JP2750972B2 - Optical device and method of manufacturing the same - Google Patents
Optical device and method of manufacturing the sameInfo
- Publication number
- JP2750972B2 JP2750972B2 JP3344890A JP34489091A JP2750972B2 JP 2750972 B2 JP2750972 B2 JP 2750972B2 JP 3344890 A JP3344890 A JP 3344890A JP 34489091 A JP34489091 A JP 34489091A JP 2750972 B2 JP2750972 B2 JP 2750972B2
- Authority
- JP
- Japan
- Prior art keywords
- optical device
- mold
- lead frame
- optical element
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Light Receiving Elements (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光学装置およびその製
造方法に関する。The present invention relates to an optical device and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来の光学装置（例えば受光装置）は、
図５〜７の如く、光学素子１（受光チツプ）を接続用リ
ードフレーム２の搭載片２ａにＡｇペースト等の接着剤
でダイボイド接着し、受光チツプ１の電極３と接続用リ
ードフレーム２の接続片２ｂをＡｕワイヤ４等にてワイ
ヤボンデイング配線を行つた後、透光性エポキシ樹脂等
の熱硬化性樹脂を用いてトランスフアーモールド法によ
りモールドパツケージ５を成形していた。なお、図５〜
７中、６は集光レンズ、図７中、１ａは受光チツプの有
効受光面である。2. Description of the Related Art Conventional optical devices (for example, light receiving devices) are:
As shown in FIGS. 5 to 7, the optical element 1 (light receiving chip) is die-bonded to the mounting piece 2a of the connection lead frame 2 with an adhesive such as Ag paste, and the connection between the electrode 3 of the light receiving chip 1 and the connection lead frame 2 is performed. After wire-bonding the piece 2b with an Au wire 4 or the like, a mold package 5 is formed by a transfer molding method using a thermosetting resin such as a translucent epoxy resin. In addition, FIG.
7, reference numeral 6 denotes a condenser lens, and in FIG. 7, reference numeral 1a denotes an effective light receiving surface of a light receiving chip.
【０００３】[0003]
【発明が解決しようとする課題】従来の光学装置では、
以下のような欠点が指摘されていた。SUMMARY OF THE INVENTION In a conventional optical device,
The following disadvantages were pointed out.
【０００４】（１）トランスフアーモールド方式では、
成形後の金型からの離型性の問題を考慮し、モールドす
る前に離型剤を金型に散布していた。そのため、離型剤
が少ない場合に、金型分割の際、モールドパツケージ５
にクラツクを生じる場合があつた。(1) In the transfer mold method,
In consideration of the problem of mold releasability from a mold after molding, a mold release agent is sprayed on the mold before molding. Therefore, when the mold release agent is small, the mold package 5
In some cases cracks may occur.
【０００５】また、逆に離型剤が多すぎる場合に、集光
レンズ６等の透光部が白濁し、出力の低下を招く場合が
あつた。On the other hand, when the amount of the release agent is too large, the light-transmitting portion such as the condenser lens 6 becomes cloudy, which sometimes causes a decrease in output.
【０００６】（２）トランスフアーモールド後の離型剤
除去のため、フロン等の溶剤で洗浄を行わなければなら
ず、工程上、手間がかかつていた。また、離型剤が洗浄
不足となることがあり、光学装置を利用する取付装置
（フオトインタラプタ等）の接着工程において接着不良
が発生することがあつた。(2) In order to remove the release agent after transfer molding, cleaning must be performed with a solvent such as chlorofluorocarbons, which is troublesome in the process. In addition, the release agent may be insufficiently cleaned, and a bonding failure may occur in a bonding process of a mounting device (such as a photo interrupter) using an optical device.
【０００７】（３）離型剤の問題で、パツケージ５に大
きな抜きテーパ５ａを設けなければならず、光学装置を
使用する取付装置の外装ケース等に寸法をピツタリ合わ
せようとすると、外装ケースを設計する際に抜きテーパ
を考慮して設計する必要がある。従つて、寸法の設計や
仕上精度の点検等に手間がかかる。(3) Due to the problem of the release agent, the package 5 must be provided with a large extraction taper 5a. If the dimensions are to be fitted to the outer case of the mounting device using the optical device, the outer case must be provided. When designing, it is necessary to take the draft taper into consideration. Therefore, it takes time to design the dimensions and check the finishing accuracy.
【０００８】（４）金型からの離型性が悪いため、透光
性樹脂のモールド形状を複雑にすると、離型時に破損が
生じやすく、したがつて、例えば外部装置への取付用フ
ツク（図４参照）の成形等を行うことができなかつた。(4) Since the mold releasing property from the mold is poor, if the mold shape of the translucent resin is complicated, breakage is likely to occur at the time of mold releasing, and accordingly, for example, a hook for mounting to an external device ( (See FIG. 4) cannot be performed.
【０００９】（５）ワイヤ４により結線を行つていたた
め、粘性の低い熱硬化性樹脂を使用しなければならず、
硬化に至るまでのトランスフアーモールド時間が１分以
上かかり、大量生産の限界となつていた。このことか
ら、光学装置を１個製造するに当たつての金型の製作費
が高くついていた。(5) Since the connection is made by the wire 4, a thermosetting resin having low viscosity must be used.
The transfer molding time until curing took more than one minute, which was the limit of mass production. For this reason, the manufacturing cost of the mold for manufacturing one optical device was high.
【００１０】（６）モールド時、熱硬化性樹脂の粘性が
低いために金型パーテイング部に薄バリが発生し、薄バ
リ除去工程が必要となり、手間がかかつていた。(6) At the time of molding, thin burrs are generated at the mold parting portion due to low viscosity of the thermosetting resin, and a thin flash removing step is required, which is troublesome.
【００１１】（７）以上のような熱硬化性樹脂の欠点を
考慮して、粘性が高く金型との離型性に優れた熱可塑性
樹脂を用いてパツケージ成形しようとしても、樹脂の粘
性でワイヤ４が押し流され、ワイヤ不良が起こつて断線
が生じるため、実際上熱可塑性樹脂を用いて成形できな
かつた。(7) In consideration of the above-mentioned drawbacks of the thermosetting resin, even if an attempt is made to form a package using a thermoplastic resin having a high viscosity and an excellent releasability from a mold, it is difficult to mold the package. Since the wire 4 is swept away and a wire failure occurs to cause a disconnection, it was practically impossible to mold using a thermoplastic resin.
【００１２】本発明は、上記課題に鑑み、樹脂バリの発
生を防止し、かつ金型からの離型性に優れた光学装置お
よびその製造方法の提供を目的とする。SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an optical device which prevents generation of resin burrs and is excellent in releasability from a mold and a method of manufacturing the same.
【００１３】[0013]
【課題を解決するための手段】本発明請求項１による課
題解決手段は、図１〜３の如く、リードフレーム１１の
搭載片１６ａに光学素子１３が搭載され、該光学素子１
３とリードフレーム１１の接続片１６ｂ，１６ｃとが電
気的に接続され、これらが透光性樹脂１４により封止さ
れてなる光学装置において、前記光学素子１３の電極部
１８とリードフレーム１１の搭載片１６ａ及び接続片１
６ｂ，１６ｃとが接続バンプ１９により電気的機械的に
直接接続され、前記透光性樹脂１４が、粘性を有しかつ
金型に対して離型性のよい熱可塑性樹脂からなり、抜き
テーパを省略した直方体状に形成されたものである。According to a first aspect of the present invention, an optical element 13 is mounted on a mounting piece 16a of a lead frame 11, as shown in FIGS.
3 and the connection pieces 16b and 16c of the lead frame 11 are electrically connected, and these are sealed with a translucent resin 14 to mount the electrode portion 18 of the optical element 13 and the lead frame 11. Piece 16a and connection piece 1
6b and 16c are electrically and mechanically directly connected to each other by connection bumps 19, and the translucent resin 14 has viscosity and
Ri Do from releasability good thermoplastic resin relative to the mold, bleeding
It is formed in a rectangular parallelepiped shape with no taper .
【００１４】本発明請求項２による課題解決手段は、光
学素子１３を接続バンプ１９によりリードフレーム１１
の搭載片１６ａ及び接続片１６ｂ，１６ｃに電気的機械
的に直接接続し、これらを粘性を有しかつ金型に対して
離型性のよい熱可塑性の透光性樹脂１４によりインサー
ト射出成形して、抜きテーパを省略した直方体状に形成
するものである。According to a second aspect of the present invention, an optical element is connected to a lead frame by connecting bumps.
Mounting piece 16a and the connecting piece 16b of the electrically mechanically connected directly to 16c, these relative chromatic vital mold viscous
It is formed by insert injection molding using a thermoplastic translucent resin 14 having good mold release properties, and is formed in a rectangular parallelepiped shape without a punching taper .
【００１５】[0015]
【作用】上記請求項１，２による課題解決手段におい
て、光学素子１３を接続バンプ１９を介してリードフレ
ーム１１の搭載片１６ａ及び接続片１６ｂ，１６ｃに直
接接続する。そうすると、従来、光学素子と接続片との
間の電気的接続に用いられていたボンデイングワイヤを
省略でき、透光性樹脂１４として粘性を有する熱可塑性
樹脂を用いてインサート射出成形しても、ワイヤの断線
を考慮する必要がなくなる。このことから、透光性樹脂
１４として前記熱可塑性樹脂を用いることにより、金型
に対して離型性をよくすることができるので、金型に対
する抜きテーパを設ける必要がなくなり、直方体状に成
形できる。 In the means for solving the problems according to the first and second aspects, the optical element 13 is directly connected to the mounting piece 16a and the connection pieces 16b, 16c of the lead frame 11 via the connection bumps 19. Then, the bonding wire conventionally used for the electrical connection between the optical element and the connection piece can be omitted, and even if the light-transmitting resin 14 is insert-injected using a viscous thermoplastic resin, the wire can be used. It is no longer necessary to consider the disconnection. Therefore, by using the thermoplastic resin as the translucent resin 14, it is possible to improve the releasability relative to the mold, against the mold
It is not necessary to provide a taper
Can be shaped.
【００１６】[0016]
【実施例】図１は本発明の一実施例を示す光学装置の縦
断面図、図２は光学装置の横断面図、図３は光学装置の
正面視断面図である。FIG. 1 is a longitudinal sectional view of an optical device showing an embodiment of the present invention, FIG. 2 is a transverse sectional view of the optical device, and FIG. 3 is a front sectional view of the optical device.
【００１７】図１の如く、本実施例の光学装置は、リー
ドフレーム１１に光学素子１３が搭載され、これが透光
性樹脂１４により封止され、前記光学素子１３は、フリ
ツプチツプ法、すなわちリードフレーム１１にワイヤレ
ス方式により電気的に接続されたものである。As shown in FIG. 1, in the optical device of this embodiment, an optical element 13 is mounted on a lead frame 11, which is sealed with a translucent resin 14, and the optical element 13 is mounted on a lead frame 11 by a flip-chip method. 11 is electrically connected by a wireless method.
【００１８】前記リードフレームは、図３の如く、三個
の接続リード１５ａ〜１５ｃからなり、そのうち、第一
接続リード１５ａの先端には、前記受光チツプ１３が搭
載される矩形の搭載片１６ａが延設されている。また、
第二、第三接続リード１５ｂ，１５ｃの先端には、光学
素子１３に接続するためのＬ字形の接続片１６ｂ，１６
ｃが延設されている。そして、前記第一接続リード１５
ａの搭載片１６ａの中央部付近には、図３の如く、外部
よりの入射光が光学素子１３へ入射するための矩形ある
いは円形の採光窓１７が形成されている。As shown in FIG. 3, the lead frame comprises three connection leads 15a to 15c, of which a rectangular mounting piece 16a on which the light receiving chip 13 is mounted is provided at the tip of the first connection lead 15a. It has been extended. Also,
L-shaped connection pieces 16b, 16 for connecting to the optical element 13 are provided at the tips of the second and third connection leads 15b, 15c.
c is extended. And the first connection lead 15
As shown in FIG. 3, a rectangular or circular lighting window 17 is formed near the center of the mounting piece 16a for allowing incident light from outside to enter the optical element 13.
【００１９】前記光学素子１３は、フオトトランジスタ
等の受光チツプであり、その受光面の四隅には、各接続
リード１５ａ〜１５ｃに接続される電極部１８が形成さ
れている。該各電極部１８には、各接続リード１５ａ〜
１５ｃに機械的に固定されるとともに、電気的に接続さ
れるための接続バンプ１９が形成されている。該接続バ
ンプ１９は、半田または金等を用いて前記電極部１８か
ら突出形成され、その材質に応じて半田リフロー方式ま
たは超音波方式によつて各接続リード１５ａ〜１５ｃに
接続される。これにより、光学素子１３はリードフレー
ムに対してワイヤレスにて電気的に接続される（フリツ
プチツプ法）。The optical element 13 is a light receiving chip such as a phototransistor, and electrode portions 18 connected to the connection leads 15a to 15c are formed at four corners of the light receiving surface. Each of the electrode portions 18 has a connection lead 15a
A connection bump 19 for mechanically fixing and electrically connecting to 15c is formed. The connection bump 19 is formed so as to protrude from the electrode portion 18 using solder or gold, and is connected to each of the connection leads 15a to 15c by a solder reflow method or an ultrasonic method according to the material. Thus, the optical element 13 is electrically connected to the lead frame wirelessly (flip-chip method).
【００２０】なお、光学素子１３の有効受光面は、電極
部１８以外の全ての領域とされているが、リードフレー
ムへの搭載後は、搭載片１６ａの採光窓１７から露出す
る部分に制限される。Note that the effective light receiving surface of the optical element 13 is the entire area except for the electrode portion 18, but after mounting on the lead frame, is limited to the portion exposed from the lighting window 17 of the mounting piece 16 a. You.
【００２１】前記透光性樹脂１４は、例えばポリカーボ
ネートやアクリル樹脂等の熱可塑性樹脂が用いられ、粘
性の高い状態でインサート射出成形方式にてインジエク
シヨンモールドされる。すなわち、前述の如く、光学素
子１３とリードフレーム１１との接続をボンデイングワ
イヤではなく接続バンプ１９で行つているため、透光性
樹脂１４として粘性の高い熱可塑性樹脂を用いても、ワ
イヤの断線を考慮する必要がなくなり、光学装置の信頼
性を確保し得る。The light-transmitting resin 14 is made of a thermoplastic resin such as polycarbonate or acrylic resin, and is subjected to injection molding in a highly viscous state by an insert injection molding method. That is, as described above, since the connection between the optical element 13 and the lead frame 11 is performed not by the bonding wire but by the connection bump 19, even if a highly viscous thermoplastic resin is used as the translucent resin 14, the wire is disconnected. Does not need to be considered, and the reliability of the optical device can be ensured.
【００２２】ここで、熱可塑性樹脂は、熱硬化性樹脂に
比べて離型性がよく、故に従来用いていた離型剤を省略
できるとともに、粘性を有するが故、薄バリが発生しに
くく、また、モールド時間も短いといつた特性を有して
いる。Here, the thermoplastic resin has a good releasability as compared with the thermosetting resin, so that the conventionally used releasing agent can be omitted, and since it has viscosity, thin burrs are hardly generated. Further, it has a characteristic that the molding time is short.
【００２３】なお、該透光性樹脂１４の射出成形と同時
に、図１〜３の如く、レンズ部２１が形成される。これ
に加えて、図４の如く、外部装置に取り付けるためのフ
ツク部２２等を成形してもよい。すなわち、フツク２２
等の薄板成形など、トランスフアーモールド方式では不
可能な成形も、インサート射出方式によりインジエクシ
ヨンモールドにすることで容易に成形可能となる。な
お、図１中、２４は樹脂を注入するゲート跡である。At the same time as the injection molding of the translucent resin 14, a lens portion 21 is formed as shown in FIGS. In addition, as shown in FIG. 4, a hook portion 22 or the like for attaching to an external device may be formed. That is, hook 22
Molding that cannot be performed by the transfer molding method, such as thin sheet molding, can be easily performed by using an injection molding method by an insert injection method. In FIG. 1, reference numeral 24 denotes a gate mark for injecting a resin.
【００２４】ここで、光学装置の受光特性は、搭載片１
６ａに形成されている採光窓１７の面積や、レンズ部２
１の曲率を変えることにより、外部からの光の有効入射
角を制限、調整すればよい。Here, the light receiving characteristics of the optical device are as follows.
6a, the area of the lighting window 17 formed in the
By changing the curvature of 1, the effective incident angle of external light may be limited and adjusted.
【００２５】以上のように、本実施例では、離型剤の塗
布および洗浄工程、ワイヤボンデイング工程、バリ取り
工程を省略でき、製造作業を簡素化できる。また、ボン
デイングワイヤの省略により、断線を防止でき、信頼性
を向上できる。さらに、従来品での特性を維持しつつ、
コストの低いインジエクシヨンモールドにより低設備投
資で形状を変更できる。As described above, in the present embodiment, the steps of applying and cleaning the release agent, the wire bonding step, and the deburring step can be omitted, and the manufacturing operation can be simplified. Further, by omitting the bonding wire, disconnection can be prevented and reliability can be improved. Furthermore, while maintaining the characteristics of conventional products,
The shape can be changed with a low capital investment by using a low-cost injection mold.
【００２６】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.
【００２７】例えば、上記実施例では、光学素子１３と
して受光チツプを使用していたが、ＬＥＤ等の発光チツ
プを用いてもよい。For example, in the above embodiment, a light-receiving chip is used as the optical element 13, but a light-emitting chip such as an LED may be used.
【００２８】また、光学素子１３は、その受発光面が電
極と逆側に配された構造であつてもよい。そうすると、
リードフレームの搭載片１６ａに採光窓を設けなくても
良く、フレーム形状の簡素化を図り得る。The optical element 13 may have a structure in which the light receiving / emitting surface is disposed on the side opposite to the electrode. Then,
It is not necessary to provide a lighting window on the mounting piece 16a of the lead frame, and the frame shape can be simplified.
【００２９】[0029]
【発明の効果】以上の説明から明らかな通り、本発明請
求項１，２によると、光学素子を接続バンプを介してリ
ードフレームの搭載片及び接続片に直接接続しているの
で、透光性樹脂として粘性を有しかつ金型に対して離型
性のよい熱可塑性樹脂を用いることができる。As is clear from the above description, according to the first and second aspects of the present invention, since the optical element is directly connected to the mounting piece and the connecting piece of the lead frame via the connecting bump, the light transmitting property is improved. it can be used for having a viscosity and mold as resin releasability good thermoplastic resin.
【００３０】したがつて、離型剤の散布を省略でき、ク
ラツク発生、レンズ部の白濁の防止および洗浄工程の削
減を実現できる。加えて、従来形成していた抜きテーパ
を省略して直方体状に形成できるので、抜きテーパを考
慮しなくてよく、さらにリードフレームの搭載片も小さ
くでき、小型化することが可能となり、高密度実装する
こともでき、しかも光学装置の外装取付装置の設計や仕
上精度の点検等が容易となる。Accordingly, it is possible to omit the application of the release agent, to prevent the occurrence of cracks, to prevent the lens portion from becoming cloudy, and to reduce the number of washing steps. In addition, since the formerly formed punch taper can be omitted and formed into a rectangular parallelepiped shape , consider the punch taper.
You don't have to worry, and the lead frame mounting piece is small.
High-density mounting
In addition, it is easy to design the exterior mounting device of the optical device and to check the finishing accuracy.
【００３１】また、離型性の良さから、トランスフアー
モールド方式では不可能であつた薄肉成形も可能とな
り、形状の複雑化および小型化が容易となる。In addition, due to the good releasability, thin-wall molding, which was impossible with the transfer molding method, is also possible, and the shape can be complicated and the size can be easily reduced.
【００３２】さらに、熱可塑性樹脂のモールド時間が２
０〜３０秒ですむため、従来に比べてモールド時間を短
縮でき、大量生産に適応せしめることができる。Further, the molding time of the thermoplastic resin is 2
Since it takes only 0 to 30 seconds, the molding time can be shortened as compared with the related art, and it can be adapted to mass production.
【００３３】さらにまた、熱可塑性樹脂が粘性を有する
ので、樹脂バリの発生を防止できる。Further, since the thermoplastic resin has viscosity, it is possible to prevent the occurrence of resin burrs.
【００３４】したがつて、バリ除去工程の削減による作
業の簡素化が実現でき、工数低減となり安値な光学装置
の提供が可能となるだけでなく、トランスフアーモール
ド金型と比べ、インサート射出成形金型はバリが発生し
ない分クリアランスをラフに設計でき、非常に安値とな
り、初期設備投資も低く抑えることができ、また、パツ
ケージ形状および指向特性変更も容易に変更でき、ライ
ンナツプを豊富に揃えることが可能となるといつた優れ
た効果がある。Accordingly, it is possible to simplify the work by reducing the burr removal process, to reduce the number of steps and to provide a low-priced optical device. Since the mold has no burr, the clearance can be designed roughly and the clearance can be designed very low, the initial capital investment can be kept low, the package shape and directional characteristics can be easily changed, and the lineup can be abundantly prepared. There is an excellent effect when it becomes possible.
【図１】図１は本発明の一実施例を示す光学装置の縦断
面図である。FIG. 1 is a longitudinal sectional view of an optical device showing one embodiment of the present invention.
【図２】図２は光学装置の横断面図である。FIG. 2 is a cross-sectional view of the optical device.
【図３】図３は光学装置の正面視断面図である。FIG. 3 is a sectional front view of the optical device.
【図４】図４は光学装置に外部取付用フツクを形成した
状態を示す斜視図である。FIG. 4 is a perspective view showing a state where an external mounting hook is formed on the optical device.
【図５】図５は従来の光学装置の側面図である。FIG. 5 is a side view of a conventional optical device.
【図６】図６は従来の光学装置の平面図である。FIG. 6 is a plan view of a conventional optical device.
【図７】図７は従来の光学装置の正面図である。FIG. 7 is a front view of a conventional optical device.
１３ 光学素子 １４ 透光性樹脂 １７ 採光窓 １８ 電極部 １９ 接続バンプ DESCRIPTION OF SYMBOLS 13 Optical element 14 Translucent resin 17 Lighting window 18 Electrode part 19 Connection bump
Claims (2)
載され、該光学素子とリードフレームの接続片とが電気
的に接続され、これらが透光性樹脂により封止されてな
る光学装置において、前記光学素子の電極部とリードフ
レームの搭載片及び接続片とが接続バンプにより電気的
機械的に直接接続され、前記透光性樹脂が、粘性を有し
かつ金型に対して離型性のよい熱可塑性樹脂からなり、
抜きテーパを省略した直方体状に形成されたことを特徴
とする光学装置。An optical device in which an optical element is mounted on a mounting piece of a lead frame, the optical element is electrically connected to a connecting piece of the lead frame, and these are sealed with a translucent resin. The electrode portion of the optical element and the mounting piece and the connection piece of the lead frame are electrically and mechanically directly connected by connection bumps, and the translucent resin has viscosity.
And Ri Do from releasability good thermoplastic resin relative to the mold,
An optical device, wherein the optical device is formed in a rectangular parallelepiped shape without a punching taper .
ームの搭載片及び接続片に電気的機械的に直接接続し、
これらを粘性を有しかつ金型に対して離型性のよい熱可
塑性の透光性樹脂によりインサート射出成形して、抜き
テーパを省略した直方体状に形成することを特徴とする
光学装置の製造方法。2. An optical element is electrically and mechanically directly connected to a mounting piece and a connecting piece of a lead frame by connecting bumps,
These were insert injection molded with relative chromatic vital mold viscous releasability good thermoplastic translucent resin, vent
A method of manufacturing an optical device, wherein the optical device is formed in a rectangular parallelepiped shape without a taper .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3344890A JP2750972B2 (en) | 1991-12-26 | 1991-12-26 | Optical device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3344890A JP2750972B2 (en) | 1991-12-26 | 1991-12-26 | Optical device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05175522A JPH05175522A (en) | 1993-07-13 |
| JP2750972B2 true JP2750972B2 (en) | 1998-05-18 |
Family
ID=18372788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3344890A Expired - Fee Related JP2750972B2 (en) | 1991-12-26 | 1991-12-26 | Optical device and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2750972B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3991018B2 (en) * | 2003-09-01 | 2007-10-17 | シャープ株式会社 | Semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0364071A (en) * | 1989-08-02 | 1991-03-19 | Mitsubishi Electric Corp | Integrated circuit device |
| JPH03230580A (en) * | 1990-02-05 | 1991-10-14 | Sharp Corp | Solid-state image pickup device |
-
1991
- 1991-12-26 JP JP3344890A patent/JP2750972B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05175522A (en) | 1993-07-13 |
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