KR960032734U - Wafer cleaning device - Google Patents
Wafer cleaning deviceInfo
- Publication number
- KR960032734U KR960032734U KR2019950003747U KR19950003747U KR960032734U KR 960032734 U KR960032734 U KR 960032734U KR 2019950003747 U KR2019950003747 U KR 2019950003747U KR 19950003747 U KR19950003747 U KR 19950003747U KR 960032734 U KR960032734 U KR 960032734U
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning device
- wafer cleaning
- wafer
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950003747U KR0128226Y1 (en) | 1995-03-04 | 1995-03-04 | Wafer-cleaning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950003747U KR0128226Y1 (en) | 1995-03-04 | 1995-03-04 | Wafer-cleaning device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960032734U true KR960032734U (en) | 1996-10-24 |
KR0128226Y1 KR0128226Y1 (en) | 1998-12-01 |
Family
ID=19408789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950003747U KR0128226Y1 (en) | 1995-03-04 | 1995-03-04 | Wafer-cleaning device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0128226Y1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100428622B1 (en) * | 2001-05-14 | 2004-04-27 | 아남반도체 주식회사 | Device for carrying wafer |
KR100476062B1 (en) * | 2002-06-28 | 2005-03-10 | 조재연 | Apparatus for Processing Board |
-
1995
- 1995-03-04 KR KR2019950003747U patent/KR0128226Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0128226Y1 (en) | 1998-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20050718 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |