KR960039268A - Semiconductor Device Separation Method - Google Patents
Semiconductor Device Separation Method Download PDFInfo
- Publication number
- KR960039268A KR960039268A KR1019950007785A KR19950007785A KR960039268A KR 960039268 A KR960039268 A KR 960039268A KR 1019950007785 A KR1019950007785 A KR 1019950007785A KR 19950007785 A KR19950007785 A KR 19950007785A KR 960039268 A KR960039268 A KR 960039268A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide film
- film
- semiconductor device
- separating
- separation method
- Prior art date
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- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Abstract
본 발명의 반도체 소자의 분리 방법에 관한 것으로, 보다 구체적으로는 로코스에 의한 소자 분리시 패드 산화막의 구성을 달리하여 버드 빅을 감소시키는 반도체 소자 분리 방법에 관한 것으로서, 종래 로코스 방식에 의한 소자 분리 방법은 현재의 반도체 아이솔레이션 공정에 많이 이용되고는 있으나, 측면 확산 및 버드 빅 현상 등에 의해 소자 설계치수가 서브 미크론으로 줄어드는 고집적 메모리 소자에 있어서, 분리 영역의 폭을 감소 시키는데 제한이 따르고, 소자의 단락을 유발하는 문제가 야기되어 본 발명은 패드 산화막을 열산화막과 박막의 질화막과 완충 산화막으로 구성하여 측면 확산 및 버드빅 길이를 감소시키am로써 소자의 신뢰성을 확보할 수 있다.The present invention relates to a method for separating a semiconductor device, and more particularly, to a method for separating a semiconductor device in which a bud big is reduced by changing a structure of a pad oxide film when the device is separated by a LOCOS. Separation method is widely used in the current semiconductor isolation process, but in a highly integrated memory device whose device design dimension is reduced to sub-micron due to lateral diffusion and bud-big phenomenon, there is a limitation in reducing the width of the isolation region. Since the problem of causing a short circuit is caused, the present invention can secure the reliability of the device by reducing the side diffusion and the Budvik length by configuring the pad oxide film as the thermal oxide film, the nitride film of the thin film, and the buffer oxide film.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제4도 내지 제6도는 본 발명에 따른 소자 분리 방법의 각 제조공정을 보인 요부 단면도.4 to 6 are main cross-sectional views showing each manufacturing process of the device separation method according to the present invention.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950007785A KR960039268A (en) | 1995-04-04 | 1995-04-04 | Semiconductor Device Separation Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950007785A KR960039268A (en) | 1995-04-04 | 1995-04-04 | Semiconductor Device Separation Method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960039268A true KR960039268A (en) | 1996-11-21 |
Family
ID=66552883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950007785A KR960039268A (en) | 1995-04-04 | 1995-04-04 | Semiconductor Device Separation Method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960039268A (en) |
-
1995
- 1995-04-04 KR KR1019950007785A patent/KR960039268A/en not_active Application Discontinuation
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WITN | Withdrawal due to no request for examination |