JPH0745967Y2 - Optical coupling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an optical coupling device (photointerrupter) with a connector in which a light emitting side and a light receiving side are arranged to face each other with a passage for an object interposed therebetween.

<Prior Art> Conventional optical coupling device with connector (photo interrupter)
As shown in FIG. 11, the light-transmitting-side light-transmitting resin body 1 having a light-emitting element, the light-receiving-side light-transmitting resin body 2 having a light-receiving element, and the outer light-transmitting resin bodies 1 and 2 sandwich the passage side 3 of the object. Board 4 mounted opposite to each other, a connector 5 for inputting and outputting to and from the outside, an exterior 6 for housing the translucent resin bodies 1 and 2, and a board fixing material (resin or resin for fixing the board 4). It is composed of a molded product lid) 7. In the figure, 8 and 9 are lead portions.

The optical coupling device is, as shown in FIG. 12, (1) “Insert translucent resin bodies 1 and 2 (light emitting element, light receiving element) into substrate 4” (2) “Substrate of lead parts 8 and 9” 4) (3) "Lead cut of lead parts 8 and 9" (4) "Soldering of connector 5" (5) "Insert board 4 into exterior 6 after soldering" (6) "Resin" The substrate 4 is fixed by sealing. "

<Problems to be Solved by the Invention> However, since the conventional optical coupling device with a connector has a large number of parts, it takes time to assemble. Further, there are many soldering points, and an inspection process is required after the assembly is completed in order to maintain reliability and quality.

In view of the above problems, the present invention reduces the number of parts,
An object of the present invention is to provide an optical coupling device capable of simplifying assembly, improving reliability, and reducing costs.

<Means for Solving Problems> The means for solving the problems of the present invention is a light emitting device 11 mounted on the same plane of the same lead frame 10 as shown in FIGS.
And a light-receiving element 12, a light-emitting side translucent resin body 13 formed by coating the light-emitting element 11 and having an inclined surface 13a that reflects the irradiation light from the light-emitting element 11 and guides it to the passage 22; A light-receiving side light-transmitting resin body 14 having an inclined surface 14a formed by covering the element 12 and reflecting the light guided to the passage 22 to the light-receiving element 12, and the light-emitting side light-transmitting resin body 13 And a light-transmitting side light-transmitting resin body (14) and a non-light-transmitting outer package (15) integrally formed by sandwiching the passage (22).

<Operation> In the means for solving the above problems, the same lead frame 10
The light emitting element 11 and the light receiving element 12 are mounted on the same plane of
The transparent resin bodies 13 and 14 are formed by coating these. Further, the translucent resin bodies 13 and 14 are integrally formed so as to sandwich the passage 22 of the object to be detected, thereby forming the non-translucent outer casing 15. The irradiation light from the light emitting element 11 is the inclined surface 13a of the light emitting side translucent resin body 13.
The reflected light is guided to the passageway 22 and is irradiated into the light-receiving side light-transmitting resin body 14 from the passageway 22 and reflected by the inclined surface 14a of the light-receiving side light-transmitting resin body 14 to be guided to the light-receiving element 12. . This allows
The light emitting / receiving elements 11 and 12 are optically coupled.

<Embodiment> An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the optical coupling device according to claim 1 of the present invention, FIG. 2 is a perspective view of the same part, and FIG. 3 is a light emitting element and a light receiving element mounted on a lead frame. FIG. 4 (a) is a front view showing the state, FIG. 4 (a) is a plan view showing a state in which the light emitting element and the light receiving element are primarily molded, FIG. 4 (b) is the same front view, and FIG. FIG. 5B is a plan view showing a state where the photo-resin body is secondarily molded, and FIG. 5B is a front view thereof.

As shown in the figure, the optical coupling device with a connector of the present invention comprises a light emitting element 11 and a light receiving element 12 mounted on the same lead frame 10, and a light emitting side transparent resin body 13 formed by coating the light emitting element 11. And a light-receiving side light-transmitting resin body 14 formed by coating the light-receiving element 12, and a non-light-transmitting body formed by integrally forming the light-emitting side light-transmitting resin body 13 and the light-receiving side light-transmitting resin body 14. Exterior
15, a lead-out portion (recess) 16 for leading out the lead portions 10a, 10b, 10c of the lead frame 10 is formed in the exterior 15, and a connector 17 for inputting and outputting between the lead-out portion 16 and the outside. The connection part is sealed with resin.

As shown in FIG. 3, the lead frame 10 has the lead portion.
It is composed of 10a, 10b, 10c and a tie bar 10d.

As the light emitting element 11, for example, a diode chip such as an infrared diode is used. The light emitting element 11 is die-bonded to a mounting portion A formed on the upper portion of one side of the lead portion 10a, and further internally connected by a bonding wire 19 such as a gold wire connected to the lead portion 10b. ing.

As the light receiving element 12, a chip such as a phototransistor is used. The light receiving element 12 includes the lead portion 10
It is die-bonded to a mounting portion B formed on the upper part of the other side of a and further internally connected by a bonding wire 19 connected to the lead portion 10c.

The translucent resin bodies 13 and 14 are, as shown in FIGS. 4 (a) and 4 (b),
The light emitting element 11 and the light receiving element 12 are each primarily molded with a light-transmissive resin.

The exterior 15 is formed by secondary molding with a non-translucent resin. The exterior 15 is formed by a secondary mold as shown in FIG. 5 (a).
As shown in (b), a light emitting side storage chamber 20 for storing the light emitting side light transmitting resin body 13 and a light receiving side storage chamber 21 for storing the light receiving side light transmitting resin body 14 are formed. The storage chambers 20 and 21 are arranged so as to face each other with a passage 22 for the object to be detected in between, and the storage chamber 2
The slits 23a and 23b are opened in the walls 20a and 21a on the passage 22 side of 0 and 21, respectively.

The light-transmitting side light-transmitting resin body 13 has an inclined surface 13a for reflecting the irradiation light from the light-emitting element 11 and guiding it from the slit 23a to the passage 22. Passage 2
There is an inclined surface 14a for reflecting the light entering the light-transmitting side light-transmitting resin body 14 from 2 through the slit 23b and guiding it to the light-receiving element 12.

As shown in FIG. 2, the lead-out portion (recess) 16 is arranged at the lower end of the side surface 15a of the exterior 15. In the lead-out portion 16, the end portions of the lead portions 10a, 10b, 10c are exposed so that they can be connected to the connector 17.

The connector 17 is, as shown in FIG. 1, an L-shaped base portion 17a and the lead portions 10a, 10 attached to the base portion 17a.
It is composed of a connector lead portion 17b connected to b and 10c. The connector lead portion 17b and the lead portions 10a, 10b, 1
0c is connected by soldering, welding, or the like, and is sealed with a strength reinforcing resin (eg, epoxy resin) 24.

In the above structure, the optical coupling device is manufactured as follows.

First, as shown in FIG. 3, the lead portion 10a of the lead frame 10
The light emitting element 11 and the light receiving element 12 are die-bonded to each other, and the lead portions 10b and 10c are internally connected by the bonding wires 19 respectively. Next, as shown in FIGS. 4A and 4B, the light-transmitting resin is primarily molded to form the light-transmitting resin bodies 13 and 14. Further, as shown in FIGS. 5A and 5B, the transparent resin body
The outer packaging 15 is formed by secondary molding 13 and 14 with a non-translucent resin.

At this time, the lead portions 10a, 1
A derivation unit 16 that derives 0b and 10c is formed. Then, in the lead-out portion 16, the lead portions 10a, 10b, 10c and the connector lead portion 17b
Are connected to each other by soldering or welding, and sealed with a resin 24 for strength reinforcement to complete the process.

In this way, the lead portion 10 of the lead frame 10 is
Forming a derivation unit 16 for deriving a, 10b, 10c, and further derivation unit 1
Since the connecting portion between 6 and the connector 17 is resin-sealed, unlike the conventional optical coupling device, a substrate is not required and the number of parts can be reduced.

Also, in the assembly process, steps such as "inserting the light emitting element and the light receiving element into the board" and "soldering the leads of the light emitting element and the light receiving element to the board" can be omitted, which simplifies the assembly and reduces the cost. to enable.

Next, a first embodiment according to claim 2 of the present invention will be described with reference to the drawings. FIG. 6 is a perspective view showing a first embodiment of an optical coupling device according to claim 2 of the present invention, FIG. 7 is a front view showing a state in which a light emitting element and a light receiving element are mounted on a lead frame, and FIG. 8 ( a) is a plan view showing a state in which the light emitting element and the light receiving element are similarly primary-molded, FIG. 8 (b) is a front view thereof, and FIG. 9 (a) is a state in which a translucent resin body is also secondarily molded. The plan view shown in FIG. 9B is also a front view thereof.

This embodiment is a connector-integrated type optical coupling device, and as shown in the drawing, a light emitting element mounted on the same lead frame 10.
11 and a light receiving element 12, a light emitting side light transmitting resin body 13 formed by coating the light emitting element 11, a light receiving side light transmitting resin body 14 formed by covering the light receiving element 12, and the light emitting side light transmitting body Resin body
The light-transmitting resin body 13 and the light-receiving side light-transmitting resin body 14 are integrally covered to form a non-light-transmitting exterior 15, and the lead portions 10a, 10b, 10c of the lead frame 10 perform input / output with the outside. Connector 17
The outer casing 15 and the connector 17 are integrally molded and are used as a pin.

In the above-mentioned structure, as shown in FIG. 7, the light emitting element 11 and the light receiving element 12 are mounted on the lead frame 10, and the light-transmitting resin is primarily molded to form the light-transmitting resin bodies 13 and 14. Secondary molding is performed with resin to form the exterior 15 and the optical coupling device is completed.

During this secondary molding, the lead portion 10 of the lead frame 10 is
Since a, 10b and 10c are used as pins of the connector 17 and the exterior 15 and the connector 17 are integrally formed, the step of "soldering the lead portion and the connector" is omitted as compared with the embodiment of claim 1. In addition, the number of soldering points is reduced, and an inspection process is not required after assembly is completed in order to maintain reliability and quality, and reliability is improved.

Other configurations, operations, and effects are similar to those of the first embodiment.

Next, a second embodiment according to claim 2 will be described with reference to the drawings. FIG. 10 is a perspective view showing a second embodiment of the optical coupling device according to claim 2 of the present invention.

As shown in the figure, this embodiment is a connector-integrated type optical coupling device similar to the first embodiment, in which the connector 17 is formed in an L shape and is provided with a protrusion 17c.

Other configurations, operations, and effects are similar to those of the first embodiment.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

<Effects of Device> As is apparent from the above description, according to the present invention, the light emitting element and the light receiving element are arranged on the same plane, and the irradiation light from the light emitting element is provided on the inclined surface and the passage of the light emitting side transparent resin body. Since it is guided to the light receiving element via the inclined surface of the light receiving side light-transmitting resin body, the light receiving and emitting element can be optically coupled without bending the lead frame, and the manufacturing process can be simplified. .

In addition, it is possible to reduce the number of parts without the need for a board like the conventional optical coupling device, and to perform steps such as "insert the light emitting element and the light receiving element into the board" and "solder the lead part to the board". It can be omitted, which enables simplification of assembly and cost reduction.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the optical coupling device according to claim 1 of the present invention, FIG. 2 is a perspective view of the same main portion, and FIG. 3 is a light emitting element and a light receiving element mounted on a lead frame. FIG. 4 (a) is a front view showing the state, FIG. 4 (a) is a plan view showing a state in which the light emitting element and the light receiving element are primarily molded, FIG. 4 (b) is the same front view, and FIG. FIG. 5 (b) is a front view of the same, and FIG. 6 is a perspective view showing a first embodiment of the optical coupling device according to claim 2 of the present invention. FIG. 7 is a front view showing a state in which the light emitting element and the light receiving element are mounted on a lead frame, FIG. 8 (a) is a plan view showing a state in which the light emitting element and the light receiving element are similarly primary-molded, and FIG. ) Is the same as the front view, and FIG. 9B is a front view of the same, FIG. 10 is a front view of the same, FIG. 10 is a perspective view of a second embodiment of the optical coupling device according to claim 2 of the present invention, and FIG. 11 is a conventional optical coupling. FIG. 12 is a sectional view of the device, and FIG. 12 is a view showing the assembling process thereof. 10: lead frame, 10a, 10b, 10c: lead portion, 11: light emitting element, 12: light receiving element, 13: light emitting side transparent resin body, 14: light receiving side transparent resin body, 15: exterior, 16: lead-out section , 17: Connector.

Claims (1)

[Scope of utility model registration request] 1. An optical coupling device for contactlessly detecting the presence or absence of an object on a passage, which comprises a light emitting element and a light receiving element mounted on the same plane of the same lead frame, and the light emitting element is formed by coating. And a light-transmitting-side translucent resin body having an inclined surface that reflects the irradiation light from the light-emitting element and guides it to the passage, and reflects the light guided to the passage by covering the light-receiving element. And a light-receiving side light-transmitting resin body having an inclined surface for guiding to the light-receiving element, and the light-emitting side light-transmitting resin body and the light-receiving side light-transmitting resin body are integrally formed with the passageway interposed therebetween. An optical coupling device comprising a non-translucent exterior.