KR960032734U - Wafer cleaning device - Google Patents

Wafer cleaning device

Info

Publication number
KR960032734U
KR960032734U KR2019950003747U KR19950003747U KR960032734U KR 960032734 U KR960032734 U KR 960032734U KR 2019950003747 U KR2019950003747 U KR 2019950003747U KR 19950003747 U KR19950003747 U KR 19950003747U KR 960032734 U KR960032734 U KR 960032734U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer cleaning
wafer
cleaning
Prior art date
Application number
KR2019950003747U
Other languages
Korean (ko)
Other versions
KR0128226Y1 (en
Inventor
김형식
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950003747U priority Critical patent/KR0128226Y1/en
Publication of KR960032734U publication Critical patent/KR960032734U/en
Application granted granted Critical
Publication of KR0128226Y1 publication Critical patent/KR0128226Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019950003747U 1995-03-04 1995-03-04 Wafer-cleaning device KR0128226Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950003747U KR0128226Y1 (en) 1995-03-04 1995-03-04 Wafer-cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950003747U KR0128226Y1 (en) 1995-03-04 1995-03-04 Wafer-cleaning device

Publications (2)

Publication Number Publication Date
KR960032734U true KR960032734U (en) 1996-10-24
KR0128226Y1 KR0128226Y1 (en) 1998-12-01

Family

ID=19408789

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950003747U KR0128226Y1 (en) 1995-03-04 1995-03-04 Wafer-cleaning device

Country Status (1)

Country Link
KR (1) KR0128226Y1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100428622B1 (en) * 2001-05-14 2004-04-27 아남반도체 주식회사 Device for carrying wafer
KR100476062B1 (en) * 2002-06-28 2005-03-10 조재연 Apparatus for Processing Board

Also Published As

Publication number Publication date
KR0128226Y1 (en) 1998-12-01

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Legal Events

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050718

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee