JPS5896783A - Light-emitting diode - Google Patents

Light-emitting diode

Info

Publication number
JPS5896783A
JPS5896783A JP56195263A JP19526381A JPS5896783A JP S5896783 A JPS5896783 A JP S5896783A JP 56195263 A JP56195263 A JP 56195263A JP 19526381 A JP19526381 A JP 19526381A JP S5896783 A JPS5896783 A JP S5896783A
Authority
JP
Japan
Prior art keywords
pellet
light
lead frame
axis
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56195263A
Other languages
Japanese (ja)
Inventor
Yoshinobu Tashiro
田代　嘉宣
Fumio Minowa
箕輪　文雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp Japan Ltd, Infineon Technologies Americas Corp, International Rectifier Corp USA filed Critical International Rectifier Corp Japan Ltd
Priority to JP56195263A priority Critical patent/JPS5896783A/en
Publication of JPS5896783A publication Critical patent/JPS5896783A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To increase the degree of workability and to obtain a bidirectional photo output for the titled light-emitting diode by a method wherein a light- emitting pellet is attached to the surface part having a relatively wide width of a lead frame, and a resin molding process is performed generating lens surfaces respectively on the central-axis of the main surface of the pellet and on the vertical axis which passes the junction part on the side face. CONSTITUTION:A pellet 12 is installed on the head surface 11a of the lead frame 11, the surface of said pellet 12 and the head surface 13a of the lead frame 13 are bonded using a fine metal wire 14. Then, a molding process is performed on the circumference of the pellet 12 using light transmitting resin 17, and at this time, molding molds are to be designed in such a manner that the first convex lens surface 15 will be generated on the lens direct-axis l facing the junction part 12a forming surface of the pellet 12 and the second convex lens surface 16 will be generated on the axis m which coincides with the side face of the pellet 12, which is the junction part 12b. Then, the bidirectional output can be picked out from the lens surfaces 15 and 16 efficiently.

Description

【発明の詳細な説明】 本発明は、二方向の光出力を得られるようにした発光ダ
イオードにｔ％ｊする。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a light emitting diode capable of obtaining light output in two directions.

従来の発光ダイオードは、槙１図及び第２図に示すよう
な構造のものか一般的である。Conventional light emitting diodes generally have structures as shown in FIGS. 1 and 2.

すなわち、所定の大きさの頭部１ａ全形成したリードフ
レーム１の前記頭部１ａの端面に発光ペレット２を敗り
付け、このベレット２の表面と他方のリードフレーム３
の端１１１１とを金、試細線ｌｌにてワイヤボンデング
するかあるいは−へ２図ＶＣ示すように発光ペレット２
の両ｉ１＋ｉ　’ｆｔ）リードフレーム１及び３で挾ん
で固定したもの音光透過性樹脂で樹脂モールド５しであ
る。That is, a light emitting pellet 2 is applied to the end surface of the head 1a of the lead frame 1, which has a head 1a of a predetermined size, and the surface of the pellet 2 and the other lead frame 3 are
Wire bond the ends 1111 and 1111 of the luminous pellets 2 with a gold sample wire 11 or -2 as shown in Figure VC.
(i1+i'ft) is sandwiched and fixed between lead frames 1 and 3, and is molded with a resin mold 5 using a sound-light transmitting resin.

しかるに、−１１記ｉｆ’ｆ造の発光ダイオードにあっ
ては、発光ペレット２を幅の狭いリードフレーム１゜３
端面に取Ｖ付けなければならないこと、また第１図の構
造のものＶＣあっては、発光ペレット２と他方のリード
フレーム３と全金属細線４を用いてワイヤボイングしな
ければならないこと等で作業性が悪い。さらに発光ペレ
ット２からの光出力は、ＩＩ脂上モールド５レンズ面５
ａに向う一方向の出力のみであり、用途によっては不便
であった。However, in the case of a light emitting diode constructed in -11 if'f, the light emitting pellet 2 is mounted on a narrow lead frame 1°3.
A V must be attached to the end face, and if the VC has the structure shown in Fig. 1, wire bowing must be performed using the light emitting pellet 2, the other lead frame 3, and the all-metal thin wire 4, etc. Bad sex. Furthermore, the light output from the light emitting pellet 2 is
The output is only in one direction toward a, which is inconvenient depending on the application.

本発明は、十躬、の事情に基づきなされたもので、リー
ドフレームの比較的幅の広い表面部に発光ペレノトヲ取
り付け、かつこのベレットの主面に対する中心軸−１−
及び側面接合部を通過する鉛直軸」二にそれぞれレンズ
面が形成されるように樹脂モールドし、作業性の改善と
二方向の光出力を得られるようにした発光ダイオードを
提（ｔｌ：する。The present invention has been made based on the following circumstances: a light-emitting pellet is attached to a relatively wide surface portion of a lead frame, and the central axis -1- with respect to the main surface of the pellet.
We present a light emitting diode which is resin-molded so that lens surfaces are formed on each of the vertical axis and the vertical axis passing through the side joint, thereby improving workability and providing light output in two directions.

以下に、本発明の一実施例を図面全参照（７て説明する
。An embodiment of the present invention will be described below with full reference to the drawings.

第３図及び第４図において、リードフレーム１１の頭部
表面ｌｅａ上に発光ペレノ）］２ｉ取りｔｌける。In FIGS. 3 and 4, a light emitting device 2i is formed on the head surface lea of the lead frame 11.

このペレノｌ１２の表面と他方のリードフレーム１３の
＠部表面１．３ａと全金属細線１４全ワイヤボンデング
する。The surface of this pereno l12 and the @-portion surface 1.3a of the other lead frame 13 are wire-bonded to the entire thin metal wire 14.

しかる後、光透過性樹脂にて樹脂モールドする訳である
が、この場合、発光ペレット１２の接合部形成面に対す
る鉛直軸を七に第１凸レンズ面１５が、また発光ペレッ
ト１２の側面、すなわち接合部１２ｂに一致する軸ｍＪ
−に第２凸レンズ面１６が形成されるようにモールド型
を設計する。Thereafter, resin molding is performed using a light-transmitting resin. In this case, the first convex lens surface 15 is placed at the 7th axis perpendicular to the joint formation surface of the light-emitting pellet 12, and the side surface of the light-emitting pellet 12, that is, the joint Axis mJ corresponding to part 12b
A mold is designed so that the second convex lens surface 16 is formed at -.

しかして、樹脂モールド１７を施すことにより、水平方
向及び％ｆ）　’ＩＰＴ方向の二方向への先出カケ得る
ことができ発光ダイオードが完成する。By applying the resin mold 17, the light emitting diode can be completed by providing pre-cutting in two directions: the horizontal direction and the %f)'IPT direction.

この二方向の光出力が得られることは、たとえは゛、ペ
レット主ｍ＋と鉛直方向の光出力を第１凸レンズ面１５
で集光し、ブ、４−トトランジノメ等の受光素子の駆動
源として用い、接合部形成１ｈ】と平行な軸方向の光出
力を第２凸ｌ／ンズ而１６で呆光し、点滅状態の確認等
に用いイ）のに朗利である。Obtaining light output in these two directions means, for example, that the light output in the pellet main m+ and the vertical direction is transferred to the first convex lens surface 15.
The light is collected by the second convex l/lens 16 and is used as a driving source for a light receiving element such as a bulge or a 4-transistor. It is useful for confirmation etc.

上記の、説明から明らかなように本発明に、ｌ：れば、
二方向の光出力が二個のレンズ面の形成に、Ｂ効率良く
取ジ出ぜるとともに発光ペレットは、リードフレームの
表１１ｎ部ＶＣ同定するため、後の金属細線のワイヤボ
ンデング作業を含めて作業性が著しく改善される。した
がって品質の安定した素子を安価に提供することが可能
となる。As is clear from the above description, in the present invention, if l:
The light output in two directions allows for the formation of two lens surfaces, and the light emitting pellets can be extracted efficiently, including the subsequent wire bonding work of thin metal wires, in order to identify the VC of the table 11n part of the lead frame. work efficiency is significantly improved. Therefore, it is possible to provide devices with stable quality at low cost.

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は、従来の発光ダイオードの構造例を
示す断面図、第３図及び第４図は、本発明の発光ダイオ
ードを示し、流３図は、その正面図、第４図は、その側
面図である。 １１．１３　　リードフレーム、１．］ａ、　１３ａ・
頭部表面、１２・発光ペレット、１４−金属細線、１２
ａ・主面、１５・即：】凸レンズ面、１６・第２凸レン
ズ面、１７・・・樹脂モールド。 第　ｌ　図 第３　図 第２　（２） 第４　副1 and 2 are sectional views showing an example of the structure of a conventional light emitting diode, FIGS. 3 and 4 show a light emitting diode of the present invention, and FIG. 3 is a front view thereof, and FIG. is a side view thereof. 11.13 Lead frame, 1. ]a, 13a・
Head surface, 12- Luminescent pellet, 14- Fine metal wire, 12
a. Main surface, 15. Immediately: ] Convex lens surface, 16. Second convex lens surface, 17... Resin mold. Figure l Figure 3 Figure 2 (2) 4th sub

Claims (1)

【特許請求の範囲】[Claims] 発光ベレノトヲ−方のリードフレームの頭部光面に固定
し、この発光ベレットと他方のリードフレームの頭部表
面とを金属細線で接続し、これらを樹脂モールドするに
当り、前記ペレットの主面に対する水平方向中心軸）−
に第２凸レンズ面、前記ペレットの接合部形成面に４１
する鉛ＩＧ軸上に第１凸レンズ面が形成されるように樹
脂モールドしたことを特徴とする発光ダイオード。The light emitting pellet is fixed to the head light surface of one lead frame, and the light emitting pellet and the head surface of the other lead frame are connected with a thin metal wire, and when molding them with resin, the main surface of the pellet is horizontal center axis) −
a second convex lens surface, 41 on the joint forming surface of the pellet;
A light emitting diode characterized in that the light emitting diode is resin-molded so that a first convex lens surface is formed on a lead IG axis.
JP56195263A 1981-12-04 1981-12-04 Light-emitting diode Pending JPS5896783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56195263A JPS5896783A (en) 1981-12-04 1981-12-04 Light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56195263A JPS5896783A (en) 1981-12-04 1981-12-04 Light-emitting diode

Publications (1)

Publication Number Publication Date
JPS5896783A true JPS5896783A (en) 1983-06-08

Family

ID=16338229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56195263A Pending JPS5896783A (en) 1981-12-04 1981-12-04 Light-emitting diode

Country Status (1)

Country Link
JP (1) JPS5896783A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0450560A2 (en) * 1990-04-03 1991-10-09 Sumitomo Electric Industries, Ltd. An optical device
US5328122A (en) * 1991-08-23 1994-07-12 Daiwa Seiko, Inc. Handle for fishing reel
US5762278A (en) * 1994-09-21 1998-06-09 Daiwa Seiko, Inc. Handle for fishing reel
JP2007157911A (en) * 2005-12-02 2007-06-21 Yukio Takahashi Light-emitting diode lump, and light-emitting diode lamp device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0450560A2 (en) * 1990-04-03 1991-10-09 Sumitomo Electric Industries, Ltd. An optical device
US5175783A (en) * 1990-04-03 1992-12-29 Sumitomo Electric Industries, Ltd. Optical molded device including two lenses and active element integrally
US5328122A (en) * 1991-08-23 1994-07-12 Daiwa Seiko, Inc. Handle for fishing reel
US5762278A (en) * 1994-09-21 1998-06-09 Daiwa Seiko, Inc. Handle for fishing reel
JP2007157911A (en) * 2005-12-02 2007-06-21 Yukio Takahashi Light-emitting diode lump, and light-emitting diode lamp device

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