는 본 고안에 의해 제작된 포토커플러의 예시도.8 is an exemplary view of a photocoupler manufactured by the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
2 : 발광칩 3 : 수광칩2: light emitting chip 3: light receiving chip
10 : 수광부 리드프레임 10A : 구멍10: light receiver lead frame 10A: hole
20 : 발광부 리드프레임 20A : 볼록부20: light emitting part lead frame 20A: convex part
본 고안은 수광소자 및 발광소자가 한 패키지로된 광학분리기인 포토커플러(Photo Coupler)를 제조하기 위한 리드프레임의 연결구조에 관한 것으로 특히, 수광 및 발광소자의 중심축이 서로 일치하도록하여 이들을 제조상 간단히 할 수 있도록 한 수광 및 발광소자 리드프레임의 연결구조에 관한 것이다.The present invention relates to a connection structure of a lead frame for manufacturing a photo coupler, which is an optical separator in which a light receiving element and a light emitting element are packaged, in particular, so that the central axes of the light receiving and light emitting elements coincide with each other. It relates to a connection structure of a light receiving and light emitting device lead frame to simplify.
통산적으로 포토커플러는 수광소자와 발광소자가 한 패키지내에 만들어진 광반도체 소자로 입력과 출력이 전기적으로는 절연되어 있지만 광학적으로는 결합된 일종의 분리기(Isolator)로 입출력 접속기(I/O interface)나 전원부의 분리기로 또한 탑재기기는 FA기기나 계측기로부터 컴퓨터, 전화관련기기로 확대되고 있으며, 더구나 텔레비젼, 에어콘 등의 가전제품에 이르기까지 그 용가 다양해지고 있다.In general, a photocoupler is an optical semiconductor element in which a light receiving element and a light emitting element are formed in one package. Although the input and output are electrically insulated, it is an optically coupled type of isolator, which is an I / O interface or an I / O interface. As a separator for the power supply unit, the onboard equipment is being expanded from FA equipment and measuring equipment to computers and telephone-related equipment. Moreover, its use is diversified to household appliances such as TVs and air conditioners.
제1도는 종래의 한 리드프레임상에 수광칩 및 발광칩이 함께 부착되어 설치된 것을 나타내고 있다.1 shows that a light receiving chip and a light emitting chip are attached together on a conventional lead frame.
한편, 제3도는 종래 수광부 리드프레임, 발광부 리드프레임이 각각 하나씩 구성되어 있는 것을 예시하고 있다.On the other hand, Figure 3 illustrates that the conventional light receiving unit lead frame and the light emitting unit lead frame are each configured one by one.
제1도의 경우, 각각의 칩부착(다이본딩) 및 결선(와이어본딩)후, 발광칩(2)위에 1차 수지를 주입시키고 절연필름(4) 부착후, 발광칩(2) 부착부위는 헤드부분만을 제1도의 (a)에서 (b)도 상태로 회전시킴으로써 수광칩(3) 및 발광칩(2)을 서로 마주보도록 한다.In the case of FIG. 1, after each chip bonding (die bonding) and wiring (wire bonding), the primary resin is injected onto the light emitting chip 2 and the insulating film 4 is attached, and then the light emitting chip 2 is attached to the head. Only the portion is rotated in the state of FIGS. 1A to 1B so that the light receiving chip 3 and the light emitting chip 2 face each other.
제1도의 (c)는 서로 마주보도록한 수광 및 발광칩(2, 3)의 상태를 나타내는 요부측면도이다.(C) of FIG. 1 is a principal side view showing the state of light receiving and light emitting chips 2 and 3 facing each other.
이에 대한 공정순서를 더욱 상세히 설명하면 각각의 칩부착후, 와이어 결선을 하고, 발광칩(2)에 1차 수지 주입한 후, 절연필름(4)을 부착하고 타이바를 절단한 후 발광칩(2)을 15도, 90도, 165도, 그리고 최종적으로 180도 회전시킨다. 그런후 2차수지를 주입하여 최종적으로 물딩하면 제1도의 (c)와 같은 상태가 된다. 제2도는 수광칩(3)이 부착되는 수광부반을 갖는 리드프레임(1A)을 나타낸 것으로 (a)는 리드프레임에 대한 전체 평면도, (b)는 (a)의 측면도이고, (c)는 리드프레임(1A)에 수광칩(3)을 부착한 상태, (d)는 와이어 결선한 상태를 나타낸다.In order to explain the process in more detail, after each chip is attached, the wires are connected, the primary resin is injected into the light emitting chip 2, the insulating film 4 is attached and the tie bars are cut, and then the light emitting chip 2 is attached. ) Rotate it 15 degrees, 90 degrees, 165 degrees, and finally 180 degrees. Then, after the secondary resin is injected and finally watered, it is in the state as shown in FIG. 2 shows a lead frame 1A having a light receiving unit attached to a light receiving chip 3, (a) is an overall plan view of the lead frame, (b) is a side view of (a), and (c) is a lead The light receiving chip 3 is attached to the frame 1A, and (d) shows a wire connection state.
제3도는 발광칩(2)이 부착되는 수광부만을 갖는 리드프레임(1B)을 나타낸 것으로서, (a)는 리드프레임에 대한 전체 평면도, (b)는 (a)의 측면도, (c)는 리드프레임(1B)에 발광칩(2)을 부착한 상태, (d)는 와이어 (금선)결선한 상태를 나타낸다.3 shows a lead frame 1B having only a light receiving portion to which the light emitting chip 2 is attached, (a) is an overall plan view of the lead frame, (b) is a side view of (a), and (c) is a lead frame A state in which the light emitting chip 2 is attached to (1B), and (d) shows a state in which wires (gold wires) are connected.
즉 제2도 및 제3도의 경우엔 각각의 리드프레임에 수광칩, 발광칩을 부착하고 결선하며, 결선후 발광측 리드프레임(1B)에 수지를 주입하고 발광칩(2), 수광칩(3)이 서로 마주보도록 두 리드프레임(1A,1B)을 용접하므로써 일체화한다. 그리고 절연필름을 삽입하고 2차 수지주입하며 제품보호를 위해 제1도의 경우와 동일하게 예폭시몰딩 혼합물로 몰딩하고 트림 및 포밍(성형)으로 제품화 한다.That is, in the case of FIGS. 2 and 3, the light receiving chip and the light emitting chip are attached to each lead frame and connected. After connection, resin is injected into the light emitting side lead frame 1B, and the light emitting chip 2 and the light receiving chip 3 are connected. The two lead frames 1A and 1B are welded together so that they face each other. Then, the insulating film is inserted, the secondary resin is injected, and the product is molded into the epoxy molding mixture as in the case of FIG.
제4도는 수광부와 발광부가 각각 별개로 이루어진 리드프레임을 상호 결합시킨 상태를 나타낸 요부도이다.4 is a main view illustrating a state in which a light receiving unit and a light emitting unit are respectively coupled to each other by a lead frame.
그러나 제1도의 경우엔 발광칩(2)의 헤드부분만을 회전시킴으로써 회전시 칩(2) 및 금선(6)에 손상을 입히므로 제품에 악영향을 미치며, 제4도의 경우엔 각각의 리디프레임을 다시 일체화 하기위해 용접공정이 필요하며 양산적용시 적당치 못하다는 문제가 있다.However, in the case of FIG. 1, only the head portion of the light emitting chip 2 is rotated, thereby damaging the chip 2 and the gold wire 6 during rotation, which adversely affects the product. In the case of FIG. Welding process is required to integrate and there is a problem that it is not suitable for mass production.
그리고 제1도의 경우는 몰딩시 리드프레임의 흔들림으로 광축의 일치를 기대하기가 곤란하며 요동으로 두 금선(6,6)이 서로 부딪혀 소자(Device)로서의 기능에 좋지못한 결과를 가져오는 문제가 있다.In the case of FIG. 1, it is difficult to expect the optical axis to coincide with the shaking of the lead frame during molding, and the two gold wires 6 and 6 collide with each other due to rocking, resulting in a bad result for the function as a device. .
본 고안은 종래의 회전시 발생할 수 있는 칩 및 금선의 손상 및 불필요한 용접공정 등의 문제를 해소하고 양산적용이 가능토록한 포토커플러의 리드프레임 구조를 게종하는 것을 그 목적으로 한다.The object of the present invention is to solve the problems such as chip and gold wire damage and unnecessary welding process that can occur during the conventional rotation, and to replace the lead frame structure of the photocoupler to be mass-produced.
이하 본 고안의 구성을 첨부도면을 참조하여 상세히 설명하면 다음과 같다. 제5도에 있어서 한 리드프레임상에 수광부 리드프레임(10)과 발광부 리드프레임(20)을 설치하고 수광부 리드프레임(10)상에는 구멍(10A)을 형성하고, 발광부 리드프레임(20)상에는 볼록부(20A)를 형성시킨다.Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings. In FIG. 5, the light receiving part lead frame 10 and the light emitting part lead frame 20 are provided on one lead frame, and a hole 10A is formed on the light receiving part lead frame 10, and on the light emitting part lead frame 20. 20A of convex parts are formed.
그리하여 수고아부 리드프레임(10)만을 180도 회전시키도록하여 (제6도 참조)광축의 일치를 기하며, 몰딩시 리드프레임의 흔들림을 방지할 수 있다.Thus, only the hard part lead frame 10 is rotated by 180 degrees (see FIG. 6) so that the optical axis can be matched, and shaking of the lead frame can be prevented during molding.
상기한 본 고안의 구성에 의해 더욱 상세히 설명하면 제5도와 같이 한패키지 내에 수광칩, 발광칩 부착이 가능한 리드프레임으로 각각의 수광칩(3), 발광칩(2)을 부착하고 그리고 금선(와이어)(6) 결선을 한다. 결선후 발광칩(2)위에 수지(5)를 주입하고 수광부 리드프레임(10)을 제7도에 나타낸 바와같이 15도, 90도, 165도 및 180도 순차 회전함으로 제6도와같이 두 칩(2, 3)을 서로 광축으로 일치시키며, 제5도상의 수광부 리드프레임(10)의 구멍(10A)과 발광부 리드프레임(20)의 볼록부(20A)로 서로 결합시키므로써 제4도와같은 몰딩결과를 갖도록 한다.When described in more detail by the configuration of the present invention described above, the light receiving chip, the light emitting chip (2) attached to each of the light receiving chip, the light emitting chip in a package as shown in Fig. (6) Connect the wiring. After connection, resin 5 is injected onto the light emitting chip 2, and the light receiving unit leadframe 10 is sequentially rotated 15 degrees, 90 degrees, 165 degrees and 180 degrees as shown in FIG. 2 and 3 are aligned with each other by the optical axis, and the molding as shown in FIG. 4 is coupled to each other by the hole 10A of the light receiving part lead frame 10 and the convex part 20A of the light emitting part lead frame 20 on FIG. Have a result.
제8도는 상술한 본 고안의 리드프레임 구조에 의해 제작된 포토커플러를 예시한 것이다. 도면부호 7은 에폭시 몰딩혼합물이다. 물론 제품이 이루어지기까지는, 이 경우 역시 몰딩, 트림 및 포밍 공정을 거친후에 완성되는 것이다.8 illustrates a photocoupler manufactured by the above-described leadframe structure of the present invention. Reference numeral 7 denotes an epoxy molding mixture. Of course, until the product is made, it is also completed after the molding, trimming and forming process.
이상과 같이 본 고안은 수광부 리드프레임상에 구멍을 형성하고 발광부 리드프레임상에는 볼록부를 형성하여 수고아부 리드프레임만을 180도 회전시킴으로써 구멍과 볼록부가 서로 일치하도록 함으로 종래와 같은 용접공정이 필요없이 수광 및 발광축을 일치시킬 수 있을뿐만 아니라 또한 수광부 리드프레임 및 발광부 리드프레임이 서로 결합에 의해 연결되므로 몰딩시 리드를 흔들림을 방지할 수 있는 효과가 있다.As described above, the present invention forms a hole on the light receiving part lead frame, and a convex part is formed on the light emitting part lead frame so that only the hard part lead frame is rotated by 180 degrees so that the hole and the convex part coincide with each other. And since the light emitting unit lead frame and the light emitting unit lead frame are connected to each other by being coupled to each other, the light emitting axis can be prevented from shaking the lead during molding.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910019404U KR970003198Y1 (en) | 1991-11-14 | 1991-11-14 | Passive lighy and emitted light device lead frame connect structure of phtocoupler |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910019404U KR970003198Y1 (en) | 1991-11-14 | 1991-11-14 | Passive lighy and emitted light device lead frame connect structure of phtocoupler |
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| Publication Number | Publication Date |
|---|---|
| KR930012127U KR930012127U (en) | 1993-06-25 |
| KR970003198Y1 true KR970003198Y1 (en) | 1997-04-14 |
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| KR2019910019404U KR970003198Y1 (en) | 1991-11-14 | 1991-11-14 | Passive lighy and emitted light device lead frame connect structure of phtocoupler |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100242782B1 (en) * | 1995-09-07 | 2000-02-01 | 가네꼬 히사시 | Semiconductor device and control circuit therefor |
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1991
- 1991-11-14 KR KR2019910019404U patent/KR970003198Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100242782B1 (en) * | 1995-09-07 | 2000-02-01 | 가네꼬 히사시 | Semiconductor device and control circuit therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR930012127U (en) | 1993-06-25 |
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