JP3167769B2 - Lead frame and method of manufacturing optical device using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for an optical device such as an optical coupling device for detecting the presence or absence of an object to be detected without contact, and a method of manufacturing an optical device using the same.

[0002]

2. Description of the Related Art FIG. 8 shows a conventional lead frame.
FIG. 9 is a diagram showing a conventional lead frame after resin sealing, and FIG. 10 is a diagram showing a conventional lead frame after cutting a tie bar.

[0003] As shown in the figure, a conventional lead frame has an element mounting terminal 1 and an internal connection terminal 2 connected by a tie bar 3, and has an optical element 4 such as a light emitting element or a light receiving element mounted thereon, and a gold wire or the like. After the internal connection with the wire 6, both terminals 1 and 2 are sealed with a light-transmitting sealing resin to form a primary molded body 7, and then the tie bar 3 is cut.

[0004]

In a conventional lead frame, the element mounting terminal 1 and the internal connection terminal 2 are relatively fixed and positioned, and then sealed with a resin. At this time, the tie bar 3 was disposed at a position relatively far from the internal connection position of the optical element 4 by the wire 6.

In this case, however, the lead frame vibrates due to the movement of the lead frame in the production process or the like after the mounting of the element 4 or after the internal connection and before the sealing with the sealing resin, and is used for the internal connection. The loop shape of the wire 6 may be deformed or broken.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a lead frame capable of preventing breakage of wires even if vibrations occur in both terminals before resin sealing, and a method of manufacturing an optical device using the same. I do.

[0007]

According to a first aspect of the present invention, there is provided a header section 12a on which an optical element 11 is mounted.
A mounting terminal 12 having a wire 1
3 , a connection terminal 14 having a connection portion 14a internally connected at 3, and the connection terminal 14 and the mounting terminal 12
Are integrally connected by a tie bar 15 in the outer region, and the optical element 1
In a lead frame in which the periphery of the internal connection position 1 is resin-sealed with a sealing resin 17 a, the mounting mounting portion is provided outside the resin sealing region 17 of the terminals 12 and 14 and near the internal connection position of the optical element 11 . Header 12a of terminal 12 and front
The bridge portion 16 is formed by extending each end of the connection portion 14a of the connection terminal 14 and integrally connecting the connection portion 14a .

According to a second aspect of the present invention, an optical element 11 is mounted on a header 12a of a mounting terminal 12 according to the first aspect of the present invention, and the optical element 11 is connected with a wire 13 according to the first aspect. After connecting to the connection portion 14a of the terminal 14 for use and sealing the vicinity of the wire connection position of the optical element 11 with the sealing resin 17a, the tie bar 15 in the outer region and the bridge portion 16 adjacent to the vicinity of the wire connection position are connected. It is to cut.

[0009]

According to the first and second aspects of the present invention, the optical element 11 is mounted on the mounting terminal 12, and the optical element 11 and the connection terminal 14 are internally connected by wires 13 to form a seal. Seal with resin 17a.

During this time, the mounting terminal 12 and the connection terminal 14
Are integrally connected by a bridging portion 16 arranged outside the resin sealing region 17 and near the internal connection position of the optical element 11, so that the lead frame is moved before the sealing with the sealing resin 17a. Even if vibration occurs, both elements 12, 1
The relative positional relationship of 4 is stabilized.

[0011]

FIG. 1 is a front view of a lead frame showing one embodiment of the present invention, FIG. 2 is a side view of a transmission type optical coupling device using the lead frame, and FIG. 3 is a sectional view taken along line AA of FIG. , FIG.
2 is a sectional view taken along line BB of FIG. 2, and FIG. 5 is a rear view of the optical coupling device.

As shown in the drawing, the lead frame of this embodiment is provided, for example, in a pair in a light receiving / emitting section, and is a configuration of a transmission type optical coupling device (photo interrupter) for detecting the presence or absence of an object without contact. Used as a part.

The transmission type optical coupling device includes a mounting terminal 12 for mounting an optical element 11 and a wire 1 connected to the optical element 11 on the mounting terminal 12 for each of a light emitting section and a light receiving section.
And a connection terminal 14 internally connected at 3. Each of the connection terminals 14 and the mounting terminal 12 are integrally connected by a tie bar 15 in an outer area, and the vicinity of the internal connection position of each optical element 11 is, for example, A primary molded body is formed by resin sealing with a thermosetting translucent sealing resin 17a such as epoxy, and the primary molded body of the light emitting / receiving section is arranged to face.

As shown in FIGS. 1 and 4, each of the mounting terminals 12 has a rectangular head portion 1 for mounting the optical element 11 thereon.
2a, and each of the connection terminals 14 has a connection portion 14a that is internally connected to the optical element 11 by a wire 13. The tip of each of the header portion 12a and the connection portion 14a is extended so as to protrude from the formation region 17 of the primary molded body. The tips of the headers 12a and the connection portions 14a are connected to each other by bridging portions 16. Thereby, the header portion 12a and the connection portion 14a
Are positioned and fixed to each other outside the formation region 17 of each primary mold body and near the internal connection position of the optical element 11.

Here, in FIG. 2 to FIG.
An exterior molded body resin-sealed in 1a, a light transmitting window 22 for transmitting light between the optical elements 11 of the light emitting and receiving unit, and a connecting unit 23 for connecting and fixing the light emitting and receiving unit.

Next, a method of manufacturing the transmission type optical coupling device will be described. As shown in FIG. 1, first, regarding the light receiving section of the transmission type optical coupling device, the header section 1 of the mounting terminal 12 is used.
An optical element 11 such as a photodiode or a phototransistor is mounted on 2a, the optical element 11 is internally connected to a connection terminal 14 by a wire 13, and the periphery thereof is sealed with a sealing resin 17a by a transfer molding method. Then, a light receiving side primary molded body is formed.

Similarly, for the light emitting section, the optical element 11
A light-emitting element such as an infrared light-emitting diode is mounted on the header 12a of the mounting terminal 12, and the wire 1
After the internal connection by No. 3, sealing is performed with a sealing resin 17a.

Next, the tie bar 15 and the bridge portion 16 of the light emitting / receiving section are cut simultaneously. At this time, since the tie bar 15 and the bridging portion 16 are arranged outside the sealing region 17 of the sealing resin 17a, if a mold-shaped cutter is used,
Simultaneous cutting is facilitated.

Thereafter, the light emitting and receiving portions are opposed to each other at regular intervals, and integrally sealed with a light-shielding thermoplastic resin 21a such as, for example, polyphenylene sulfide (PPS) by injection molding (injection). The exterior molded body 21 shown in FIGS. At this time, the mounting terminal 1
The remaining protruding portion obtained by cutting the bridging portion 16 of the connection terminal 2 and the connection terminal 14 is stored in an exterior mold body 21 as shown in FIG. Keep protected.

As described above, since the mounting terminal 12 and the connection terminal 14 are connected by the bridging portion 16 close to the connection position, the positioning between the two can be firmly performed. The terminal 12 and 14 do not vibrate due to the upward movement and the loop shape of the internal connection is not deformed or disconnected. Therefore, the reliability as a product is improved, and a higher yield (cost reduction) can be expected.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.

For example, as shown in FIGS.
A notch 27 is formed inside the primary mold body, a bridging portion 16 is arranged at a position corresponding to the notched portion 27, and a jig is inserted into the notched portion 27 after resin sealing and the bridging portion 16 is formed.
May be cut.

[0023]

As is apparent from the above description, according to the first and second aspects of the present invention, the mounting terminal and the connection terminal are arranged outside the resin sealing area and near the internal connection position of the optical element. The internal connection positions of both terminals can be relatively positioned and fixed even before resin sealing because they are integrally connected at the formed bridge portion. Then, before the internal connection, the connection position of the wire is determined, so that the connection operation becomes easy. Further, after the internal connection, both the lead terminals vibrate due to movement in the production process and the like, so that the internal connection is not deformed and the wire is not broken. Therefore, when the improvement of the reliability as a product and the improvement of the yield (cost reduction) can be expected, there is an excellent effect.

[Brief description of the drawings]

FIG. 1 is a front view of a lead frame showing one embodiment of the present invention.

FIG. 2 is a side view of a transmission type optical coupling device using a lead frame.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a sectional view taken along line BB of FIG. 2;

FIG. 5 is a rear view of an optical coupling device of a transmission type optical coupling device using a lead frame.

FIG. 6 is a cross-sectional view of a transmission type optical coupling device using a lead frame according to another embodiment of the present invention.

FIG. 7 is a sectional view taken along the line CC of FIG. 6;

FIG. 8 is a front view of a conventional lead frame.

FIG. 9 is a view showing a conventional lead frame after resin sealing.

FIG. 10 is a view showing a conventional lead frame after cutting a tie bar.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Optical element 12 Terminal for mounting 13 Wire 14 Terminal for connection 15 Tie bar 16 Bridge part 17 Resin sealing area 17a Sealing resin

Claims (2)

(57) [Claims] 1. A mounting terminal having a header portion for mounting an optical element, and a connection terminal having a connection portion internally connected to the optical element on the mounting terminal by a wire. A lead frame in which the connection terminal and the mounting terminal are integrally connected by a tie bar in an outer region, and a periphery of an internal connection position of the optical element is resin-sealed with a sealing resin; Outside and near the internal connection position of the optical element,
Connection of the header of the mounting terminal and the connection terminal
A lead frame having a bridge portion formed by extending each end of the portion and integrally connecting them. 2. An optical element is mounted on the header of the mounting terminal according to claim 1, and the optical element is connected to a connection part of the connection terminal according to claim 1 by a wire, and a wire connection position of the optical element is provided. A method for manufacturing an optical device, comprising: after sealing the vicinity with a sealing resin, cutting a tie bar in an outer region and a bridge portion adjacent to a position near a wire connection position.