KR960038711U - 상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치 - Google Patents

상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치

Info

Publication number
KR960038711U
KR960038711U KR2019950009890U KR19950009890U KR960038711U KR 960038711 U KR960038711 U KR 960038711U KR 2019950009890 U KR2019950009890 U KR 2019950009890U KR 19950009890 U KR19950009890 U KR 19950009890U KR 960038711 U KR960038711 U KR 960038711U
Authority
KR
South Korea
Prior art keywords
supply line
vapor deposition
atmospheric pressure
chemical vapor
discharge device
Prior art date
Application number
KR2019950009890U
Other languages
English (en)
Other versions
KR0134818Y1 (ko
Inventor
오주연
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950009890U priority Critical patent/KR0134818Y1/ko
Publication of KR960038711U publication Critical patent/KR960038711U/ko
Application granted granted Critical
Publication of KR0134818Y1 publication Critical patent/KR0134818Y1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
KR2019950009890U 1995-05-10 1995-05-10 상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치 KR0134818Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950009890U KR0134818Y1 (ko) 1995-05-10 1995-05-10 상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950009890U KR0134818Y1 (ko) 1995-05-10 1995-05-10 상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치

Publications (2)

Publication Number Publication Date
KR960038711U true KR960038711U (ko) 1996-12-18
KR0134818Y1 KR0134818Y1 (ko) 1999-03-20

Family

ID=19412974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950009890U KR0134818Y1 (ko) 1995-05-10 1995-05-10 상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치

Country Status (1)

Country Link
KR (1) KR0134818Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000040993A (ko) * 1998-12-21 2000-07-15 윤종용 잔류가스 처리장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003014193A (ja) * 2001-06-27 2003-01-15 Nec Corp シリンダキャビネット及びその配管内の残留ガスのパージ方法
US11527380B2 (en) 2020-04-01 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Ion implanter toxic gas delivery system
KR102602190B1 (ko) * 2023-01-02 2023-11-15 (주)엠지케이 독성 및 유해 잔류가스 처리 시스템을 이용한 처리 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000040993A (ko) * 1998-12-21 2000-07-15 윤종용 잔류가스 처리장치

Also Published As

Publication number Publication date
KR0134818Y1 (ko) 1999-03-20

Similar Documents

Publication Publication Date Title
EP0740103A3 (en) Liquefied gas supply system
SG76499A1 (en) Chemical vapor deposition system including dedicated cleaning gas injection
GB9705608D0 (en) Inductively coupled plasma chemical vapor deposition apparatus
DE69402624D1 (de) Vorrichtung zur Lieferung von Hochdruckgas
DE59610002D1 (de) Einrichtung zum Aufbewahren von tiefkaltem verflüssigtem Gas
KR960038711U (ko) 상압 화학증착 장비용 가스공급라인 내의 잔류가스 배출장치
EP0815903A4 (en) HIGH PRESSURE GAS JET PRODUCTION DEVICE
ATE205331T1 (de) Sauerstoffabgabevorrichtung für hochdruckentladungslampen
DK0741503T3 (da) Fremgangsmåde til drift af en højtryksgasudladningslampe og koblingsindretning til gennemførelse af fremgangsmåden
KR960035593U (ko) 반도체 화학기상증착장비용 가스공급라인의 잔류가스제거장치
FR2734341B1 (fr) Installation de fourniture de gaz sous basse pression
TW493477U (en) Device for cleaning exhaust gas discharge piping
KR950023949U (ko) 가스 노즐 일체형 수직 저압 화학 기상 증착장치
KR970025782U (ko) 화학기상증착용 가스 공급장치
DE59811708D1 (de) Vorrichtung zum Betreiben eines atmosphärischen Gasbrenners
KR960035591U (ko) 매엽식 플라즈마 저압 화학 증기 증착장치
ZA987442B (en) Transporting apparatus for gas cylinders
KR960003077U (ko) 저압 화학 기상 증착 장치용 웨이퍼 보트
KR960009602U (ko) 반도체의 화학증착 공정용 가스공급장치
KR950025872U (ko) 종형 플라즈마 저압 화학 증기 증착장치
KR960019060U (ko) 웨이퍼 가공장비의 퍼지가스 공급장치
KR960002365U (ko) 액화가스전용 펌프라인 장치
KR0111691Y1 (en) Portable light pressure gas container
KR960025294U (ko) 확산공정의 가스공급장치
ATA8897A (de) Starrer hochdruckgasbehälter

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090922

Year of fee payment: 12

EXPY Expiration of term