JPH0262747U - - Google Patents

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Publication number
JPH0262747U
JPH0262747U JP14094688U JP14094688U JPH0262747U JP H0262747 U JPH0262747 U JP H0262747U JP 14094688 U JP14094688 U JP 14094688U JP 14094688 U JP14094688 U JP 14094688U JP H0262747 U JPH0262747 U JP H0262747U
Authority
JP
Japan
Prior art keywords
light
resin body
receiving
lead
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14094688U
Other languages
Japanese (ja)
Other versions
JPH0745967Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988140946U priority Critical patent/JPH0745967Y2/en
Publication of JPH0262747U publication Critical patent/JPH0262747U/ja
Application granted granted Critical
Publication of JPH0745967Y2 publication Critical patent/JPH0745967Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案請求項1記載の光結合装置の一
実施例を示す斜視図、第2図は同じくその要部斜
視図、第3図は同じく発光素子、受光素子をリー
ドフレームに搭載した状態を示す正面図、第4図
aは同じく発光素子、受光素子を一次モールドし
た状態を示す平面図、第4図bは同じくその正面
図、第5図aは同じく透光樹脂体を二次モールド
した状態を示す平面図、第5図bは同じくその正
面図、第6図は本考案請求項2記載の光結合装置
の第一実施例を示す斜視図、第7図は同じく発光
素子、受光素子をリードフレームに搭載した状態
を示す正面図、第8図aは同じく発光素子、受光
素子を一次モールドした状態を示す平面図、第8
図bは同じくその正面図、第9図aは同じく透光
樹脂体を二次モールドした状態を示す平面図、第
9図bは同じくその正面図、第10図は本考案請
求項2記載の光結合装置の第二実施例を示す斜視
図、第11図は従来の光結合装置の断面図、第1
2図は同じくその組立工程を示す図である。 10:リードフレーム、10a,10b,10
c:リード部、11…発光素子、12:受光素子
、13:発光側透光樹脂体、14:受光側透光樹
脂体、15:外装、16:導出部、17:コネク
タ。
FIG. 1 is a perspective view showing an embodiment of the optical coupling device according to claim 1 of the present invention, FIG. 2 is a perspective view of the main parts thereof, and FIG. 3 is a perspective view showing a light-emitting element and a light-receiving element mounted on a lead frame. Fig. 4a is a plan view showing the state in which the light-emitting element and light-receiving element are primary molded, Fig. 4b is the same front view, and Fig. 5a is the same as the secondary molding of the light-transmitting resin body. FIG. 5B is a plan view showing the molded state, FIG. FIG. 8a is a front view showing a state in which a light receiving element is mounted on a lead frame, and FIG.
FIG. 9b is a front view of the same, FIG. 9a is a plan view showing a state in which the translucent resin body is secondarily molded, FIG. 9b is a front view of the same, and FIG. FIG. 11 is a perspective view showing a second embodiment of the optical coupling device; FIG. 11 is a sectional view of a conventional optical coupling device;
FIG. 2 is a diagram similarly showing the assembly process. 10: Lead frame, 10a, 10b, 10
c: Lead portion, 11...Light emitting element, 12: Light receiving element, 13: Light transmitting resin body on the light emitting side, 14: Transparent resin body on the light receiving side, 15: Exterior, 16: Leading out portion, 17: Connector.

Claims (1)

【実用新案登録請求の範囲】 1 リードフレームに搭載された発光素子および
受光素子と、前記発光素子と被覆形成して成る発
光側透光樹脂体と、前記受光素子を被覆形成して
成る受光側透光樹脂体と、前記発光側透光樹脂体
と受光側透光樹脂体とを一体的に被覆形成して成
る非透光性外装とを備え、該外装に、前記リード
フレームのリード部を導出する導出部が形成され
、該導出部と外部との入出力を行うコネクタとの
接続部が樹脂封止されたことを特徴とする光結合
装置。 2 リードフレームに搭載された発光素子および
受光素子と、前記発光素子と被覆形成して成る発
光側透光樹脂体と、前記受光素子を被覆形成して
成る受光側透光樹脂体と、前記発光側透光樹脂体
と受光側透光樹脂体とを一体的に被覆形成して成
る非透光性外装とを備え、前記リードフレームの
リード部が、外部との入出力を行うコネクタのピ
ンとして利用され、前記外装とコネクタとが一体
成形されたことを特徴とする光結合装置。
[Claims for Utility Model Registration] 1. A light-emitting element and a light-receiving element mounted on a lead frame, a light-emitting side light-transmitting resin body formed by covering the light-emitting element, and a light-receiving side formed by covering the light-receiving element. A light-transmitting resin body, and a non-light-transmitting exterior formed by integrally covering the light-emitting side transparent resin body and the light-receiving side transparent resin body, and the lead portion of the lead frame is attached to the exterior. 1. An optical coupling device characterized in that a lead-out portion is formed, and a connecting portion between the lead-out portion and a connector that performs input/output with the outside is sealed with a resin. 2. A light-emitting element and a light-receiving element mounted on a lead frame, a light-emitting-side transparent resin body formed by coating the light-emitting element, a light-receiving-side transparent resin body forming a coating over the light-receiving element, and the light-emitting element and the light-receiving element. A non-light-transmitting exterior is formed by integrally covering a side light-transmitting resin body and a light-receiving side light-transmitting resin body, and the lead portion of the lead frame serves as a pin of a connector for inputting and outputting external data. 1. An optical coupling device characterized in that the exterior casing and the connector are integrally molded.
JP1988140946U 1988-10-27 1988-10-27 Optical coupling device Expired - Fee Related JPH0745967Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988140946U JPH0745967Y2 (en) 1988-10-27 1988-10-27 Optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988140946U JPH0745967Y2 (en) 1988-10-27 1988-10-27 Optical coupling device

Publications (2)

Publication Number Publication Date
JPH0262747U true JPH0262747U (en) 1990-05-10
JPH0745967Y2 JPH0745967Y2 (en) 1995-10-18

Family

ID=31405573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988140946U Expired - Fee Related JPH0745967Y2 (en) 1988-10-27 1988-10-27 Optical coupling device

Country Status (1)

Country Link
JP (1) JPH0745967Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326113A (en) * 2000-05-15 2001-11-22 Oizumi Seisakusho:Kk Electronic component lead frame for mounting the same
JP2008172183A (en) * 2007-01-15 2008-07-24 Yiguang Electronic Ind Co Ltd Photo interrupter and its manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149177A (en) * 1985-12-23 1987-07-03 Sharp Corp Manufacture optocoupler with connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149177A (en) * 1985-12-23 1987-07-03 Sharp Corp Manufacture optocoupler with connector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326113A (en) * 2000-05-15 2001-11-22 Oizumi Seisakusho:Kk Electronic component lead frame for mounting the same
JP2008172183A (en) * 2007-01-15 2008-07-24 Yiguang Electronic Ind Co Ltd Photo interrupter and its manufacturing method

Also Published As

Publication number Publication date
JPH0745967Y2 (en) 1995-10-18

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