KR970003192Y1 - Collision preventing device - Google Patents
Collision preventing device Download PDFInfo
- Publication number
- KR970003192Y1 KR970003192Y1 KR2019900020754U KR900020754U KR970003192Y1 KR 970003192 Y1 KR970003192 Y1 KR 970003192Y1 KR 2019900020754 U KR2019900020754 U KR 2019900020754U KR 900020754 U KR900020754 U KR 900020754U KR 970003192 Y1 KR970003192 Y1 KR 970003192Y1
- Authority
- KR
- South Korea
- Prior art keywords
- sleeve
- package
- guide rail
- elastic piece
- preventing device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안장치의 사시도.1 is a perspective view of the present device.
제2도는 제1도의 종단면도.2 is a longitudinal cross-sectional view of FIG.
제3도는 종래의 슬리이브에 디바이스가 삽입된 상태도.3 is a state in which a device is inserted into a conventional sleeve.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 슬리이브 2 : 가이드레일1: sleeve 2: guide rail
3 : 탄성편 4 : 완충판3: elastic piece 4: buffer plate
5 : 디바이스5: device
본 고안은 디바이스의 충돌방지장치에 관한 것으로서, 특히 세라믹 팩케이지(Ceramic Package)로 된 디바이스를 슬리이브에 삽입시킬 때 팩케이지가 상호 부딪혀 깨지는 것을 방지할 수 있도록 한 것이다.The present invention relates to a device for preventing a collision of the device, and in particular, to prevent the packages from colliding with each other when inserted into the sleeve of a ceramic package (Ceramic Package).
일반적으로 생산라인에서 제조된 디바이스는 핸들러를 이용하여 성능검사를 하고 성능검사가 완료되면 디바이스가 양품과 불량품으로 자동분류되어 슬리이브에 삽입된다.In general, the device manufactured in the production line is subjected to the performance test using a handler. When the performance test is completed, the device is automatically classified as good or bad and inserted into the sleeve.
또한 디바이스의 팩케이지는 합성수지제와 세라믹제로 대별되는데, 이때 합성수지제는 취급이 용이하고 가격이 저렴한 장점이 있어 많이 사용되고 있는 반면 내부를 보호하기 위해 두께가 두꺼운 결점이 있고 세라믹제는 합성수지제와는 반대로 재질의 특성상 팩케이지가 충격으로 인해 자주깨져 취급이 불편하고 고가인반면 팩케이지의 두께가 얇아 정밀기기 등에 사용되는 장점이 있다.In addition, the package of the device is roughly divided into synthetic resin and ceramic, wherein the synthetic resin is easy to handle and inexpensive, and is widely used, while the defect is thick to protect the inside, and the ceramic is different from the synthetic resin. On the contrary, due to the characteristics of the material, the package is frequently broken due to impact, which makes the handling inconvenient and the expensive package has a thin thickness, which is used for precision instruments.
따라서 세라믹 팩케이지를 가진 디바이스는 충격으로 인해 자주깨져 핸들러를 사용하여 자동으로 성능검사를 하지 못하고 작업자가 수작업으로 성능검사를 하여 양품을 제3도와 같은 튜브형상으로 된 슬리이브(11)에 삽입하여 보관하도록 되어 있는데, 이때 디바이스(12)가 슬리이브(11)내에서 유동하여 팩케이지(12a)가 파손되는 것을 방지하기 위해 슬리이브(11)내에 스폰지(도시는 생략함)등 별도의 완충제를 삽입하도록 되어 있다.Therefore, the device with the ceramic package is frequently broken due to the impact, so that the performance test is not performed automatically using the handler, and the operator manually inspects the performance and inserts the product into the sleeve 11 having the tubular shape as shown in FIG. In this case, a separate buffer such as a sponge (not shown) is added to the sleeve 11 to prevent the device 12 from flowing in the sleeve 11 and breaking the package 12a. It is intended to be inserted.
그러나 이러한 종래의 슬리이브(11)는 단순히 튜브형상으로 되어 있어 핸들러를 이용하여 성능검사를 할 수 없게 되므로 생산성이 저하되었음은 물론 상호 충돌로인해 세라믹 팩케이지가 깨지는 것을 방지하기 위해 슬리이브(11)내에 별도의 스폰지등과 같은 완충제를 삽입시켜야하는 결점이 있었다.However, since the conventional sleeve 11 is simply in the form of a tube, the performance test cannot be performed using the handler, and thus the productivity is reduced, and the sleeve 11 is prevented from breaking due to mutual collision. There was a defect in that a buffer such as a sponge or the like was inserted.
본 고안은 종래의 이와 같은 결점을 감안하여 안출한 것으로서, 슬리이브의 상방에 탄성편을 설치하여 세라믹 팩케이지로된 디바이스를 핸들러를 이요, 성능검사를 실시할 수 있도록 하는데 그 목적이 있다.The present invention has been made in view of the above drawbacks of the prior art, and an object of the present invention is to provide an elastic piece above the sleeve so that a device made of a ceramic package can be subjected to a handler and perform a performance test.
상기 목적을 달성하기 위해, 본 고안은 슬리이브의 상방에 가이드레일을 형성함과 함께 가이드레일에 다수개의 탄성편이 형성된 완충판을 삽입하여 탄성편에 의해 디바이스의 이송이 제어되도록 한 디바이스의 충돌방지장치가 제공된다.In order to achieve the above object, the present invention forms a guide rail above the sleeve and inserts a buffer plate formed with a plurality of elastic pieces in the guide rail to prevent the device from being transferred by the elastic piece to prevent the collision of the device Is provided.
이하, 본 고안을 일실시예로 도시한 첨부된 도면 제1도 및 제2도를 참조하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 1 and 2 of the accompanying drawings.
첨부도면 제1도는 본 고안장치의 사시도이고 제2도는 제1도의 종단면도로서, 슬리이브(1)의 상방에 가이드레일(2)이 형성되어 이 가이드레일(2)에 다수개의 탄성편(3)을 가진 완충판(4)이 결합되어 있는데, 이때 완충판(4)에 형성된 탄셩편(3)의 간격은 세라믹 팩케이지(이하 팩케이지라함)(5a)의 길이방향 폭보다 크게 되어 있다.1 is a perspective view of a device of the present invention, and FIG. 2 is a longitudinal cross-sectional view of FIG. 1, wherein a guide rail 2 is formed above the sleeve 1, and a plurality of elastic pieces 3 are formed on the guide rail 2. Is coupled to the buffer plate 4, wherein the gap between the bullet strips 3 formed on the buffer plate 4 is greater than the longitudinal width of the ceramic package 5a (hereinafter referred to as the package cage) 5a.
따라서 탄성편(3)이 디바이스(5)의 진행방향과 동일한 방향, 즉 제2도의 화살표 방향을 향하도록 슬리이브(1)를 핸들러의 언로딩부에 적재시켜 놓으면 테스터에 의해 자동분류된 디바이스(5)가 이송트랙을 따라 이송되어 슬리이브(1)의 내부로 삽입되는데, 이때 슬리이브(1)의 하방 개방부는 마개(도시는 생략함)로 폐쇄되어 있고 상부 개방부의 마개(6)는 분리된 상태이다.Therefore, when the sleeve 1 is placed in the unloading part of the handler so that the elastic piece 3 faces the same direction as the traveling direction of the device 5, that is, the arrow direction of FIG. 2, the device automatically sorted by the tester ( 5) is transported along the transfer track and inserted into the sleeve 1, where the lower opening of the sleeve 1 is closed with a stopper (not shown) and the stopper 6 of the upper opening is separated. It is in a state.
디바이스(5)가 이송트랙을 따라 자중에 의해 슬리이브(1)내로 삽입되어 탄성편(3)과 접속됨에 따라 탄성편(3)이 상방으로 젖혀지게 되므로 디바이스(5)가 탄형편(3)을 통과하게 됨과 동시에 탄셩편(3)은 최초의 상태로 복원되어 제2도와 같이 팩케이지(5a)의 후면과 접속하게 된다.As the device 5 is inserted into the sleeve 1 by its own weight along the transfer track and is connected to the elastic piece 3, the device 5 is folded upward, so that the device 5 is burnt piece 3. At the same time, the bullet piece 3 is restored to its original state and connected to the rear surface of the package 5a as shown in FIG.
따라서 그후 이송되어온 디바이스가 탄성편(3)에 의해 제어되어 더 이상 이송을 하지 않게 되므로 팩케이지(5a)가 상호 충돌하는 것을 방지하게 된다.Therefore, since the device that has been transferred afterwards is controlled by the elastic piece 3 and no longer moves, the package 5a is prevented from colliding with each other.
또한 슬리이브(1)에 삽입된 디바이스(5)를 꺼내고자 할 경우에는 디바이스(5)의 삽입방향과 반대방향의 마개를 분리시키고 1개씩 차례로 꺼내 사용할 수 있게 되는 것이다.In addition, when the device 5 inserted into the sleeve 1 is to be taken out, the plug in the opposite direction to the insertion direction of the device 5 is removed and one by one can be used.
이상에서와 같이 본 고안장치는 슬리이브(1)의 상방에 탄성편(3)을 가진 완충판(4)을 삽입하는 간단한 구조에 의해 세라믹 팩케이지로된 디바이스(5)를 핸들러를 이용, 자동으로 성능검사를 할 수 있게 되므로 생산성을 향상시킬 수 있게 됨은 물론 보관시에 디바이스(5)가 슬리이브(1)내에서 유동하는 것을 방지하여 팩케이지가 상호 충돌하여 깨지는 것을 미연에 방지할 수 있게 되는 효과가 있다.As described above, the device of the present invention uses a handler for the device 5 made of a ceramic package automatically by a simple structure of inserting the buffer plate 4 having the elastic piece 3 above the sleeve 1. Since the performance test can be performed, the productivity can be improved, and the device 5 can be prevented from flowing in the sleeve 1 during storage, thereby preventing the package from colliding with each other and breaking. It works.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900020754U KR970003192Y1 (en) | 1990-12-24 | 1990-12-24 | Collision preventing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900020754U KR970003192Y1 (en) | 1990-12-24 | 1990-12-24 | Collision preventing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920013680U KR920013680U (en) | 1992-07-27 |
| KR970003192Y1 true KR970003192Y1 (en) | 1997-04-14 |
Family
ID=19307655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019900020754U KR970003192Y1 (en) | 1990-12-24 | 1990-12-24 | Collision preventing device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970003192Y1 (en) |
-
1990
- 1990-12-24 KR KR2019900020754U patent/KR970003192Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR920013680U (en) | 1992-07-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3417865A (en) | Flat package carrier block and assembly | |
| KR970003192Y1 (en) | Collision preventing device | |
| US4909386A (en) | Storage receptacles for drill bits | |
| US5163551A (en) | Integrated circuit device carrier | |
| EP0769986B1 (en) | Conveyor cassette for wafers | |
| GR851063B (en) | ||
| TR20319A (en) | A MEASURED METHOD AND THE METHOD FOR USING THE METHOD AND THE METHOD FOR HOLDING A USED EMUELSION PROCESSING WHICH HAS BEEN USED IN AN INDUSTRIAL PROCESS. | |
| EP0336061B1 (en) | Container | |
| US3208589A (en) | Apparatus for handling and transporting articles | |
| US3175153A (en) | Terminal contacting fixture utilizing torsional deflectable contacting elements | |
| EP0094463A3 (en) | Optical measuring apparatus | |
| KR200148124Y1 (en) | External inspection apparatus for semiconductor package | |
| JPH02180182A (en) | Magazine | |
| JPS60211961A (en) | Semiconductor device | |
| KR0110049Y1 (en) | Metal tray transferring apparatus of semiconductor device inspector | |
| JPS59161899A (en) | Conveying position deciding mechaism for electronic part | |
| US7946405B2 (en) | Guide path for electronic components | |
| JPH062799U (en) | Bend detection device for DIP type electronic parts | |
| TH7065EX (en) | Method and apparatus for conveying casings with one end closed from the point of operation and into the transport device. | |
| US9748126B2 (en) | Magazine for packaged integrated circuits | |
| JPS63229291A (en) | Load detecting method in substrate conveyor | |
| JP2545294Y2 (en) | Chute for device sliding of IC handler | |
| JP3616721B2 (en) | Mold frame transfer method and transfer positioning device | |
| KR950024293A (en) | Wafer Transfer Device | |
| KR970000971Y1 (en) | Transfer defence device of sleeve |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20050620 Year of fee payment: 9 |
|
| EXPY | Expiration of term |