KR960043011A - 플라즈마 가공중에 기판의 표면상으로 플라즈마를 집중시키도록 웨이퍼를 지지하기 위한 척조립체 및 방법 - Google Patents
플라즈마 가공중에 기판의 표면상으로 플라즈마를 집중시키도록 웨이퍼를 지지하기 위한 척조립체 및 방법 Download PDFInfo
- Publication number
- KR960043011A KR960043011A KR1019960015622A KR19960015622A KR960043011A KR 960043011 A KR960043011 A KR 960043011A KR 1019960015622 A KR1019960015622 A KR 1019960015622A KR 19960015622 A KR19960015622 A KR 19960015622A KR 960043011 A KR960043011 A KR 960043011A
- Authority
- KR
- South Korea
- Prior art keywords
- platform
- substrate
- upper portion
- chuck assembly
- support surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H10P72/7611—
-
- H10P50/242—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- H10P72/72—
-
- H10P72/7624—
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- ing And Chemical Polishing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US44116095A | 1995-05-11 | 1995-05-11 | |
| US08/441,160 | 1995-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960043011A true KR960043011A (ko) | 1996-12-21 |
Family
ID=23751780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960015622A Withdrawn KR960043011A (ko) | 1995-05-11 | 1996-05-11 | 플라즈마 가공중에 기판의 표면상으로 플라즈마를 집중시키도록 웨이퍼를 지지하기 위한 척조립체 및 방법 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0742579A2 (cg-RX-API-DMAC10.html) |
| JP (1) | JPH0922934A (cg-RX-API-DMAC10.html) |
| KR (1) | KR960043011A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100648401B1 (ko) * | 2004-10-13 | 2006-11-24 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
| KR100650925B1 (ko) * | 2004-10-13 | 2006-11-29 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3566740B2 (ja) * | 1992-09-30 | 2004-09-15 | アプライド マテリアルズ インコーポレイテッド | 全ウエハデポジション用装置 |
| US5803977A (en) * | 1992-09-30 | 1998-09-08 | Applied Materials, Inc. | Apparatus for full wafer deposition |
| US6159299A (en) * | 1999-02-09 | 2000-12-12 | Applied Materials, Inc. | Wafer pedestal with a purge ring |
| US20050133166A1 (en) * | 2003-12-19 | 2005-06-23 | Applied Materials, Inc. | Tuned potential pedestal for mask etch processing apparatus |
| DE102005032547B4 (de) | 2005-07-12 | 2010-01-07 | Texas Instruments Deutschland Gmbh | Wafer-Klemmanordnung zur Aufnahme eines Wafers während eines Abscheidungsverfahrens |
| JP4677474B2 (ja) * | 2008-07-28 | 2011-04-27 | キヤノンアネルバ株式会社 | プラズマ処理装置用基板ホルダーにおける特性補正リングの温度制御方法及びプラズマ処理装置用基板ホルダー |
| US10553404B2 (en) * | 2017-02-01 | 2020-02-04 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| CN110998788B (zh) * | 2017-08-01 | 2024-08-23 | 应用材料公司 | 金属氧化物后处理方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0343502A3 (en) * | 1988-05-23 | 1991-04-17 | Lam Research Corporation | Method and system for clamping semiconductor wafers |
| DE69401863T2 (de) * | 1993-07-15 | 1997-07-03 | Applied Materials Inc | Verbesserte Suszeptor Ausführung |
-
1996
- 1996-04-30 EP EP96303027A patent/EP0742579A2/en not_active Withdrawn
- 1996-05-11 KR KR1019960015622A patent/KR960043011A/ko not_active Withdrawn
- 1996-05-13 JP JP11808896A patent/JPH0922934A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100648401B1 (ko) * | 2004-10-13 | 2006-11-24 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
| KR100650925B1 (ko) * | 2004-10-13 | 2006-11-29 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0742579A2 (en) | 1996-11-13 |
| EP0742579A3 (cg-RX-API-DMAC10.html) | 1996-12-04 |
| JPH0922934A (ja) | 1997-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |