KR950024293A - Wafer Transfer Device - Google Patents

Wafer Transfer Device Download PDF

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Publication number
KR950024293A
KR950024293A KR1019940001459A KR19940001459A KR950024293A KR 950024293 A KR950024293 A KR 950024293A KR 1019940001459 A KR1019940001459 A KR 1019940001459A KR 19940001459 A KR19940001459 A KR 19940001459A KR 950024293 A KR950024293 A KR 950024293A
Authority
KR
South Korea
Prior art keywords
wafer
gripper
unloading
transfer device
loading
Prior art date
Application number
KR1019940001459A
Other languages
Korean (ko)
Other versions
KR970008361B1 (en
Inventor
이병관
고균희
김철희
김성경
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR94001459A priority Critical patent/KR970008361B1/en
Publication of KR950024293A publication Critical patent/KR950024293A/en
Application granted granted Critical
Publication of KR970008361B1 publication Critical patent/KR970008361B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체 제조장치에 관한 것으로, 좌측에 웨이퍼가 적재된 로딩부(캐리어)와 우측에 언로딩부(보트)를 가지며, 상기 로딩부와 언로딩부 사이의 중심선을 따라 업/다운 가이드를 이용하여 상기 캐리어로 부터 옮겨진 웨이퍼를 메인 그리퍼의 전/후진 동작에 의해 보트로 옮겨주는 웨이퍼 이송장치에 있어서, 상기 메인 그리퍼에 선별용 그리퍼를 추가로 부착하여 각 그리퍼가 별도로 작동하도록 하므로써 웨이퍼의 선별 로딩/언로딩이 가능하게 되어(웨이퍼와 웨이퍼 사이의 간격을 넓힐수 있는 구조)P/R 굳힘에 소요되는 시간을 현저히 감소시킬수 있을 뿐 아니라 웨이퍼간의 긁힘 및 오염발생과 같은 불량 현상을 제거할 수 있는 고신뢰성의 웨이퍼 이송장치를 실현할 수 있게 된다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, comprising a loading portion (carrier) on which a wafer is loaded on a left side, and an unloading portion (boat) on a right side, and an up / down guide along a center line between the loading portion and the unloading portion. In the wafer transfer device for transferring the wafer transferred from the carrier to the boat by the forward / backward operation of the main gripper, by selecting the additional gripper attached to the main gripper to operate each gripper separately Loading / unloading is possible (a structure that can widen the gap between wafer and wafer), which not only significantly reduces the time required for P / R hardening but also eliminates defects such as scratches and contamination between wafers. It is possible to realize a highly reliable wafer transfer device.

Description

웨이퍼 이송장치Wafer Transfer Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2(A)도 및 제2(B)도는 본 발명에 의해 제작된 웨이퍼 이송장치의 개략도 및 웨이퍼 그리퍼부의 구조를 확대하여 도시한 상세도.2 (A) and 2 (B) are enlarged schematic views of the wafer transfer device manufactured by the present invention and enlarged structures of the wafer gripper portion.

Claims (2)

웨이퍼가 적재된 로딩부와 우측에 언로딩부를 가지며, 상기 로딩부와 언로딩부 사이의 중심선을 따라 업/다운 가이드를 이용하여 상기 캐리어로 부터 옮겨진 웨이퍼를 메인 그리퍼의 전/후진 동작에 의해 보트로 옮겨주는 웨이퍼 이송장치에 있어서, 상기 메인 그리퍼에 선별용 그리퍼가 추가로 부착되어 웨이퍼의 선별 로딩/언로딩이 가능하도록 한 것을 특징으로 하는 웨이퍼 이송장치.The wafer has a loading portion and an unloading portion on the right side, and the wafer transferred from the carrier using an up / down guide along the center line between the loading portion and the unloading portion is moved by the forward / reverse operation of the main gripper. A wafer transfer apparatus for transferring a wafer, characterized in that a sorting gripper is further attached to the main gripper to enable sorting loading / unloading of wafers. 제1항에 있어서, 상기 선별용 그리퍼는 상기 이송장치의 메인 그리퍼부 내측 중간 및 상기 이송장치에 형성된 그리퍼 삽입 홀 측에 각각 부착된 것을 특징으로 하는 웨이퍼 이송장치.The wafer transfer apparatus according to claim 1, wherein the sorting gripper is attached to an inner middle of the main gripper portion of the transfer apparatus and a gripper insertion hole formed in the transfer apparatus, respectively. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR94001459A 1994-01-27 1994-01-27 Semiconductor wafer processing apparatus KR970008361B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94001459A KR970008361B1 (en) 1994-01-27 1994-01-27 Semiconductor wafer processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94001459A KR970008361B1 (en) 1994-01-27 1994-01-27 Semiconductor wafer processing apparatus

Publications (2)

Publication Number Publication Date
KR950024293A true KR950024293A (en) 1995-08-21
KR970008361B1 KR970008361B1 (en) 1997-05-23

Family

ID=19376322

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94001459A KR970008361B1 (en) 1994-01-27 1994-01-27 Semiconductor wafer processing apparatus

Country Status (1)

Country Link
KR (1) KR970008361B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101423503B1 (en) * 2013-01-21 2014-07-28 주식회사 테라세미콘 Boat

Also Published As

Publication number Publication date
KR970008361B1 (en) 1997-05-23

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