KR950015631A - Dicing machine - Google Patents

Dicing machine Download PDF

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Publication number
KR950015631A
KR950015631A KR1019940031394A KR19940031394A KR950015631A KR 950015631 A KR950015631 A KR 950015631A KR 1019940031394 A KR1019940031394 A KR 1019940031394A KR 19940031394 A KR19940031394 A KR 19940031394A KR 950015631 A KR950015631 A KR 950015631A
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
carrier frame
attached
positioning
size
Prior art date
Application number
KR1019940031394A
Other languages
Korean (ko)
Inventor
다다시 아다치
Original Assignee
다카키 도시요시
세이코세이키 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다카키 도시요시, 세이코세이키 가부시기가이샤 filed Critical 다카키 도시요시
Publication of KR950015631A publication Critical patent/KR950015631A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

Abstract

본 발명의 다이싱 머신은 반도체 웨이퍼가 부착된 캐리어프레임을 적재하는 다수의 스토커와, 하나의 캐리어 프레임을 그 사이즈에 매칭하는 위치에 위치시키는 프리얼라이먼트와, 상기 프리얼라이먼트와 상기 스토커 중의 하나 사이에 반도체 웨이퍼를 이동시키는 핸들링 유닛과, 가공 테이블과, 반도체 웨이퍼를 운반하는 로더와, 상기 가공 테이블 상에서 반도체 웨이퍼를 절단하는 절단 블레이드로 구성된다. 상기 캐리어 프레임의 사이즈가 변경되면, 상기 가공테이블 상에서 작동 흡착 영역은 또 다른 흡착 영역으로 전환된다. 상기 로더는 캐리어 프레임을 흡입하는 진공 패드의 위치를 변경시킨다. 본 발명은 취급할 캐리어 프레임의 사이즈가 변경되어도 단시간내에 용이하게 그 상황에 대처할 수 있으므로, 생산성을 향상시킨다.The dicing machine of the present invention includes a plurality of stockers for loading a carrier frame to which a semiconductor wafer is attached, a pre-alignment for positioning one carrier frame at a position matching the size, between the pre-alignment and one of the stockers. A handling unit for moving the semiconductor wafer, a processing table, a loader for carrying the semiconductor wafer, and a cutting blade for cutting the semiconductor wafer on the processing table. When the size of the carrier frame is changed, the working suction zone on the processing table is switched to another suction zone. The loader changes the position of the vacuum pad that sucks the carrier frame. The present invention can easily cope with the situation within a short time even if the size of the carrier frame to be handled is changed, thereby improving productivity.

Description

다이싱 머신Dicing machine

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 일실시예에 따른 다이싱 머신의 주요부의 배열을 도시한 도면이다.1 is a diagram showing an arrangement of main parts of a dicing machine according to an embodiment of the present invention.

Claims (1)

캐리어 프레임들에 고정된 다수의 반도체 웨이퍼를 적재하는 두 개의 스토커와; 하나의 반도체 웨이퍼가 부착된 상기 캐리어 프레임중의 하나가 배치되며, 상기 캐리어 프레임의 사이즈에 매칭되는 위치에 상기 캐리어 프레임을 위치시키는 위치결정수단을 구비한 위치결정 테이블과; 가공되지 않은 반도체 웨이퍼가 부착된 캐리어프레임을 상기 스토커 중의 한 스토커로부터 가져오는 한편, 상기 위치결정 테이블로부터 가공 반도체 웨이퍼가 부착된 캐리어 프레임을 끌어내어 상기 스토커중의 하나에 안치시키는 반도체 웨이퍼 핸들링유닛과; 상기 반도체 웨이퍼가 부착된 하나의 캐리어 프레임을 흡착하는 다수의 흡착 영역을 가지는 가공테이블과; 반도체 웨이퍼가 부착된 캐리어 프레임을 고정시키는 고정수단과 상기 캐리어 프레임의 사이즈에 따라 상기 고정수단의 위치를 변경시키는 고정위치 변경수단을 가지는 반도체 웨이퍼 운반수단과; 상기 가공 테이블상에 고정된 반도체 웨이퍼를 절단하는 절단 수단을 구비하고, 상기 가공 테이블에는 캐리어 프레임의 사이즈에 따라서 작동 흡착 영역을 전환하는 흡착영역 전환수단을 추가로 설치하고, 상기 반도체 웨이퍼 운반수단은 가공되지 않은 반도체 웨이퍼가 부착된 캐리어 프레임을 상기 고정수단에 의해 고정시키고, 이를 상기 위치결정 테이블로부터 상기 가공 테이블로 운반하는 한편, 가공된 반도체 웨이퍼가 부착된 케리어 프레임을 상기 고정수단에 의해 고정시키고 이를 상기 가공테이블로부터 상기 위치결정 테이블로 운반하도록 작동하는 것을 특징으로 하는 다이싱 머신.Two stockers for loading a plurality of semiconductor wafers fixed to carrier frames; A positioning table on which one of the carrier frames to which one semiconductor wafer is attached is disposed, the positioning table having positioning means for positioning the carrier frame at a position matching the size of the carrier frame; A semiconductor wafer handling unit for taking a carrier frame with an unprocessed semiconductor wafer from one of the stockers, while drawing a carrier frame with the processed semiconductor wafer from the positioning table and placing it in one of the stockers; ; A processing table having a plurality of adsorption regions for adsorbing one carrier frame to which the semiconductor wafer is attached; A semiconductor wafer conveying means having fixing means for fixing a carrier frame to which the semiconductor wafer is attached and fixing position changing means for changing the position of the fixing means according to the size of the carrier frame; Cutting means for cutting the semiconductor wafer fixed on the processing table, and the processing table further includes adsorption area switching means for switching the operation adsorption area according to the size of the carrier frame. The carrier frame to which the unprocessed semiconductor wafer is attached is fixed by the fixing means, and transported from the positioning table to the processing table, while the carrier frame to which the processed semiconductor wafer is attached is fixed by the fixing means. A dicing machine, operable to convey it from said machining table to said positioning table. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940031394A 1993-11-26 1994-11-26 Dicing machine KR950015631A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-321201 1993-11-26
JP5321201A JPH07153721A (en) 1993-11-26 1993-11-26 Dicing device

Publications (1)

Publication Number Publication Date
KR950015631A true KR950015631A (en) 1995-06-17

Family

ID=18129926

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940031394A KR950015631A (en) 1993-11-26 1994-11-26 Dicing machine

Country Status (4)

Country Link
JP (1) JPH07153721A (en)
KR (1) KR950015631A (en)
GB (1) GB2284304B (en)
TW (1) TW255979B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270389A (en) * 1997-03-21 1998-10-09 Seiko Seiki Co Ltd Dicing device
NL2001790C2 (en) 2008-07-11 2010-01-12 Fico Bv Device and method for cutting electronic components.
JP7143020B2 (en) * 2018-06-12 2022-09-28 株式会社ディスコ processing equipment
CN111029287B (en) * 2019-11-29 2021-01-12 上海福赛特机器人有限公司 Automatic wafer loading and unloading system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2566042B2 (en) * 1990-05-21 1996-12-25 株式会社東芝 Optical semiconductor manufacturing equipment

Also Published As

Publication number Publication date
GB9423892D0 (en) 1995-01-11
GB2284304A (en) 1995-05-31
GB2284304B (en) 1997-11-19
JPH07153721A (en) 1995-06-16
TW255979B (en) 1995-09-01

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